This is an analytical opinion piece: the title states that Texas Instruments is boosted by a cyclical industrial recovery and growing data center monetization, with an upgrade to a Buy rating. No further body details, figures, dates or causes are provided in the source; it reflects the author's bullish analytical judgment rather than a confirmed factual event.
Texas Instruments (TXN) has been upgraded to a Zacks Rank #1 (Strong Buy), reflecting growing optimism about the company's earnings prospects. The article states this might drive the stock higher in the near term. The source does not state any underlying cause beyond this optimism, and provides no production, price, capacity or demand data.
XP Power has introduced the UCH750 series of 750W convection-cooled AC-DC power supplies for medical and industrial equipment requiring quiet operation, high efficiency, and reliable performance. The compact, chassis-mount, fanless design reduces acoustic noise and removes a wear-prone mechanical component, making the supplies suitable for noise-sensitive applications including medical imaging, patient monitoring, diagnostic instruments, treatment equipment, and home healthcare devices, as well as hospital equipment, factory automation, semiconductor manufacturing, test-and-measurement systems, and telecommunications infrastructure. The series achieves up to 96% conversion efficiency, and each unit measures 203.2 × 127.0 × 40.0 mm. It supports medical equipment requiring BF (Body Floating) applied-part classification, provides two Means of Patient Protection (2 × MOPP) of isolation between input and output, with a maximum patient leakage current of 100 µA under 264 VAC, 60 Hz conditions. The series reports to IEC 60601-1 and has UL and TÜV safety approvals, with Class I and Class II versions available; IEC 62368-1 safety approvals support IT and industrial integration, and the UCH750 meets EN 55032 Class B limits for conducted and radiated emissions. Five models provide nominal DC outputs of 12 V, 24 V, 36 V, 48 V, and 54 V from a universal 90–264 VAC input, delivering the full 750 W output from a 100 VAC input at ambient temperatures up to +50°C. Additional features include remote on/off control, a 5 VDC/2 A standby output, and built-in protection against overload, short circuit, overvoltage, and overtemperature. The series is available through Avnet Abacus, DigiKey, element14, Farnell, Mouser, RS, TME, authorized regional distributors, and directly from XP Power, with a three-year warranty. This is a product introduction announcement and does not constitute confirmed capacity or price changes.
UCH750 series 750W convection-cooled AC-DC power suppliesXP PowerPower Electronics News
ZDNet Korea reported on October 23, citing industry sources, that Samsung Electronics has ordered additional equipment to fill the remaining space at its first foundry fab in Taylor, Texas, a move that would lift the plant's 2nm capacity to 20,000 wafers per month in the second half of 2027. This is a planned capacity expansion, and the source does not state the cause for the expansion.
TSMC is scouting Texas for possible new US capacity, even as it builds out its advanced-process fabs in Arizona. Chairman C.C. Wei confirmed that a team has been sent to Texas to assess expansion opportunities. TSMC is also discussing cooperation with Elon Musk's Terafab, on the condition that it keeps operational control. Together, the moves could shift TSMC's US strategy from expanding existing sites to choosing new locations and exploring capacity partnerships. The source does not state the cause.
possible new US capacityTSMCDigiTimes AsiaCapacity Change
In an interview with DIGITIMES, Patrick Zeng, general manager of data center thermal management at Texas Instruments (TI), said that liquid cooling in AI data centers is moving toward more granular control architectures. As next-generation GPU computing power and rack power continue to rise, thermal management will shift from centralized control by a CDU to independent control for each server tray, a shift that will increase the use of sensors, drivers, MCUs and other components within each rack. This is an industry trend forecast, not an already implemented change.
liquid cooling componentssensorsdriversTexas InstrumentsDigiTimes Asia
Texas Instruments, in its third-quarter earnings call, reported strong revenue growth driven by strong demand across its industrial, automotive, and data center businesses. The company said it is facing a tight supply environment for its chips, and brought up its ramping of production and testing capacity, including through its new Malaysia back-end facility. The source provides no specific revenue figures, dates, or quantified details of the capacity expansion.
industrial chipsautomotive chipsdata center chipsTexas InstrumentsDigiTimes AsiaCapacity Change
Texas Instruments' third quarter suggested the analog chip upturn has moved beyond restocking into a broad-based recovery, and the company's multi-year build-out of 12-inch wafer capacity is now lifting margins rather than absorbing cash. Revenue rose 28% year on year and 11% sequentially to US$6.06 billion for the quarter ended September 30, 2026.
Taiwan's Minister of Economic Affairs Ming-Hsin Kung recently revealed in an interview with foreign media that Taiwan plans to collaborate with the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) to construct multiple US industrial parks, with Texas selected as the inaugural location to help Taiwanese AI and semiconductor suppliers build a local manufacturing footprint. This is a plan; the source does not state investment amounts, timelines, or named suppliers, and no cause is given.
Taiwan Electrical and Electronic Manufacturers' Association (TEEMA)DigiTimes AsiaCapacity Change
Related manufacturers
Taiwan Electrical and Electronic Manufacturers' Association (TEEMA)
On 21 October 2026 (Wednesday), Intel announced that it had started installing production tools at its Fab 62 in Arizona, with the fab on track for mass production by late 2028; however, the company has not disclosed when it intends to begin high-volume production, the planned wafer processing capacity, the capital expenditures required to complete the facility, and it has not officially assigned Intel 14A to Fab 62 (Fab 62 remains unassigned, while Fab 52 has been designated for Intel 18A). Per Intel's manufacturing roadmap disclosed earlier this year, Fab 62 will be able to make chips on 18A, 18A-P, and 14A nodes. Intel also confirmed that it has integrated High-NA EUV lithography into high-volume manufacturing (HVM), used to produce select tiles for Panther Lake CPUs at its D1X fab in Oregon; Intel has not explicitly confirmed whether High-NA EUV scanners are currently used to produce the same circuits as Low-NA EUV machines. In addition, construction workers recently installed the first major structural truss at the first fab of the Ohio One complex in New Albany, Ohio, but Intel did not provide an updated construction schedule, disclose when the first fab is expected to begin operations, or reveal which process technology it will use or its estimated capacity. The source does not state the cause (this is a capacity expansion progress update, not a price or disruption event).
Elon Musk said on October 20, during a live broadcast of SpaceX's Q3 2026 earnings call on X, that ASML and other critical semiconductor equipment suppliers have expedited shipments to the Terafab semiconductor manufacturing facility, a joint megaproject between Tesla and SpaceX, to support his aggressive timeline. He said the company is targeting volume chip production at Terafab's primary facility in Gibbons Creek, Texas, by the third or fourth quarter of 2028, emphasizing that the timeline is highly aspirational and carries 'big error bars'; SpaceX plans to manufacture its first experimental test chip at its research fabrication facility in Austin, Texas, around Q2 2027. Terafab will use traditional extreme ultraviolet (EUV) lithography systems utilizing Intel's 14A manufacturing node; Intel officially joined the Terafab venture in April 2026 to co-develop and refactor silicon fabrication technology. According to unofficial sources, Terafab's first EUV tool was reportedly slated for delivery in mid-2027, and it remains unclear if this is the expedited timeline Musk referred to. Other major suppliers include Applied Materials, Lam Research, and KLA Corporation, as well as Japan's Tokyo Electron; Tesla and SpaceX are also in talks with about 10 South Korean equipment makers, including Hanmi Semiconductor (advanced packaging equipment) and HPSP (high-pressure hydrogen annealing equipment). Musk also outlined AI compute goals: 2.5 to 3 GW of computing capacity active by the end of 2026, a total of 13 GW by the end of 2027, and plans to bring a 440,000-GPU Nvidia 'Vera Rubin' training cluster online by the end of Q2 2027. The event remains a plan/target and volume production has not been achieved.
EUV lithography systemslogic chipsmemoryASML, Tesla and 11 totalTom's HardwareCapacity Change
On October 21, 2026, Apple announced an expansion of its American Manufacturing Program: Qnity Electronics, based in Delaware (it joined the programme in March), will produce in the US the advanced films used in the variable aperture of the iPhone 18 Pro's main camera. Apple also signed Pennsylvania-based Perryman Company to supply titanium for the foldable iPhone Duo, with a commitment of up to USD 100 million over three years. According to Apple, nearly 100 components in its newest iPhones now come from American companies, and suppliers in more than a dozen states provide US-made components for the iPhone Duo and iPhone 18 Pro. Among them: Broadcom is expanding and modernising its Fort Collins, Colorado facility under a USD 1.5 billion investment announced in July, with a multi-year agreement covering more than 15 billion US-made chips; Corning's Harrodsburg, Kentucky site will produce all cover glass for the iPhone and Apple Watch sold worldwide by the end of 2026; Coherent supplies VCSEL lasers for Face ID from Sherman, Texas; TSMC's Arizona fab is set to produce more than 100 million chips for Apple in 2026, with construction of the north campus under way; Amkor broke ground on its first high-volume packaging and test facility in Peoria, Arizona in September 2025 and began construction of the building shell this year, with Apple as one of its first customers and the first two phases expected to employ more than 3,500 people. Apple also opened an Advanced Manufacturing Center in Houston in August, where it will start manufacturing the Mac mini this year in the same facility where it builds AI servers. The programme is part of Apple's USD 600 billion, four-year commitment to US manufacturing and innovation.
variable aperture camera filmstitaniumRF componentsApple, Qnity Electronics and 8 totalEvertiqCapacity Change
Hanwha Systems has begun full-scale mass production of multifunction displays (MFDs) for South Korea’s domestically developed KF-21 supersonic fighter jet. According to industry sources on Oct. 21, Hanwha Systems has completed development of the KF-21 MFD and started mass production. A contract covering the initial production batch of 40 aircraft has been signed, with the overall procurement program potentially expanding to 120 aircraft, including 80 in subsequent production batches. In November 2024, Hanwha Systems signed a contract worth approximately 61.6 billion won with Korea Aerospace Industries (KAI) to supply four types of avionics equipment for the KF-21. The contract covers MFDs, mission computers (MC), audio communication control systems (ACCS) and infrared search and track (IRST) systems. The contract runs through December 2026.
multifunction displays (MFDs)Hanwha Systems, Korea Aerospace Industries (KAI)The ElecCapacity Change
Japan's Fujifilm is expanding its extreme ultraviolet (EUV) photoresist production capacity to deepen cooperation with Samsung Electronics. Brian O'Donnellley, president of Fujifilm Electronic Materials USA, said the company is producing EUV photoresists in Pyeongtaek and, although it has not yet entered full-scale mass production, some EUV PR products have passed qualification tests at major customers. Fujifilm has expanded EUV PR production facilities in Shizuoka, Japan (its primary hub for advanced photoresist development and production) and Pyeongtaek, South Korea (near Samsung, selected for its most advanced products); EUV PR production and inspection equipment at both locations began operating in October 2025. The source does not state when full-scale mass production in Pyeongtaek will begin. The company cited artificial intelligence (AI) driving demand for materials used in processes at 2 nanometers and below, and expansion of advanced manufacturing processes increasing demand for ArF and EUV photoresists as the stated reason. Separately, Fujifilm is expanding its CMP slurry production facility near Samsung's Cheonan campus, planning to increase production capacity by approximately 30%, with additional facilities scheduled to begin operating in the first half of 2027; Fujifilm holds the largest global market share in CMP slurries for copper interconnects. The company also operates a facility in Carrollton, Texas near Samsung's Taylor plant and is considering various options to expand its manufacturing presence in South Korea, where it currently has two production facilities.
According to Reuters, Elon Musk said during a SpaceX conference call that his semiconductor manufacturing venture, Terafab, is targeting volume production in 3Q28, though he acknowledged that either 3Q or 4Q remains possible, describing the timeline as "very aggressive" given that advanced logic chip fabs in the U.S. typically take three years or more to build. Before volume production, Terafab aims to produce its first functional test chip using SRAM circuits around May or June 2027 at its Austin research facility. Equipment supply remains a key challenge, particularly from ASML and U.S. suppliers such as Applied Materials and KLA; asked whether SpaceX had ordered EUV lithography systems from ASML, Musk did not answer directly but thanked ASML and other suppliers for accelerating equipment deliveries. Per Reuters, ASML expects demand to outstrip supply through 2028 despite plans to expand EUV production capacity. According to The Elec, Tesla and SpaceX are in talks with South Korean semiconductor materials, components, and equipment suppliers to establish Terafab's supply chain, with several companies signing NDAs; HPSP and Hanmi Semiconductor remain the only two Korean equipment suppliers publicly linked to Terafab, and Terafab is reportedly seeking prices even lower than those offered by Chinese competitors. On manufacturing partners, TSMC Chairman and CEO C.C. Wei confirmed ongoing discussions but stressed that any fab involving TSMC must be operated by the company, contrasting with Musk's October 7 remarks that his companies would build and operate Terafab, potentially allowing TSMC to sublease space without an operational role; meanwhile, per Reuters citing Bloomberg, Intel CEO Lip-Bu Tan said the company would remain involved in Terafab.
SRAM test chipadvanced logic chipsEUV lithography systemsTerafab, Tesla and 10 totalTrendForceCapacity Change
The article explains that MEMS (micro-electromechanical systems) switches are gaining popularity in AI-driven optical networks, datacentres and other areas, and are considered a reliable replacement for semiconductor switches. Optical MEMS switches (optical circuit switches, OCS) route light signals directly via micromirror arrays, eliminating optical-electrical conversion and saving datacentre cost and power, and come in 2D and 3D types; RF MEMS switches come in ohmic (DC contact) and capacitive types and can replace PIN diodes and FETs. The article states MEMS switches are 90-95% smaller than semiconductor counterparts. Limitations noted: switching is microseconds slower than semiconductor switches, they require high actuation voltage, moving parts may wear, and they must be sealed against moisture; efficient MEMS switches remain in the research and development phase across enterprises and vendors, and commercialisation for AC/DC high-power handling systems is still awaited. The article contains no price, output or order data.
According to an analysis by Chinese semiconductor news outlet ijiwei, based on data from Japanese market research firm Techno Systems Research (TSR), OmniVision captured 13% of the global CMOS image sensor (CIS) market by revenue in 2025, surpassing Samsung Electronics' 12.8% share for the first time to become the world's second-largest CIS supplier; Sony retained the top position with a 54% share. OmniVision's CIS revenue totaled approximately $3 billion in 2025; per market research firm Yole, the global CIS market reached $25.3 billion in 2025, up 9% from 2024. ijiwei attributed the ranking change to a pullback by South Korean memory chipmakers: Samsung Electronics has shifted its focus toward high-bandwidth memory (HBM), while SK hynix has effectively exited the CIS market — SK hynix withdrew in March 2025, reassigning CIS personnel to AI memory operations including HBM. Onsemi's market share was below 3%. Samsung Electronics is reportedly seeking a rebound by securing Apple as a new customer, and is reportedly preparing to produce three-layer stacked CIS chips using hybrid bonding technology for a new iPhone series at its Austin, Texas, plant starting in 2026; Apple has previously sourced all CIS chips for its iPhones from Sony.
CMOS image sensors (CIS)OmniVision, Samsung Electronics and 5 totalThe Elec
Related manufacturers
OmniVision, Samsung Electronics, Sony, SK hynix, Onsemi
According to information gathered by THE ELEC on Oct. 20, Elon Musk's Tesla and SpaceX are holding talks with South Korean semiconductor materials, components and equipment suppliers to secure a supply chain for their Terafab chip manufacturing project. Several companies have already signed NDAs and advanced to discussions over specific products. On the morning of Oct. 13, the opening day of SEMICON West 2026 (held in San Francisco from Oct. 13 to 15), Terafab representatives visited booths operated by about 10 Korean companies, including ENF Technology, Dongjin Semichem, Asflow, BMT, GnG Intech, Unisem, MiCo and Hanmi Semiconductor; talks with many of these companies had already been underway for several months. ENF Technology, Asflow and GnG Intech made their first contacts during the event; BMT is in talks over valves and fluid-handling components; KoMiCo signed a three-party NDA with Tesla and SpaceX about a month ago to discuss cleaning services for an R&D pilot line in Texas; Unisem has signed an NDA to discuss environmental equipment including scrubbers; Dongjin Semichem has been in talks with Tesla for two to three months centered on its thinner production plant in Texas, with materials including phosphoric acid also under discussion; Hanmi Semiconductor is discussing the supply of thermocompression (TC) bonders; HPSP has agreed to supply one high-pressure hydrogen annealing (HPA) system for Terafab's R&D line; and ISC has advanced to exchanging samples and R&D design information. Overseas, Fujifilm holds regular meetings with Terafab's procurement team on potential supplies of CMP slurries, photoresists, etchants and cleaning chemicals, and Lam Research and Applied Materials are understood to have established dedicated Terafab teams. Tesla and SpaceX do not do business with Chinese suppliers, and industry officials said the companies are seeking prices even lower than those offered by Chinese suppliers, making Korea a good option. Terafab was jointly announced by Tesla, SpaceX and xAI in March, targeting a fab capable of processing 1 million wafers a month within 10 years, with an estimated initial investment of $16.8 billion and more than 3,000 jobs expected; SpaceX signed a tax abatement agreement with Texas earlier this month and began construction, and industry observers expect the initial 100,000-wafers-per-month facility to be completed before 2030. Most of these supply arrangements remain in the discussion stage and are not yet confirmed as final supply agreements.
semiconductor materialspiping componentsvalvesTesla, SpaceX and 16 totalThe ElecPartnership/M&A
According to commentary, Samsung Electronics' 2nm mass-production capability at its Taylor, Texas fab has become critical to its efforts to close the gap with TSMC, while Tesla's AI5 chip delivery schedule and Broadcom's potential 2nm orders hang in the balance. The company's ability to achieve competitive yields and stable output at the US facility will determine whether it can turn major customer orders into a broader foundry comeback. The source does not state the cause, and these statements are commentary rather than realized yield or order outcomes.
2nm processSamsung Electronics, TSMC and 4 totalDigiTimes AsiaCapacity Change
LS Electric signed a contract worth approximately 170 billion won to supply switchgear for AI data centers of a major US technology company; it also announced on Oct. 19 a long-term agreement worth $125.23 million to supply power distribution solutions for North American data centers. The contract covers 2027‑2028, with 2027 deliveries set and 2028 volume to be negotiated. The products are 38‑kilovolt high‑voltage switchgear systems. The source does not state the cause.