NuAxiSemiconductor trade intelligence

(PR) AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028

What happened

TrendForce reports CoWoS-L remains the mainstream AI packaging solution through 2028 due to TSMC's maturity and yield advantages. NVIDIA's high-end GPU shipments are projected to grow 30% YoY in 2026, supported by rack-scale solutions. AMD's MI400/MI450 series launch in H2 2026 further boosts shipment momentum.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

AI ChipsAdvanced PackagingGPU

TSMC NVIDIA AMD Intel

demandcapacityAIpackaging

Source and time

Source: TechPowerUp · 9/18/2026 · View original source

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(PR) AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028

What happened

Impact and signal

Affected components and suppliers

Source and time

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