Toyota Motor Corporation is accelerating the commercialization of robots, creating potential opportunities for Ikka Holdings (IKKA-KY) to leverage its existing Japanese automotive supply-chain relationships and compete for robot component orders. IKKA, a long-standing supplier of Toyota-related automotive products, also plans to strengthen its metal-gear and robotic-arm assembly capabilities through an investment in Yijin Precision, extending its customer relationships into new applications. These remain plans and potential opportunities; no orders or completed investment are confirmed.
robot componentsmetal-gearrobotic-armToyota Motor Corporation, Ikka Holdings (IKKA-KY) and 3 totalDigiTimes AsiaPartnership/M&A
Related manufacturers
Toyota Motor Corporation, Ikka Holdings (IKKA-KY), Yijin Precision
Lam and imec announced a collaboration to accelerate manufacturing readiness for 3D integration technologies supporting advanced packaging and next-generation memory. The collaboration focuses on key process challenges that must be solved before heterogeneous integration can scale broadly, with joint research areas including thick dielectric deposition, asymmetric stress compensation, bevel deposition, and plasma dicing, alongside process validation for advanced packaging and future memory architectures; the work also extends into future 3D memory technologies such as new charge-trap materials, precision multilayer deposition, high-aspect-ratio channel etch, deep memory contacts, and low-resistivity interconnects. The source states these innovations are increasingly important as AI workloads drive demand for greater memory density and bandwidth. The parties are also collaborating on R&D to advance Lam's Aether dry resist platform using imec's high-NA EUV research environment, targeting enhanced resolution, sensitivity, depth of focus and stochastic defectivity, and exploring Aether-enabled patterning for advanced interconnects, including ruthenium direct metal etch at increasingly aggressive pitches. Joint research has already demonstrated single-exposure high-NA EUV patterning for sub-20 nm ruthenium direct metal etch interconnects; across the wafer at 20nm pitch, that work obtained 100% electrical yield for fork structures sensitive to bridges and >90% for meander structures sensitive to breaks. The collaboration remains at the R&D and manufacturing-readiness stage; the source gives no volume-production timeline or commercial terms.
3D integration technologiesadvanced packagingnext-generation memoryLam, imecElectronics WeeklyPartnership/M&A
According to Nikkei, citing industry sources, rising component costs are reportedly prompting leading PC brands including HP, ASUS, and Acer to move part of their production from Thailand and Vietnam back to China, while Dell is also reportedly considering a similar move (reported move, not confirmed as implemented). The stated cause is that surging AI demand drives shortages of memory and storage chips, raising PC bills of materials: per TrendForce, CPU, DRAM, and SSD costs accounted for approximately 68% of a mainstream notebook's BOM in the third quarter of 2026, up from 45% in the first quarter of 2025. The development partially reverses the 'China+1' diversification strategy pursued amid U.S.-China tensions and trade restrictions. TrendForce estimates the share of global notebook production outside China will decline from approximately 24% in 2025 to 21% in 2026, potentially falling below 20% in 2027, and expects global notebook shipments to decline by a low-single-digit percentage in 2027, potentially widening to a high-single-digit rate if elevated DRAM and CPU prices are passed on to consumers. Separately, Quanta reportedly suspended HP notebook production for about a week in September amid a dispute over rising component costs, resuming after further negotiations; servers accounted for over 80% of Quanta's revenue in the second quarter of 2026, and supply chain sources suggest it has gained greater leverage in notebook pricing negotiations. Chinese ODMs (Luxshare, Huaqin Technology, Longcheer Technology) are reportedly offering lower upfront costs, including waiving engineering and tooling fees, and benefit from access to domestically produced memory chips.
memory chipsstorage chipsDRAMHP, ASUS and 11 totalTrendForceCapacity Change
Researchers at IBM Research Europe published the paper "Superposed analog memory for vector storage in neural networks" and demonstrated an analog phase-change memory (PCM) architecture that stores multiple AI vectors in superposition, increasing effective storage density with a tunable accuracy tradeoff. Tests on prototype PCM hardware showed inference accuracy close to full-precision software. This is a research demonstration; the source does not state any production, pricing, or supply impact.
phase-change memory (PCM)IBM Research EuropeSemiconductor Engineering
Microchip has introduced its latest 6A POL converter power module, which integrates power MOSFETs, a PWM controller, inductors, and capacitors, delivering precision and protection without external passives. The source does not state pricing, availability timing, or a specific part number.
6A POL converterpower MOSFETsPWM controllerMicrochipElectronic Design
Murata Manufacturing has developed the NCU01 series, an 008004-inch negative temperature coefficient (NTC) thermistor measuring just 0.25 × 0.125 mm, described as the world's smallest. Compared with the company's previous smallest 01005-inch product, the new component reduces mounting area by approximately 60% while maintaining equivalent temperature-sensing performance, with both resistance and B-constant tolerances specified at ±1%. The ultra-compact thermistor targets densely integrated devices including smartphones, wearable electronics, IC packages, and SiP modules, allowing temperature sensors to be placed closer to heat-generating components. Murata plans to begin sample shipments in October 2026, followed by mass production in 2027; the initial lineup will include 100 kΩ and 10 kΩ resistance variants, with additional options introduced progressively.
On October 21, during GTC Berlin, Nvidia announced several multi-billion-dollar deals with six major supply chain partners — Ibiden, Unimicron, Samsung Electro-Mechanics, SPIL, Amkor and KYEC — across substrates, advanced packaging, semiconductor testing and optical engines, to expand production capacity and reserve capacity for its AI accelerators; expanded supply is to be available from 2027 through 2028, with commitments and production roadmaps stretching through 2028. For substrates, Nvidia plans to secure 2.5x dedicated substrate capacity over the next three years: it earlier signed a deal to provide a multibillion-dollar capacity reservation advance to support Ibiden's Ono Plant in Japan (targeting 3x the plant's current capacity); the Samsung Electro-Mechanics deal will support facility upgrades and new plants in Busan and Sejong, with Nvidia projected to account for a significant portion of its output by 2028; a capacity reservation agreement with Unimicron supports its substrate expansion in Taiwan, expected to start providing capacity by Q2 2027 and reach full capacity by mid-2028. For co-packaged optics, Nvidia signed with SPIL to expand optical engine production capacity 15x (1,400%) by mid-2027, with plans to double again by the end of 2028. With Amkor, Nvidia targets a more-than-300% increase in interposer wafer capacity by the end of 2028 through advanced packaging expansion in South Korea; Amkor confirmed the deal is worth $1.3 billion, bringing Nvidia's total investment across Amkor's Arizona and South Korea facilities to $3 billion. For testing, on October 13 Nvidia signed a deal to pay KYEC $1.1 billion to reserve testing capacity at KYEC's new $1.4 billion U.S. facility (high-volume production slated to begin in April 2027; Singapore high-volume production expected to begin February 2027), with testing capacity expected to double from calendar 2026 to 2027; KYEC currently handles nearly all of Nvidia's chip testing. Per its August 2026 disclosures, Nvidia had accumulated $279 billion in outstanding supply and manufacturing-capacity commitments by July 2026. All expansion figures are announced plans and targets, not yet realized.
substratesadvanced packaginginterposer wafersNvidia, Ibiden and 7 totalTom's HardwareCapacity Change
JIMTOF 2026, Japan's International Machine Tool Fair and one of the world's three major machine tool shows, opened this week with 94 Taiwan companies exhibiting. The exhibitors are showcasing precision machining, key components and smart automation while deepening manufacturing supply-chain cooperation between Taiwan and Japan.
Applied Materials plans to increase its stake in Dutch company BE Semiconductor Industries (BESI) from 9% to approximately 20%, deepening a partnership focused on advanced packaging technologies for AI chips. The transaction is structured through an accelerated share purchase agreement and is subject to U.S. antitrust review; the company said it does not intend to increase its stake beyond approximately 20% or seek representation on BESI's board. Applied Materials became BESI's largest shareholder after acquiring a 9% stake in April 2025; the two companies have collaborated on hybrid bonding technology since 2020 and jointly developed Kinex, an integrated die-to-wafer hybrid bonding system. According to ijiwei, BESI holds approximately 70% of the global hybrid bonding equipment market. According to Reuters on October 22, BESI's third-quarter orders rose 96% year over year to €342.6 million, and hybrid bonding equipment orders in the first nine months of 2026 more than doubled compared with the full-year 2025 level; BESI's latest earnings release shows its hybrid bonding customer base has expanded to 23, with cumulative equipment demand exceeding 215 systems. According to ijiwei, Chinese equipment maker Piotech generated RMB 136 million in hybrid bonding equipment revenue in 2025, up 41.92% year over year, and secured repeat orders for its wafer-to-wafer hybrid bonding systems.
hybrid bonding equipmentKinex die-to-wafer hybrid bonding systemDatacon 8800 CHAMEO ultra plus AC systemApplied Materials, BE Semiconductor Industries (BESI) and 3 totalTrendForcePartnership/M&A
Related manufacturers
Applied Materials, BE Semiconductor Industries (BESI), Piotech
According to industry sources on Oct. 26, South Korean semiconductor piping component maker Asflow recently received an order from Company A, a leading Dutch ALD equipment manufacturer, to supply Hastelloy welded piping assemblies, known as weldments, for ALD equipment. Company A selected Asflow as its supplier as it introduces Hastelloy components into its equipment for the first time, and this marks the first transaction between the two companies. Asflow previously passed a quality audit by global equipment maker Company L and secured a weldment supply agreement, and is receiving approvals in stages for approximately 1,000 weldment items to be supplied to Company L; the latest order increases its number of customers for internal equipment components to two. Securities analysts forecast that the company's revenue next year could roughly double from this year's level. Asflow is also discussing the adoption of Hastelloy components with other companies including a global logic semiconductor manufacturer identified as Company I, and since 2024 has participated in a government-backed project, working with steelmakers including SeAH Changwon Special Steel, to establish a South Korean domestic supply chain for Hastelloy raw materials currently procured from Japan, Europe and other markets.
Hastelloy welded piping assemblies (weldments) for ALD equipmentHastelloy tubesfittingsAsflow, Company A and 4 totalThe ElecPartnership/M&A
Related manufacturers
Asflow, Company A, Company L, SeAH Changwon Special Steel
Fine M-Tec, a component supplier for Apple's first foldable smartphone, the iPhone Duo, posted an official statement on its website on Oct. 26 denying that the recently reported screen damage was caused by defects in components it supplied, and said it was considering legal action against claims attributing the defects to its components without objective verification. The statement followed the iPhone Duo's release on Oct. 23, after which consumers in the United States, Australia and China reported cracks along the central crease of the display or bright horizontal lines appearing during folding and unfolding. One Australian buyer claimed the screen broke after a noise came from near the hinge, approximately six hours after first use and following fewer than 20 folding cycles; Apple reportedly replaced the device. Fine M-Tec manufactures internal hinges, also known as metal plates, that support foldable OLED panels by distributing stress from repeated folding, and has supplied related components to Samsung Display. The precise cause of the defects and the extent of the problem have yet to be confirmed.
foldable OLED panel internal hinges (metal plates)Fine M-Tec, Apple and 3 totalThe Elec
This is a background technical explainer about TSMC's CoWoS-S (Chip-on-Wafer-on-Substrate with a silicon interposer) 2.5D integration platform, which places large logic dies or chiplets beside multiple high-bandwidth-memory stacks and connects them through dense wiring in a silicon interposer, producing multi-terabyte-per-second memory interfaces. TSMC reports the platform has been in production since 2012 and supports silicon interposers reaching approximately 3.3 times reticle size; its fifth-generation implementation demonstrated an interposer of about 2,500 square millimeters capable of accommodating multiple logic chips and eight HBM stacks. The article also describes power-integrity features (embedded deep-trench capacitors), thermal and mechanical engineering challenges, and notes that packaging capacity determines how quickly cloud providers can deploy new computing clusters. The source does not state the cause of any event, as this is background technology analysis with no price movement, capacity change, or policy event reported.
TSMC CoWoS-S (Chip-on-Wafer-on-Substrate with silicon interposer)2.5D integration platformsilicon interposerTSMCSemiWiki
Antaira Technologies today introduced the five-model LanoSync™ Q-Series Industrial Network Switches. The series is built around IEEE 1588 Precision Time Protocol version 2 (PTPv2), supporting both Boundary Clock and Transparent Clock modes to deliver sub-microsecond synchronization accuracy, and includes ITU-T G.8032 Ethernet Ring Protection Switching (ERPS), which automatically redirects traffic along an alternate path in under 50 milliseconds if a fiber is cut or a node fails. Select models provide IEEE 802.3bt PoE++ with up to 90 W per port. All five models feature ITU-T K.44 surge protection and operate across an extended temperature range of -40 to 85 °C (-40 to 185 °F). The five models are: QMX-0804G-2Q2S-T (4 Gigabit Ethernet ports and 4 SFP slots, 20–60 VDC input); QMX-1204G-2Q2S-T (8 Gigabit Ethernet ports, 4 SFP slots, plus 2 digital inputs, 4 relay outputs, 1-Wire and 3 RS-232/485 serial ports, 20–60 VDC input); QMP-0804G-2Q2S-bt-T (4 Gigabit PoE++ ports, 240 W PoE budget, 4 SFP slots); QMP-1204G-2Q2S-bt-T (8 Gigabit PoE++ ports, 240 W PoE budget, 4 SFP slots); and QMP-2820G-4X16S-bt-T (8 Gigabit PoE++ ports, 500 W PoE budget, 16 × 100M/1G SFP slots, 4 × 1G/2.5G/10G SFP+ uplinks with static routing, 36–60 VDC input). This is a product-launch item with no price change, capacity change or supply/demand condition stated; the source does not state the cause (no causal event applies).
Power Electronics News published a roundup of this week's articles covering practical EMI guidance for power converters, FinFET-based power devices, and simulation-driven thermal modeling for SiC and GaN converters. The roundup also lists news items: Navitas launched a 2300-V SiC power module for grid infrastructure, with the 2300 V SiC technology targeting higher efficiency and power density in AI data centers, energy storage, and grid applications; Allegro introduced 48V power management and precision position sensors for robotics, helping humanoid robots with integration, motion control, and functional safety; EPC GaN FETs enable a 4 kW high-efficiency converter, where the dual-phase EVAL-LT7930-AZ combines ADI's LT7930 controller with EPC2361 transistors for high-current power conversion; STMicroelectronics launched a QML-V qualified LVDS receiver, the RHFLVDS42, supporting data rates up to 600Mbps, 300krad(Si) radiation resistance, and 8kV ESD immunity for aerospace systems; onsemi and Sungrow target 99.3% efficiency in utility-scale BESS, where the PowerTitan 3.0 platform supports conversion units up to 450 kW and could save over 475 MWh annually in a 100 MW installation. The articles section also covers a GaN-based dual-side cooled package for 650-V GaN in 800-V AI data centers. This item is an informational roundup with no price or supply-demand data.
SiCGaNFinFETNavitas, Allegro and 9 totalPower Electronics News
Victor Lopez, Co-Founder and CTO of RaiderChip with over 20 years of experience in FPGA and ASIC design, gives an interview about the company. RaiderChip is a European fabless semiconductor company founded in 2024, developing a proprietary NPU architecture to bring Generative AI directly to edge devices; its business model combines chip development with licensing the NPU architecture as IP for integration into third-party SoCs. The technology targets Transformer inference, with strongest application areas in robotics, automotive, and industrial automation. The company is currently moving towards the tape-out of Kairós, its first-generation chip (a plan in progress, not yet completed); in the meantime it offers demonstrations on an FPGA-based NPU prototype that supports more than 50 models and is available for evaluation under a non-disclosure agreement. The company also presented a robotics demonstration: robots and their physics are simulated in MuJoCo, Google DeepMind's physics simulator, while the intelligence runs on real hardware, the Kairós FPGA-based NPU prototype; a speech recognition model transcribes instructions, a four-billion-parameter reasoning model interprets objectives and plans movements as a timed sequence of velocities, and all ten models, including speech recognition, reasoning, and robotic control policies, execute concurrently on a single NPU, locally and in real time, without any cloud connection. Lopez also cites customer concerns about technological sovereignty and strategic dependence on a small number of international suppliers of advanced technologies, noting recent geopolitical tensions and export restrictions on advanced hardware.
PNT said on Oct. 23 that it will participate in C-TOUCH & DISPLAY SHENZHEN 2026 and FILM & TAPE EXPO 2026, scheduled for Oct. 27–29 in Shenzhen, China, to showcase its high-speed, high-precision roll-to-roll equipment and web handling technology targeting China's display and functional film markets. PNT plans to identify local customers, expand opportunities for equipment orders, assess equipment demand among local companies, and pursue discussions on new equipment supply contracts. The article notes that Chinese manufacturers are expanding production capacity for related materials, particularly those used in high-value-added products such as foldable and automotive displays. This is a participation plan and prospective contract discussions; no confirmed supply contract has been reported.
roll-to-roll equipmentoptical films for displaysindustrial functional materialsPNTThe Elec
Navitas Semiconductor has introduced the G4H08MT23GB4 family of 2300 V silicon carbide (SiC) full-bridge power modules designed for energy conversion and grid infrastructure, based on the industry-standard SiCPAK™ form factor, featuring an on-state resistance (RDS(on)) of 8 mΩ and built on Navitas' fourth-generation GeneSiC™ Trench-Assisted Planar™ (TAP) technology. The family extends Navitas' ultra-high-voltage SiC portfolio, which includes 2300 V and 3300 V devices, with target applications including solid-state transformers (SSTs), grid-scale battery energy storage systems, solar inverters, megawatt EV charging infrastructure, and high-voltage DC-DC conversion. The modules incorporate an aluminum nitride (AlN) active-metal-brazed (AMB) substrate for heat spreading and electrical isolation exceeding 5 kV; epoxy-resin potting reduces internal mechanical stress and helps limit moisture and contaminant ingress, and per Navitas the material offers ten times the thermal conductivity of silicone gel. High-current press-fit pins provide twice the current-carrying capability per pin versus standard press-fit connections, and an optional pre-applied thermal interface material (TIM) is available. The family is scheduled for qualification under Navitas' AEC-Plus reliability benchmark, which extends testing beyond AEC-Q101 and JEDEC requirements; samples of the G4H08MT23GB4(HC) family, including high-current variants and pre-applied TIM options, are available immediately, and engineers can request the EVB-UHVSIC-GB-E-DPT-1 double-pulse test system. The source does not state pricing or a volume-production timeline.
2300 V silicon carbide (SiC) full-bridge power modulesNavitas SemiconductorPower Electronics News
Allegro MicroSystems announced an expansion of its robotics portfolio with 48V power management and precision position-sensing solutions designed to address key hardware challenges in humanoid robots, targeting system size, weight, thermal management, torque density, and functional safety, alongside a collaboration with Sarcomere Dynamics supporting more natural, human-like dexterity. The new A81481 power management IC (PMIC) integrates power regulation and safety monitoring in a single 6 × 6 mm package, incorporating two buck regulators, five low-dropout (LDO) outputs, and safety diagnostics including a triple-watchdog architecture; its ASIL-D-capable safety features support safety-critical designs, and according to Allegro, the A81481 can cut overall system footprint and bill-of-materials costs by approximately 50%. The A17802 and A17803 inductive position sensors provide rotor-position feedback for high-torque actuators in robotic joints such as shoulders, hips, and knees, with the A17803 also available in an ultra-compact QFN package. For robotic hands and fingers, Allegro offers the CT310 XtremeSense TMR angle sensor (sub-degree angular accuracy in a 2 × 2 mm DFN package) and the A33023 Hall-effect angle sensor. Allegro's Robotics Building Blocks program offers samples and evaluation support for the A81481, A17802, A17803, CT310, and A33023, and the company will showcase its robotics power and sensing solutions at electronica 2026, Hall C6, Booth 129. The source does not state the cause (this is a product introduction with no price or supply-demand change information).
48V power management IC (PMIC)inductive position sensorsTMR angle sensorAllegro MicroSystemsPower Electronics News
On Oct. 21 local time, Nvidia announced that, to meet growing demand for AI infrastructure, it is working with Samsung Electro-Mechanics, Ibiden, Amkor Technology, King Yuan Electronics Co. (KYEC), Siliconware Precision Industries (SPIL) and Unimicron, making advance payments to secure semiconductor packaging substrate, testing and co-packaged optics (CPO) capacity. CEO Jensen Huang said demand is enormous but capacity is constrained. Substrates: Nvidia is expanding agreements with Ibiden, Samsung Electro-Mechanics and Unimicron to increase semiconductor package substrate capacity 2.5-fold over the next three years; Nvidia has reserved several billion dollars worth of capacity at Ibiden with advance payments, aiming to triple capacity at its Ono plant in Japan, with the additional capacity expected to begin full-scale operations in the first quarter of 2028; Samsung Electro-Mechanics will begin supplying next-generation package substrates from its South Korean facilities in 2026, with Nvidia supporting equipment upgrades at its Sejong and Busan plants plus construction of a new factory; Nvidia signed a capacity reservation agreement with Unimicron to expand its KF plant in Taiwan, with capacity beginning to increase in the second quarter of 2027 and expected to reach full utilization by mid-2028. Advanced packaging: Nvidia is working with Amkor to expand capacity in Gwangju, South Korea, planning to increase interposer wafer capacity by more than 300% by the end of 2028. Testing: Nvidia committed $1.1 billion in advance payments to reserve capacity at KYEC; expansion in the United States, Taiwan and Singapore will double total testing capacity in 2027 from the 2026 level, with a new U.S. facility scheduled for mass production in April 2027 and Singapore lines in February 2027. CPO: Nvidia is expanding optical engine capacity for CPO with SPIL in Taiwan, rising 15-fold by mid-2027 and doubling again by the end of 2028. All expansions are planned/expected arrangements, not yet achieved results.
Precision gearmaker Khgears International is expanding into humanoid robot joint components and expects its newly developed differential reducer to enter mass production in 2027. The company said shipments for new projects should remain strong through the fourth quarter of 2026.