Applied Materials opened the EPIC Center in California with up to $5 billion investment, partnering with TSMC, Intel, Samsung, Micron, and SK hynix to accelerate the commercialization of advanced semiconductor technologies, particularly for AI leadership.
The article explores the application and selection of MOSFETs in circuit design, covering the transition from theory to practical working circuits.
Reported on October 14, 2026: Kontron has started US production of its rugged VX307H computing board at subsidiary Nextek in Huntsville, Alabama, and at the same time the product moves from build-to-order to build-to-stock to shorten delivery times for US defense customers. The VX307H is the first product in a broader expansion of Kontron's VPX manufacturing in the US, with the VX3060 and VX30101 planned to follow. Nextek handles the entire production chain in Huntsville, from PCB assembly to final assembly and test; the facility is certified to AS9100 and ISO 9001, is ITAR-registered and works to IPC workmanship standards. According to the company, defense customers are asking for greater supply-chain resilience, faster availability and closer access to support, and bringing VX307H production to the U.S. directly addresses those needs. The VX307H is a 3U VPX platform based on Intel's Xeon D-2700/2800 processors, designed in accordance with the SOSA standard.
King Yuan Electronics (KYEC) has signed a prepayment agreement with Nvidia to support its wholly owned US subsidiary, AeternZ, in building local testing capacity, giving Nvidia early access to AI chip testing capacity in the US. The move further clarifies KYEC's plans to invest in the US, with Fort Worth, Texas, reportedly emerging as the likely site of its operations in the country. The event remains at the agreement/plan stage and the capacity is not yet built.
ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and SK Hynix. The announcement has fuelled speculation that China's memory technology is approaching or surpassing South Korean capabilities, while positioning CXMT for an early entry into the emerging 3D DRAM market. This remains a plan; mass production has not yet been achieved.
Taiwanese semiconductor testing services provider King Yuan Electronics (KYEC) is expanding its US footprint, with its board approving an advance payment agreement with Nvidia. Under the arrangement, Nvidia will make advance payments to support KYEC and its US subsidiary AeternZ Semiconductor Testing in building local testing capacity, while securing capacity for Nvidia; the payments will be gradually offset through the provision of testing services. The source does not state specific payment amounts, capacity scale or a construction timetable, and the capacity build-out remains at the planned stage.
On its earnings call, ASML warned that even with a planned 30% capacity increase in 2027 followed by another targeted 30% expansion in 2028, its planned capacity would fall short of customer demand in both 2027 and 2028; Reuters, citing CEO Christophe Fouquet, notes that orders for 2028 are already pouring in, with some customers looking to secure equipment as far ahead as 2029 or even 2030. ASML expects to ship around 65 systems, up more than 50% from last year, and the outlook for DUV immersion tools has improved significantly: after initially anticipating a decline in shipments, the company now expects volumes to remain roughly flat year over year. ASML confirmed it will introduce the NXE:3800F EUV scanner in 2027, boosting wafer throughput from today's 230 wafers per hour to 260 wph, a breakthrough the company said is expected to meaningfully scale customer production capacities starting in 2028 and beyond; it is also upgrading key DUV immersion tools scheduled for delivery in 2027 to a record 330 wph. On pricing, ASML said pricing discussions with major customers have concluded, with the impact expected to be minimal in 2026, beginning in 2027 and fully visible from 2028 onward; according to The Elec, ASML is reportedly seeking a 10% price hike on replacement parts supplied to South Korea, with Samsung Electronics and SK hynix already notified. Financially, ASML posted record third-quarter net sales of €11.66 billion, up from €9.33 billion in the previous quarter; net profit surged to €4.96 billion from €2.92 billion and gross margin expanded to 57.5% from 54%. It forecasts Q4 revenue of €14.2 billion–€15.2 billion ($15.9 billion–$17.0 billion) with gross margin around 57%, and raised the lower end of full-year revenue guidance by €1 billion to €44 billion–€45 billion while maintaining the upper end, with gross margin of approximately 56%. The price impact has not yet taken effect and the capacity expansions remain planned.
CanSemi debuted on the ChiNext board on October 13 with an IPO price of CNY 12.01 per share; shares opened at CNY 45, up 274.69%, raising approximately CNY 7.5 billion.
Reported on October 13, 2026: Jabil and Adani Enterprises have signed a non-binding memorandum of understanding (MoU) to form a 50:50 joint venture that would manufacture AI racks, servers and data centre equipment in India, with a manufacturing capacity target of several gigawatts. The proposed joint venture would manufacture and assemble AI racks, servers, storage and networking equipment, as well as the systems needed to power and cool them, including power distribution units, liquid cooling systems and transformers, and would also provide installation and commissioning; its rack manufacturing capacity is expected to support computing systems with a combined power capacity of several gigawatts. The joint venture still depends on definitive agreements being signed and on the necessary approvals. It follows the strategic alliance the two companies announced in June to build up manufacturing of AI and data centre infrastructure in India. The venture is meant to serve the Indian market and support exports; the source states India's data centre capacity is expected to reach 5–8 gigawatts by 2030, and the companies put the global market opportunity in AI computing infrastructure at more than USD 3 trillion over the next seven years. For Adani, the project fits into a planned USD 100 billion investment in 5 gigawatts of AI-ready data centres powered by renewable energy by 2035; for Jabil, which reported revenue of USD 36 billion for fiscal year 2026, the joint venture would expand its presence in the Indian data centre market, following recent acquisitions of Hanley Energy Group (power and energy management) and Mikros Technologies (liquid cooling).
On October 13, 2026, Germany’s Federal Ministry for Economic Affairs approved the spin‑off of Varta’s consumer battery business from the insolvent Varta AG group, allowing Varta Consumer Batteries to operate again as an independent company. The lenders have taken over the business and all 990 jobs will be retained. The company has received fresh capital amounting to several million euros, production and deliveries continue without interruption, and existing contracts and supply agreements remain unchanged, with no job cuts planned. Varta plans significant investments in Dischingen by the end of 2028, mainly in new equipment and more automation, and expects average annual sales growth of three to four percent up to 2029, driven primarily by European markets but also by South America, Asia and Canada.
China's ChangXin Memory Technologies (CXMT) is raising concerns over the future pricing power of Samsung Electronics, SK Hynix, and Micron as its plans for next-generation server DRAM prompt renewed scrutiny of competition in 2027 and 2028; South Korean industry observers caution, however, that CXMT has yet to demonstrate the production yields and reliability needed to challenge established suppliers at scale.
Samsung Electronics has begun dispatching advanced-process yield engineers from South Korea to its Taylor, Texas foundry ahead of planned 2nm chip volume production in 2027. The South Korea's Financial News reported on October 12, citing industry sources.
MangoBoost launched its AI inference platform Mango Inference on Oct. 12, after first unveiling it in July. The company said its pricing is more than 20% lower than competitors, and it plans to build a 1‑megawatt AI data center in Gangnam, Seoul by Q1 next year, expandable to 5MW, with GPUs from AMD and memory from Samsung Electronics and SK hynix. MangoBoost targets over 100 billion won in revenue next year, expecting around 10 billion won this year, and was founded in 2022.
On October 13, 2026, LS Electric announced a $138.46 million contract with Bloom Energy to supply 38 kV-class high-voltage switchgear and distribution transformers for a fuel cell-based on-site power generation project at a big-tech data center in Pennsylvania, with delivery from April to July 2027. The contract brings cumulative orders between LS Electric and Bloom Energy over 18 months to over $500 million.
According to ZDNet, Samsung Electronics teamed up with AMD to demonstrate a Compute Express Link (CXL)-based memory expansion solution at the OCP Global Summit 2026; featuring Samsung's CMM-D-based memory pooling technology, the solution enables multiple systems to share memory resources more efficiently and flexibly expand capacity. As noted by NewsPim, Samsung sees CXL-based memory expansion as a way to overcome the capacity limitations of conventional systems, particularly as AI agents drive higher memory requirements for inference. The demonstration follows a memorandum of understanding signed by Samsung and AMD in March to expand cooperation on next-generation AI memory and computing technologies; per The Korea Times, during her October 7 visit to South Korea, AMD CEO Lisa Su also discussed potential collaboration with Samsung in memory and foundry technologies (a discussion, not a confirmed collaboration). At the event, Samsung outlined plans to expand its AI memory and storage portfolio, highlighting next-generation technologies including HBM5, custom HBM, zHBM, and processing-in-memory (PIM), alongside CMM-D and CXL-based solutions, while advancing next-generation SSD technologies including quad-level cell (QLC) NAND and flexible data placement (FDP), and showcasing KV cache optimization and Direct Storage technologies. Through its Samsung MAX Lab, customers can evaluate emerging technologies including PIM, CMM-D, and next-generation SSDs under real-world AI workloads before commercialization. Samsung also displayed a Groq LPU wafer and NVIDIA's Groq 3 LPX system, with the chips mass-produced using Samsung Foundry's 4nm process, and a wafer manufactured using its 2nm gate-all-around (GAA) process.
Texas Instruments has introduced the ADC34DSO75, a 3-gigasamples-per-second (GSPS) analog-to-digital converter (ADC) designed to detect transient power events in AI data centers, enabling continuous, low-power, event-based remote monitoring at nanosecond resolution, and presented it alongside new high-voltage power management and clocking solutions at the 2026 Open Compute Project (OCP) Global Summit. TI also introduced the LMI800PS, an 800V isolated hot-swap controller that integrates functions previously implemented using five separate integrated circuits, combining an isolated bias supply and PMBus telemetry in a single package to reduce board area by more than 60%; it supports both ±400V and 800V distribution architectures with 5kVrms reinforced isolation and more than 8mm of creepage distance. TI also highlighted the LMK6B bulk acoustic wave (BAW)-based oscillator, which delivers 9.6fs jitter at 625MHz, supporting timing accuracy and signal integrity in high-speed networking systems as data transmission rates increase toward 3.2Tbps. In addition, TI will demonstrate 800V DC power solutions for NVIDIA's MGX AI Factory Ecosystem, including hot-swap protection and 800V-to-12V and 800V-to-6V DC/DC conversion, the latter incorporating gallium nitride (GaN) power stages, and has scheduled a technical presentation on 800V data center DC/DC design considerations, topology comparisons, and trade-offs for October 15, 2026, at the OCP Global Summit in San Jose, California.
On October 13, 2026, it was reported that Vital Technology Group’s subsidiary Vital Core Optoelectronic Technology (Wuhan) Co., Ltd. officially brought its wafer fabrication facility (fab) online in the Wuhan East Lake Free Trade Zone on September 28. The facility serves as the manufacturing core of the group’s CNY 12 billion high-end compound semiconductor material and chip industrialization base, featuring large-format optoelectronic chip platforms supporting 4/6-inch InP and 6/8-inch GaAs materials. Additionally, this month the group entered into a strategic cooperation agreement with Smarter Microelectronics and, together with its subsidiaries, secured joint pre‑research development orders from a leading overseas customer for next‑generation single‑lambda 400G optical interconnects.
ENGEL is showcasing an integrated injection molding production cell for automotive connectors at Fakuma 2026, combining its all-electric WINTEC e-win 1800 machine with the new viper 6 robot. The setup is designed to deliver high-volume production at lower costs while maintaining process stability and machine availability. For automotive electronics manufacturers and connector suppliers, this is an equipment demonstration; the source does not state any price, supply or demand change.
iC-Haus has announced that it will attend electronica (Munich, 10–13 November 2026, Hall C5, Booth 420) and SPS 2026 (Nuremberg, 24–26 November 2026, Hall 4A, Booth 146) with a focus on robotics, presenting highly integrated encoder and sensor iCs for position sensing and motor control in axes, joints, grippers and more. Highlights include the new iC-MUE magnetic absolute encoder SoC for position sensing in hollow-shaft applications such as robot joints, laser diode drivers for optical measurement systems including triangulation-based distance and object detection, and the iC RT2624 26-bit optical encoder solution for high-performance motor feedback systems. This is background product-showcase information; the source does not state any price, supply or demand change, and the source does not state the cause.
Stackpole Electronics introduced the RMAN series chip resistors, combining thick film resistor technology with the heat-dissipating capability of an aluminum nitride (AlN) substrate for industrial and automotive electronics operating at high power or under sustained load. According to the source, aluminum nitride provides thermal conductivity several times higher than conventional alumina while maintaining electrical insulation. In terms of power specifications, the RMAN provides power ratings up to 2.4 W in the 1206 size and 3.4 W in the 2512 size, which the source states delivers substantially higher power capability than conventional alumina-based thick film designs in compact PCB footprints. Applications include gate and snubber resistors for IGBT, SiC, and GaN power modules, pre-charge, discharge, bleeder, and current-sensing functions in motor drives, power supplies, and inverters, as well as automotive battery management systems, onboard chargers, DC-DC converters, and inverter gate drives. Pricing varies by size, tolerance, and TCR; customers are directed to contact Stackpole or a franchised distribution partner for specific or volume pricing.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |