(PR) AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028
TrendForce reports CoWoS-L remains the mainstream AI packaging solution through 2028 due to TSMC's maturity and yield advantages. NVIDIA's high-end GPU shipments are projected to grow 30% YoY in 2026, supported by rack-scale solutions. AMD's MI400/MI450 series launch in H2 2026 further boosts shipment momentum.
- Related manufacturers
- TSMC, NVIDIA, AMD, Intel
- Impact score
- 10 / 100, low impact