Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown lab
SemiAnalysis teardown of Huawei's Kirin 9030 reveals SMIC's N+3 process achieves a 32.5nm local metal pitch, slightly better than Intel's 18A shipping pitch, but trails by 38% in transistor density. The analysis highlights the use of DUV lithography and complex workarounds to reach this density.
- Related manufacturers
- SMIC, Huawei, Intel
- Part numbers
- Kirin 9030
- Impact score
- 10 / 100, low impact