Samsung commercialized FOPLP first, but TSMC is pushing 310x310mm panel formats, threatening Samsung's lead in packaging technology.
CACI International opened a 61,000-square-foot manufacturing facility in Rochester, NY, increasing its defence electronics capacity by 300%. This facility serves as the primary production hub for electronic warfare systems for the US Army. The expansion indicates a strategic move to secure supply for defence electronics components.
Nvidia has booked TSMC's 1.6nm (A16) process capacity for its Feynman GPU, targeting mass production in H2 2028. The A16 process, succeeding the 2nm N2, utilizes GAA transistors and backside power delivery for improved density and speed. Bullish: Confirms strong future demand for TSMC's advanced nodes and Nvidia's high-end roadmap.
Delta Electronics and Lite-On Technology are increasing capital expenditure to 9% of revenue to meet the surging demand for power and cooling solutions in AI data centers. Chipmakers like Nvidia and AMD are refreshing platforms annually, driving up power density and thermal requirements. This capacity expansion is necessary to avoid missing design cycles amid intense competition.
ASE SPIL breaks ground on a 100 billion TWD plant to boost CoWoS capacity, with first-phase operations scheduled for 2028. This expansion targets the current AI chip packaging bottleneck. Bearish: Future supply increase will alleviate the current CoWoS shortage.
SK Hynix is expanding Solidigm's Dalian plant to 50,000 wafers/month of 100-layer NAND by H1 2027, focusing on mature floating-gate technology while reserving advanced 375-layer NAND for its Cheongju facility.
mature NAND supply, bearish for mature NAND prices.
Siliconware Precision Industries (SPIL) broke ground on a new plant in Douliu with a 100 billion NT$ investment to introduce CoWoS technology, targeting initial operations in 2028. This capacity expansion is driven by surging AI and HPC demand. Bearish: The announced capacity increase will likely alleviate future supply shortages, exerting downward pressure on prices.
Climax Technology broke ground on a NT$2.3 billion plant in Neihu, Taipei, with capacity expected to rise 60%. This expansion plan signals increased future supply for wireless security systems. Bearish for pricing due to potential oversupply.
Trusval Technology reported record profits in H1 2026 driven by demand from semiconductor fabs and memory makers for capacity expansion. The company expects continued momentum in H2 2026 as it expands engineering and utility connection businesses.
Nanya Technology announced a $10.7B investment in Fab5A for 10nm-class EUV DRAM, following a 49.3% month-over-month revenue increase in July driven by rising DRAM prices. This indicates a bullish short-term demand outlook and a significant long-term supply expansion.
Nanya Technology announced a massive US$10.7B investment plan for Fab 5A, targeting 10nm-class DRAM with EUV. The company raised its 2026 Capex by 34% to ensure equipment advance payments. This expansion signals significant future supply growth, which is bearish for DRAM pricing.
CXMT plans to build its sixth DRAM fab in Beijing, aiming to double monthly wafer starts to over 600,000. This expansion relies on government funding and targets 30% market share by 2030. Bearish - Increased capacity will likely lead to oversupply and downward pressure on DRAM prices.
ESCATEC added two ASMPT SX pick-and-place modules to its UK facility to enhance medical manufacturing capacity. This investment aims to improve efficiency and support rapid NPI projects. The move signals a capacity expansion that could increase supply for medical electronics.
Major memory suppliers are increasing capital spending to meet AI demand, but Kioxia is keeping its investment relatively tight, prioritizing technology leadership over rapid expansion.
AMEC targets 60% high-end market coverage and expands manufacturing footprint to 900,000 sqm, supported by 36.6% revenue growth in 2025.
Zeiss is expanding production in Germany to alleviate ASML's EUV optics bottleneck, driven by surging AI data center demand for advanced chips.
TSMC's 2nm node (N2) has reached a monthly capacity of 20,000 wafers, currently accounting for only 3% of revenue. Despite having four times the tape-outs of the 3nm node, the technology is still in early ramp-up. Bullish for future demand, neutral for current spot prices.
Carl Zeiss SMT confirmed a 25,000 sqm expansion at its German site to support ASML's EUV scanner production. This expansion addresses the capacity bottleneck limiting ASML's output, aligning with ASML's plan to increase Low-NA EUV production by 30% in 2027. Bullish for ASML and EUV equipment supply chain.
Ablecom Technology is expanding production in Taoyuan to meet rising AI server demand, increasing rack output by over 1,000 units per month. This expansion targets the growing need for high-density compute in hyperscale data centers. The capacity increase signals potential oversupply, exerting downward pressure on rack prices.
Molex and Prysmian signed a 10-year agreement for optical cables to support AI data center growth, doubling Prysmian's domestic fiber capacity. This capacity expansion signals increased supply availability, which may alleviate current shortages. Bearish impact on spot prices.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass chip map: 12 modules, 37 checkable identifiers (31 A / 6 B) and 19 public MPNs (16 externally searchable); A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.All teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |