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[News] TSMC Eyes Chip-Level Microchannel Cooling as AI System Power Could Rise 6× in Five Years
What happened
TSMC has included microchannel cooling in its R&D roadmap to address the projected 6x increase in AI system power consumption over the next five years. As package power rises from 600W to 4,100W, the industry is accelerating the shift from air to liquid cooling. While this technology represents a long-term direction for advanced packaging, manufacturing challenges imply no immediate supply disruption.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
HBMAdvanced Packaging
R&DAdvanced PackagingCooling
Source and time
Source: TrendForce · 9/1/2026 · View original source
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