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Interview: TI sees liquid cooling shift to tray-level control in AI data centers
What happened
In an interview with DIGITIMES, Patrick Zeng, general manager of data center thermal management at Texas Instruments (TI), said that liquid cooling in AI data centers is moving toward more granular control architectures. As next-generation GPU computing power and rack power continue to rise, thermal management will shift from centralized control by a CDU to independent control for each server tray, a shift that will increase the use of sensors, drivers, MCUs and other components within each rack. This is an industry trend forecast, not an already implemented change.
Impact and signal
Medium impactImpact score: 30/100
Affected components and suppliers
liquid cooling componentssensorsdriversMCUsCDU
liquid coolingAI data centersthermal managementtray-level controlCDUinterview
Source and time
Source: DigiTimes Asia · 10/22/2026 · View original source
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