Samsung Electronics has installed two High-NA EUV systems but delayed mass production to manage depreciation costs amid ongoing foundry losses. This cautious approach reflects a focus on profitability before full-scale deployment, despite improving 2nm yields.
Samsung Electronics faces union pushback on a major semiconductor investment in the Honam region, with 80% of workers opposing the project, creating uncertainty regarding labor-management relations.
Samsung's Taylor, Texas fab will mass-produce Tesla's AI5 SoC on the SF2 2nm node, utilizing CHIPS Act funding. This marks a significant expansion of Samsung's US capacity and validates its advanced node. The move is bullish for Samsung's capacity utilization and LPDDR5X demand.
NexiGO secured €2M in pre-seed funding to develop 4-inch Gallium Oxide (Ga2O3) wafers for EV charging. This new capacity expansion plan signals potential future supply growth, which is bearish for current spot prices.
Rapidus has successfully produced a 2nm GAA prototype and secured government funding, but currently lacks any committed volume customers for its 2027 mass production target. Despite having 60 potential partners in talks, the absence of signed agreements poses a risk to the project's immediate supply chain viability.
Tesla plans to hire 1,000 workers at its Berlin Gigafactory to increase weekly production from 6,000 to 7,500 vehicles, supported by a 322% year-on-year surge in German registrations.
MKS invests $25 million to expand Atotech's Guangzhou site, aiming to double production capacity by Q4 2027 to meet AI-driven demand in semiconductors and advanced packaging.
Samsung Electronics plans a massive KRW2,655 trillion investment, primarily targeting memory capacity expansion in the Gwangju region. The funds will be allocated to existing clusters and new Honam region development. Bearish for memory prices due to anticipated oversupply from increased production capacity.
Nexchip Semiconductor is raising $890 million to fund a $5.1 billion 40/28nm fab in Hefei, targeting automotive chips and CMOS image sensors. Despite a 32% profit margin last year, the company anticipates reduced earnings this year due to heavy depreciation from the new facility. This capacity expansion signals potential oversupply and bears a bearish outlook for spot prices.
Goertek's AR optical wafer fab in Shanghai commenced production on June 22, 2026, with a total investment of 3.28 billion CNY. This facility, formerly Sunny OmniLight, focuses on AR waveguide lenses and advanced optical components. Bearish for AR optics prices as new supply capacity enters the market.
Samsung and SK Hynix plan to build two memory fabs each in South Korea, investing KRW 800 trillion in a new chip ecosystem. This massive capacity expansion signals potential future oversupply and downward pressure on memory prices.
Joynext expanded its Polish facility by 13,300 sqm, bringing total capacity to 26,000 sqm. The new modular plant, powered by renewables, aims to support European OEMs with shorter development cycles. Bearish impact on automotive electronics pricing due to increased supply capacity.
Samsung achieved $1B in HBM4 sales and is aggressively expanding, while SK hynix focuses on profitability. This competitive shift suggests increased supply pressure on HBM4 pricing.
Intel splits advanced packaging into a standalone business led by former SK hynix CEO Seok-Hee Lee, with EMIB-T technology rolling out in production fabs this year to compete with TSMC's oversubscribed CoWoS capacity.
Micron selected Bechtel for its NY fab construction, targeting late 2030 and 2033 operations. This $50B expansion aims to shorten ramp-up times but threatens to lower DRAM ASPs due to subsidized costs.
SK Group Chairman expects memory supply tightness to persist through 2030 and plans to double total wafer capacity over the next five years. This move aims to address surging AI demand and strengthen partnerships with TSMC and NVIDIA for next-gen HBM4E. Bullish for memory pricing in the short-to-medium term, though long-term capacity doubling warrants monitoring.
Laster Tech has entered the robot joint control module supply chain and secured North American auto orders, with small-volume shipments slated for Q3 2026 and vehicle deliveries targeted for Q1 2027. This move represents a strategic extension from automotive electronics to embodied intelligence robotics to strengthen local North American supply capacity. Neutral.
Panjit International is accelerating its expansion into AI and automotive electronics sectors. The company aims to enter a new growth cycle after four decades in the discrete device market. This strategic shift warrants attention regarding future capacity adjustments.
Doosan Corporation plans to invest approximately $120 million in a new CCL production base in Thailand, targeting mass production in the second half of 2028, to meet the rising demand from AI data centers.
ASML CEO expects first High-NA EUV products within months, while TSMC delays adoption due to high costs. Intel and SK hynix are aggressively deploying the technology, whereas Samsung adopts a pragmatic approach.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |