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Samsung shows first HBM5 mockup with Heat Path Block cooling — thermal race with SK hynix shaping up
What happened
Samsung displayed its first HBM5 mockup featuring Heat Path Block (HPB) cooling at Computex 2026, confirming that 12-layer HBM4E samples are already shipping. Both Samsung and SK hynix are aggressively developing in-package cooling solutions to manage thermal bottlenecks in next-generation AI memory. Neutral: This is a long-term R&D milestone with no immediate impact on current HBM spot pricing or availability.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
HBM5HBM4E
Source and time
Source: Tom's Hardware · 6/3/2026 · View original source
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