The board of directors of Texas Instruments Incorporated (Nasdaq: TXN) declared a quarterly cash dividend of $1.52 per share of common stock on Oct. 15, 2026, payable on Nov. 10, 2026, to stockholders of record on Oct. 30, 2026. This is a company dividend distribution and does not involve changes to capacity, pricing, or supply and demand.
ASML published its Q3 2026 earnings on October 14, 2026, saying the unprecedented spending and investment brought about by the AI boom is not slowing down, with customers already lining up to place orders for its advanced chipmaking tools for 2029 and 2030 output; CEO Christophe Fouquet said the company would struggle to meet demand despite plans announced in July to raise capacity by 30% in 2027 and another 30% in 2028. The company also confirmed it will raise prices starting in 2027, with the full effect showing in 2028. The Q3 2026 report detailed a net profit of €4.96 billion on net sales of €11.7 billion; the company projects Q4 sales of €14.2 billion to €15.2 billion ($15.9 billion to $17 billion) and boosted its full-year sales projections from at least €43 billion to €44-45 billion. ASML's shares rose 2% on Wednesday, up almost 70% so far this year, with its €586 billion market valuation making it Europe's largest firm by market cap. Additionally, Terafab will reportedly receive its first EUV chipmaking tool from ASML in mid-2027; CFO Roger Dassen said it is "still kicking the tires on the exact size of that (Terafab) opportunity."
Inission is acquiring Bavaria Digital Technik (BDT) for EUR 5.3 million, marking its first operation in Germany. The agreement was signed on 15 October 2026, with closing scheduled for 2 November 2026. BDT, founded in 1969, employs around 110 people and generated approximately EUR 20 million revenue and EUR 1.25 million EBITDA in 2025. All employees will remain with the business, which will keep its local presence and gain access to Inission’s network and resources.
Inission, Bavaria Digital TechnikEvertiqPartnership/M&A
Summary: TSMC CEO C.C. Wei confirmed on Thursday, October 15, 2026 that the company is considering expanding its American production capacity beyond Arizona, with Texas as one option; teams have been sent to Texas for evaluation, and TSMC has discussed with a customer attempting to build a fab called Terafab (Elon Musk). If TSMC joins the project, it would insist on operating the fab. Discussions are ongoing and no agreement has been reached yet.
Elon Musk posted on X criticizing memory makers for what he calls 'extortionate' pricing amid an unprecedented shortage of both conventional DRAM and high-bandwidth memory (HBM), while praising Micron as 'reasonable' regarding future memory prices and saying it is 'making the smart move for long-term customer loyalty.' The article notes that Musk did not identify the companies he criticized and provided no specific details of the pricing or the terms offered by different suppliers (which tend to be confidential), so it is impossible to determine whether Samsung Electronics and SK hynix charge substantially more than Micron for comparable products; his remarks are nonetheless seen as directed at the South Korean memory manufacturers. The article adds that Micron's own profitability is exceptionally high: in its fourth quarter of fiscal 2026, Micron reported revenue of $54.23 billion and a GAAP gross margin of 81%, up from 40% a year earlier; its cloud memory unit earned $16.283 billion with an 83% non-GAAP gross margin; its core data center storage business sold $18.002 billion worth of goods with a 90% gross margin; automotive and embedded unit sales totaled $6.824 billion with gross margins reaching 84%; and mobile and client revenue was $13.114 billion with a 90% non-GAAP gross margin. Micron has signed 26 strategic customer agreements covering more than 35% of its expected revenue through 2030, with $32 billion in customer financial commitments, most consisting of cash deposits, and the company acknowledges its new agreements reflect higher prevailing memory prices and is by no means selling memory at a discount. Separately, Samsung has reportedly secured long-term contracts covering 75%–80% of its planned memory output in 2027, and SK hynix is reportedly pursuing similar arrangements. Market insiders and analysts expect memory supply shortages to persist through at least 2028. The article also states that manufacturers have raised memory prices severalfold this time without comparable increases in production capacity, and supply still lags behind demand.
DRAMHBMNANDMicron, Samsung Electronics and 3 totalTom's Hardware
Microchip Technology has introduced the POL-05-20S-T, a radiation-tolerant gallium nitride (GaN) point-of-load (POL) converter designed for spaceborne processing systems. The device delivers up to 20 A of continuous output current in a compact surface-mount package measuring 1.51 × 1.51 × 0.45 inches and weighing 25 g, with an input voltage range of 4.75 V to 13.2 V, an adjustable output from 0.7 V to 5 V, and an operating temperature range of −55°C to +100°C at full load. For radiation tolerance, Microchip specifies electrical parameters before and after exposure to total ionizing dose (TID) levels of up to 50 krad, and the converter is characterized for single-event effects (SEE) at linear energy transfer (LET) levels up to 43 MeV·cm²/mg. Targeting high-current, fast-transient loads such as the core voltage rails of FPGAs, microcontrollers, and ASICs, the converter is available now in production quantities.
radiation-tolerant GaN point-of-load (POL) converterMicrochip TechnologyPower Electronics News
Navitas Semiconductor has announced a 24 kW, 800 VDC-to-12 VDC power delivery board (PDB) developed with NVIDIA for next-generation AI data center infrastructure. Based on Navitas' GaNFast technology, the board supports the NVIDIA MGX ecosystem and simplifies power delivery to high-performance computing processors (xPUs). The solution is scheduled to be showcased in NVIDIA's AI Factory MGX Wall partner display area at the 2026 OCP Global Summit. The new board follows the previously announced 20 kW, 800 V-to-6 V power delivery board developed with NVIDIA, and both platforms support the transition toward high-voltage DC distribution and the adoption of GaN and SiC technologies in high-power AI infrastructure. The board is designed to deliver up to 24 kW with a target full-load efficiency of 97% and power density exceeding 2,000 W/in³, follows NVIDIA's 400 mm × 60 mm form factor, and can be integrated directly onto the compute motherboard close to the xPUs. It uses a single-stage conversion architecture converting 800 VDC directly to 12 VDC, eliminating the conventional 50 V-to-12 V intermediate bus converter (IBC) stage to reduce conversion steps, power losses and component count; the 12 V output feeds the voltage regulator module (VRM). The primary-side power stage uses 16 NV6034 GaNFast FETs, each rated at 650 V with 18 mΩ on-resistance, in a stacked half-bridge topology using Navitas' dual-cooled 8 mm × 8 mm DFN package.
Russian chipmakers demonstrated homegrown RISC-V and Arm chips with retro games at the Microelectronics 26 (ME26) forum in Sochi on October 11, 2026, as reported in an article published October 15, 2026. The demo featured a Baikal Electronics BE-U1000 microcontroller-based NES clone, an Elvis Hypercom-U SoC, and MCST's Elbrus-based PCs. The source does not state the cause. The event status is observed demonstration.
SK hynix disclosed its research posted in a newsroom on Oct. 14, developing analog computing-in-memory (A-CiM) using ferroelectric three-dimensional NAND (3D FeNAND) to perform AI computations directly within NAND flash memory. The technology distinguishes current states by adjusting the number of programming pulses at the cell level, introduces air gaps between wordlines to reduce wordline resistance at the non-cell circuit level, and applies in-page pipelining (IPP) at the page level to optimize data placement and computation sequences. Simulations showed that 3D FeNAND-based A-CiM achieved up to 20 times higher throughput and 5,000 times greater energy efficiency than conventional nonvolatile memory.
Aurotek Corp. reported record consolidated revenue of NT$1.113 billion (US$34.7 million) in the third quarter of 2026, up 57.93% year-on-year. Orders from semiconductor, high-end artificial intelligence (AI) server and electronics manufacturing customers drove demand for the company's automation equipment and subsystems.
Supercapacitor maker Skeleton Technologies has raised a new investment round led by Siemens, valuing the company at more than USD 1 billion. According to a Skeleton press release, the round is a "nine-digit" sum, meaning at least USD 100 million, but the exact amount has not been disclosed. The money will mainly go towards building up manufacturing in the US, including its own cell production, for power systems in AI data centres. The company plans to invest more than USD 200 million in scaling up operations and R&D in Silicon Valley, working directly with hyperscalers; the US expansion includes plans for domestic cell manufacturing, giving Skeleton a full US value chain from cells to complete systems. The company says its supercapacitor cells based on its own Curved Graphene material, combined with power electronics and controls, even out load fluctuations from GPU clusters that switch power states within milliseconds, and can deliver up to 40% energy savings and double-digit improvements in GPU performance. Siemens supported Skeleton's expansion in 2023, and Siemens Digital Industries designed and automated the company's SuperFactory in Leipzig, Germany; the two companies will now develop and commercialise products for AI data centres together. Skeleton has not disclosed the size of the round, how large a stake Siemens is taking, or where and when the US cell production will start.
India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra. According to Dalal Street Investment Journal, the facility opened on October 12, 2026. The facility adds SIM and eSIM module production and specialized testing to its outsourced semiconductor assembly and test (OSAT) operations. The source does not state the cause.
advanced wafer-level packaging (AWLP)SIM and eSIM modulesRRP ElectronicsDigiTimes AsiaCapacity Change
TSMC announced its 3Q26 financial results on October 15: revenue reached $46.72B, up 41.2% YoY and 16.2% QoQ; gross margin was 66.4% (down 1.3 percentage points QoQ, primarily due to margin dilution from the initial ramp-up of 2nm production); net income rose 68.7% YoY to NT$763.06B and EPS reached NT$29.43, marking the sixth consecutive quarterly profit record. The 2nm process accounted for 8% of wafer revenue in its first quarter of volume production, up from 3% in the previous quarter (nearly tripling QoQ); 3nm remained the largest contributor at 33%, followed by 5nm at 28% and 7nm at 10%, with 7nm and more advanced processes combined at 79% of total wafer revenue. Inventory days declined five days QoQ to 82, suggesting inventory accumulated during the initial 2nm ramp-up is beginning to be absorbed. CapEx totaled $13.84B in 3Q26, bringing cumulative spending for the first three quarters of the year to $40.64B. By platform, HPC contributed 68% of revenue (up 22% QoQ), smartphones 21% (up 10% QoQ), automotive electronics 4% (up 23% QoQ), IoT 4% (up 5% QoQ), and consumer electronics 1% (down 12% QoQ). North American customers contributed 79% of revenue (up one percentage point QoQ), Asia-Pacific 10%, China 5%, and Japan and EMEA 3% each. Chairman and CEO C.C. Wei said the company expects full-year 2026 revenue, in US dollar terms, to grow by approximately 44% (a forecast), with 2nm production ramping at the Hsinchu and Kaohsiung sites, annual 2nm capacity expected to more than double in 2027, and nearly 25 fabs worldwide progressing in parallel.
2nm3nm5nmTSMCTrendForce Official (Market Data)Capacity Change
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements. Meanwhile, China's ChangXin Memory Technologies (CXMT) prepares to introduce server memory using the architecture by the end of 2026. The competing timelines have raised questions about whether China's memory industry is closing the technology gap with South Korean manufacturers.
4F² DRAMserver memorySamsung Electronics, ChangXin Memory Technologies (CXMT)DigiTimes Asia
Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor packaging deformation before manufacturing. The source does not state the investment amount or funding round. The investment comes as increasingly complex AI chips create new challenges in managing thermal stress, warpage, and manufacturing yields. The event is the completed investment; it involves no capacity or price change.
Delta Electronics unveiled its prefabricated solid-state transformer (SST) DC power solution at Energy Taiwan 2026 on October 14, targeting power efficiency, deployment speed and supply resilience in AI data centres, AI factories and energy-intensive manufacturing. The system integrates SSTs, DC/DC converters and control technology.
solid-state transformer (SST)DC/DC convertersDelta ElectronicsDigiTimes Asia
Global smartphone shipments fell 20% year-on-year in the third quarter of 2026, their lowest 3Q level since 2012. The source explicitly states the cause: persistent DRAM and NAND shortages inflated production costs, constrained supply, and weakened demand. Samsung led with a 23% market share, while Apple reached a record third-quarter share of 22%, highlighting a widening divide between premium and price-sensitive segments.
Kaga Electronics and AI infrastructure provider StarSeeds have signed a basic contract manufacturing agreement to produce AI servers at a partner facility in Japan, targeting mass production in December 2026. The event is a signed basic agreement; mass production remains a target/plan and has not yet been implemented.
AI serversKaga Electronics, StarSeedsDigiTimes AsiaPartnership/M&A
Global DRAM demand for humanoid robots is projected to increase more than 20-fold by 2030 as robot deployments expand and memory capacity per unit doubles, potentially opening a new growth market for Samsung Electronics and SK Hynix beyond the high-bandwidth memory (HBM) used in AI data centers. This is a demand forecast, not an achieved result.
Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that Nvidia has asked Samsung Electronics and SK hynix to increase supplies of 8-layer products. The source does not state the cause of the differing assessments; it notes that the differing assessments suggest changes in memory configurations do not necessarily signal weaker HBM demand, and that manufacturing constraints and supply shortages are expected to support memory prices in 2027. The event remains an expectation/report and the final configuration is not confirmed.
12-layer HBM48-layer HBM4Nvidia, Samsung Electronics and 3 totalDigiTimes Asia