According to The Wall Street Journal, Apple, once one of the most powerful buyers in the NAND flash market, is losing some of its negotiating leverage as AI-driven demand gives memory suppliers greater pricing power. Meta, Microsoft, and Amazon have signed long-term supply agreements with Kioxia this year at higher prices, strengthening the chipmaker's negotiating position. Separately, South Korean outlet Economy Tribune reports that Apple has reportedly turned to a long-term NAND supply agreement, with market watchers identifying Kioxia as the likely partner; the terms remain undisclosed and this is a reported plan. The report adds that Apple may also pursue long-term agreements with Samsung Electronics, SK hynix, and Micron to secure future LPDDR5X and LPDDR6 supplies. According to TrendForce, memory's share of the 256GB iPhone Pro's bill of materials rose from around 10% a year earlier to 34% in 3Q26 and could exceed 40% in 1H27; TrendForce also estimates the iPhone 18 Pro's total BOM cost could rise 38% YoY, potentially forcing Apple to sacrifice margins to maintain shipments.
NAND flashLPDDR5XLPDDR6Apple, Kioxia and 5 totalTrendForcePrice Movement
Related manufacturers
Apple, Kioxia, Samsung Electronics, SK hynix, Micron
Samsung Electronics' third-quarter profit came almost entirely from charging more for memory chips, not from selling more of them. On its earnings call, the company also told investors the shortage behind those prices will last into 2028, even as chipmakers raise spending. The shortage is the explicitly stated cause of the higher prices and profit, and the persistence of the shortage into 2028 is a company expectation, not an achieved fact.
memory chipsSamsung ElectronicsDigiTimes AsiaPrice Movement
Samsung Electronics reported consolidated revenue of ₩195.3T and operating profit of ₩107.4T for 3Q26, becoming the first global technology company to post quarterly operating profit exceeding ₩100T. Its Device Solutions (DS) division contributed ₩106.5T in operating profit, which Samsung attributed primarily to broad-based memory price increases and a significant expansion in HBM4 sales. DS division revenue was ₩147.1T, up 344% YoY, with a 72% operating margin; memory revenue reached ₩140.7T, up 427% YoY. Samsung attributed the growth to its focus on AI-related products amid capacity constraints, with server demand the strongest and prices rising across end markets. In foundry, higher revenue from HBM base dies and advanced process technologies improved performance; utilization for processes below 8nm is expected to exceed 100%, and 2nm orders secured this year are projected to more than double from 2025. During the earnings call, Samsung stated all HBM supply for 2027 has been committed at target prices, with customers continuing to request additional volumes. HBM4E global sampling began in May, with volume production expected to start in 1H27 and a ramp-up in 2H27; in 4Q27 Samsung plans to further increase sales of HBM4, high-speed DDR5, and server SSDs. Samsung expects the 2027 supply shortage to be more severe than in 2026, with full-year CapEx budgeted at ₩84.4T, of which ₩76.8T is allocated to the DS division.
memoryHBM4HBM4ESamsung ElectronicsTrendForce Official (Market Data)Price Movement
Soaring memory prices have pushed some IC design firms to develop and manufacture their own SRAM as a substitute for DRAM. Meanwhile, electronics assemblers and brand manufacturers that still need DRAM face challenges in passing on higher costs and securing supply through long-term contracts. The title states the memory surge leaves CPI stable and hits consumer electronics hardest. The source does not state the cause of the price increase.
On its third-quarter earnings conference call held on Oct. 28, LG Electronics said panel prices for LCD TVs and monitors are expected to remain firm in the fourth quarter of this year, with upward pressure intensifying further from the first quarter of next year (Q1 2027 per the headline), driven by production cuts and price increases by panel manufacturers along with growing demand for large-screen TVs. The company said demand for larger panel sizes in the TV market is clearly increasing and expects this to be another factor driving prices higher. LG Electronics' Media Entertainment Solution (MS) division, which oversees the TV business, reported third-quarter revenue of 5.0215 trillion won and operating profit of 146.7 billion won, swinging to a profit from an operating loss of 302.6 billion won a year earlier; the company attributed the improvement to increased sales of premium products including OLED TVs, lower material costs and more efficient marketing spending. Park Sang-ho, senior vice president in charge of business management at the MS division, said the company will improve supply chain efficiency to address rising costs of key components and plans to increase the proportion of premium product sales, reduce competitive costs and adjust selling prices in line with market conditions.
Samsung reported 3Q26 results: riding the AI memory boom, operating profit surged nearly ninefold YoY to a record KRW 107.4 trillion ($80.04 billion), and revenue climbed to KRW 195.3 trillion, exceeding its early-October preliminary estimate by KRW 300 billion. The semiconductor (DS) division delivered KRW 147.1 trillion in sales and KRW 106.5 trillion in operating profit, a 72.4% margin. Samsung has posted record revenue and operating profit for four consecutive quarters since 4Q25. During its October 29 earnings call, Samsung said HBM4 revenue more than tripled QoQ in 3Q26, accounting for roughly 60% of total HBM sales; its planned 2027 HBM supply is effectively sold out, with customer negotiations concluded at target pricing levels, though major clients continue to request additional volumes. Samsung also claims it has achieved its goal of bringing its HBM market share in line with its standing in the broader DRAM market (TrendForce ranked Samsung as the top DRAM supplier in 2Q26 with a 39.4% share). Against a tightening supply outlook, Samsung has finalized long-term memory supply agreements (LTAs) with 10 major customers and is negotiating with another 10, and reportedly sees its target of securing LTAs covering 60–70% of production capacity by 2030 increasingly within reach; Samsung expects chip supply to tighten further in 2027. On pricing, DRAM average selling prices (ASPs) climbed around 20% QoQ in 3Q26 and NAND gained a high-teens percentage QoQ, per News 1 citing Kim Jae-june, Executive Vice President of Samsung Electronics' Memory Business; shipment growth was more modest, with DRAM volumes up a low- to mid-single-digit percentage and NAND up a mid-single-digit percentage sequentially.
SK hynix reported its Q3 2026 quarterly results with a record $78.129 billion in net revenue and shared a market outlook: it expects memory demand to continue outpacing supply through 2030, with a grim outlook for the consumer market. The source states the main supply constraint is the complexity of leading-edge semiconductor nodes and the lengthy lead times for fab construction, which take years to translate into regular mass production volumes. On pricing, the average selling price of memory modules in Q3 increased by over 20% compared to Q2; SK hynix suggests this means consumer electronics device prices might jump by more than 20% once memory inventory is depleted. The company expects a decrease in PC and smartphone shipments, offset by a strong rollout of AI data centers. About 14 major customers, including most hyperscalers, have signed 5-year long-term agreements that will account for over 50% of total capacity sold for 2027 and 2028. The company also cited its long-term supply agreements and expansion plans involving new fab capacity and facilities under construction. The supply-demand gap and the possible consumer electronics price increase are company expectations, not achieved results.
China's semiconductor and electronics supply chains are reporting a wave of price increases: Goke Microelectronics has raised quotes for hybrid-packaged memory products, while Hygon is considering higher CPU and deep computing unit (DCU) prices. According to the source, the moves reflect rising costs for raw materials, components, and upstream supplies; however, the source states that whether they can help China escape deflationary pressure remains uncertain. Note: Goke's quote increase is an observed action, whereas Hygon's price increase is only under consideration and not confirmed as implemented.
hybrid-packaged memory productsCPUdeep computing unit (DCU)Goke Microelectronics, HygonDigiTimes AsiaPrice Movement
Driven by AI demand, memory costs in 3Q 2026 increased by 350% year-on-year, causing PC and smartphone shipments to decline 20% and 22% respectively, while electronics production growth accelerated globally.
The source states that AI data center investment continues to expand, keeping the global memory market undersupplied in the fourth quarter of 2026. Rising DRAM and NAND Flash contract prices are boosting expectations for Samsung Electronics and SK Hynix in 2027; however, the source also notes that weak consumer demand and long-term agreement (LTA) price caps will limit further price increases.
DRAMNAND FlashSamsung Electronics, SK HynixDigiTimes AsiaPrice Movement
Rising memory prices and tightening supply are reportedly pushing some Chinese smartphone makers to turn to salvaged memory chips. According to TechNews, some brands are said to be sourcing memory chips recovered from discarded phones, potentially including used iPhones, through traders in Shenzhen's Huaqiangbei electronics market. Sources say memory procurement costs have surged, with some chips reportedly costing up to RMB 500 more per unit; the Shenzhen local government is also rumored to be offering smartphone brands subsidies of around RMB 300 per unit, leaving manufacturers to absorb roughly RMB 200. Unable to fully pass on the increases, some brands are reportedly cutting production and sales volumes to limit losses. TechNews notes the reported price increases, subsidies, and use of salvaged chips have yet to be confirmed by Chinese authorities or the companies involved, and such chips are largely limited to ultra-low-cost, unbranded smartphones and are unlikely to enter flagship supply chains. As background: TrendForce says AI server demand continues to squeeze DRAM supply, with shortages and price increases expected to persist into 2027; TrendForce projected global smartphone production would fall 14% year over year to approximately 1.07 billion units in 2026, a forecast revised upward due to earlier-than-expected purchases and restored production. Caijing's April investigation found a Shandong recycler purchased around 1,000 discarded phones in March and dismantled more than 600 for potential chip resale, with some nonfunctional devices reportedly fetching more than RMB 100 each; some recyclers preferred Android phones from OPPO, vivo, and Huawei, while sources told TechNews that Huaqiangbei traders primarily purchased used iPhones. A September STAR Market Daily investigation found refurbished chips can serve lower-end applications such as automotive accessories, IoT devices, and overseas refurbished phones, but analysts cautioned that salvaged chips face yield losses and compatibility risks, and recycling premiums could quickly disappear if major chipmakers adjust production.
Growth in the global TV market is under pressure, but premium models are poised to expand. As rising memory prices fuel "chip inflation" and squeeze margins on budget TVs, Samsung Electronics and LG Electronics are reshaping their product mixes, strengthening OLED and Micro RGB offerings to support pricing through picture quality and feature differentiation.
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CanSemi debuted on the ChiNext board on October 13 with an IPO price of CNY 12.01 per share; shares opened at CNY 45, up 274.69%, raising approximately CNY 7.5 billion.
According to The Elec, ASML reportedly plans to raise prices by 10% on all replacement parts supplied to South Korea, covering both EUV and DUV lithography systems. The report notes that ASML notified Samsung Electronics and SK hynix of the planned increase through its South Korean subsidiary in early September, and the new prices will apply to deliveries starting in January 2027. The increase covers everything from regularly purchased consumables to major components replaced due to failures or declining performance; while ASML has previously adjusted prices for individual parts due to rising raw material costs or supply shortages, an across-the-board 10% hike is unusual, and industry sources suggest the company is seeking a larger share of its customers' profits. ASML is also reportedly discussing higher prices for newly ordered lithography equipment with major customers. For context, ASML generated €8.193 billion in revenue from services, replacement parts, and upgrades for installed equipment last year, roughly 25% of its total revenue of €32.667 billion, and expects this business to grow by more than 30% this year. According to Reuters, its EUV machines priced around US$200 million each are nearly sold out through 2027, and next-generation High-NA EUV systems are priced at roughly US$400 million each. ASML has also reportedly sought a 10% price increase for DUV lithography equipment, with some Chinese customers accepting, while TSMC is said to be resisting price hikes for both EUV and DUV systems; Applied Materials said in August that higher prices were supporting margin expansion, Tokyo Electron said in late July it was negotiating price adjustments to offset rising costs; lead times for certain deposition equipment components have increased from four months to as long as 10 months, and some Japanese-made laser-processing components face delivery times of up to 40 months. The source does not state a single definitive cause, linking the increases to AI-driven capacity expansion, inflation, and rising raw material costs.
EUV光刻系统更换零部件DUV光刻系统更换零部件EUV光刻设备ASML, Samsung Electronics and 6 totalTrendForcePrice Movement
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ASML, Samsung Electronics, SK hynix, Applied Materials, Tokyo Electron, TSMC
ASML will raise prices by 10% across replacement parts supplied to South Korea, covering all parts for extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography systems, with the new prices taking effect for deliveries starting in January 2027. According to industry sources, ASML headquarters notified Samsung Electronics and SK Hynix of the proposed increase through its South Korean subsidiary in early September, and the increase was finalized after discussions with the purchasing organizations of both companies. Prices will rise for everything from consumable parts purchased regularly to major components replaced because of failures or performance degradation, raising the cost of keeping the equipment operational. Industry sources say ASML has traditionally adjusted prices for individual parts only when raw material costs rose sharply or specific materials became difficult to procure, making a blanket 10% increase unusual; an industry official said component prices have risen across the board but ASML also appears to be seeking a larger share of the profits its customers are making. ASML separately reports revenue from services, parts and upgrades for installed equipment, which totaled €8.193 billion last year, accounting for 25% of total sales of €32.667 billion, and the company forecast this revenue would grow by more than 30% this year. Prices for newly ordered equipment are also likely to increase, and ASML is discussing equipment price increases with major customers. The Information reported in July that ASML had notified Chinese semiconductor manufacturers and other customers of a 10% increase in DUV equipment prices, with some customers accepting, while largest customer TSMC was reportedly opposing the increase. Industry observers expect the across-the-board increase, accepted by Samsung Electronics and SK Hynix, to strengthen the position of other equipment and component suppliers seeking price increases: Applied Materials said in August that prices had risen for both new and existing products, Tokyo Electron said in late July it was pursuing price adjustments including for equipment already on the market, and Advanced Energy Industries said it had raised prices for some product lines. The source states the cause: AI data center investment has prompted memory makers and foundries to expand capacity simultaneously, driving up equipment and component orders while suppliers need time to expand production, creating a supply-demand imbalance; rising inflation and raw material costs have added to supplier cost burdens, giving suppliers greater negotiating leverage.
EUV lithography system replacement partsDUV lithography system replacement partsASML, Samsung Electronics and 3 totalThe ElecPrice Movement
Samsung Electronics is seeking prices for its next-generation HBM4 that are more than three times its current HBM3E prices. This significant increase is expected as the company transitions its main product from HBM3E to HBM4. Bullish. Analysts believe this shift will further boost the company's profitability.
HBM4HBM3ESamsung ElectronicsDigiTimes AsiaPrice Movement
Global DRAM module revenue reached $21.2 billion in 2025, surging 59% year-over-year. This growth was driven by rising prices and concentrated shipments in the second half, fueled by tariff-driven inventory buildup and DDR4 end-of-life plans. Bullish signal for DRAM pricing and supply constraints.
DRAM ModuleDDR4TrendForce, DRAM module makersTechPowerUpPrice Movement
NVIDIA's gross margin is projected to drop to 71-72% in 4Q26 due to component price hikes exceeding expectations. Consequently, major OEMs like Dell, HP, and ASUS are qualifying and adopting components from Chinese suppliers such as CXMT and Viiyong to mitigate shortages and costs. This shift signals a significant diversification in the supply chain for entry-level PCs.
DRAMMLCCNVIDIA, CXMT and 11 totalTrendForce Official (Market Data)Price Movement
MLCC, resistors, and inductors see prices rising 15% to 70% due to raw material inflation and supply constraints. AI and EV demand has pushed capacity utilization above 95%, creating a structural shortage. Bullish: Price uptrend confirmed.
MLCCTantalum capacitorsPolymer capacitorsElectronics SourcingPrice Movement
Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display in Q2 2026 ahead of schedule. This move was driven by AI-related demand lifting memory prices and strengthening the company's cash position.
DRAMNAND FlashSamsung ElectronicsDigiTimes AsiaPrice Movement