TDK expands the MLJ1608-G series multilayer inductors for automotive power-over-coax (PoC) circuits, with mass production starting in October 2026; the component provides 1.7 to 2 times higher impedance than conventional parts in the 100–700 MHz range, achieves high impedance up to 2 GHz, and has a 1608 footprint.
ITEN expands its solid-state battery family with a 1,500 μAh device and reaches a 30 million unit/year production capacity milestone at its French pilot plant. This expansion targets IoT and MedTech applications requiring higher energy density. Impact: Neutral (Capacity increase signals future supply growth).
LG Electronics is expanding chiller capacity in the US and South Korea, while LS Electric secured a $133.41 million contract to supply ultra-high-voltage transformers for a North American hyperscale AI data center. This addresses critical bottlenecks in high-density computing infrastructure. Bullish: Demand for cooling and power transmission components is surging.
Samsung Electronics is accelerating its sub-10nm DRAM production strategy by shifting to the D0a node and utilizing hybrid bonding technology. This roadmap update indicates a focus on increasing capacity and efficiency for next-generation memory. The expansion of production capacity is likely to exert downward pressure on spot prices.
Samsung Electronics plans to increase HBM4 production capacity by 2.5 times by 2027 to meet surging AI chip demand. This significant expansion signals a future supply increase, which typically exerts downward pressure on spot prices.
Samsung and SK Hynix are shifting production capacity to HBM, tightening conventional DRAM supply and allowing CXMT to gain market share without price competition. This structural shift is bullish for DRAM pricing.
TDK expands its B43645-B43661 series aluminum electrolytic capacitors to 500V rated voltage for AI server power supplies. This capacity expansion targets high power density requirements in data centers.
Scanfil is expanding its Myslowice plant in Poland by 6,000 sqm, bringing the total area to approximately 36,000 sqm. The expansion, driven by organic growth and new customer wins, is scheduled for Q1 2028.
产能扩张计划对短期现货价影响有限，主要利好公司长期订单承接能力。
Micron plans to increase HBM capacity by 60,000 wafers/month, reaching 100,000 by year-end, focusing on 12-Hi HBM4 for NVIDIA. This expansion aims to close the gap with rivals Samsung and SK hynix. Bearish: Increased supply will likely put downward pressure on HBM prices.
Samsung commercialized FOPLP first, but TSMC is pushing 310x310mm panel formats, threatening Samsung's lead in packaging technology.
CACI International opened a 61,000-square-foot manufacturing facility in Rochester, NY, increasing its defence electronics capacity by 300%. This facility serves as the primary production hub for electronic warfare systems for the US Army. The expansion indicates a strategic move to secure supply for defence electronics components.
Samsung Display plans to expand OLED production capacity in Asan (Plant 2) starting 2027, targeting completion in early 2028, driven by foldable demand and Apple's rumored entry. Concurrently, rising memory costs are expected to keep mobile manufacturing expenses elevated in 2H26.
Delta Electronics and Lite-On Technology are increasing capital expenditure to 9% of revenue to meet the surging demand for power and cooling solutions in AI data centers. Chipmakers like Nvidia and AMD are refreshing platforms annually, driving up power density and thermal requirements. This capacity expansion is necessary to avoid missing design cycles amid intense competition.
NXP broke ground on a new assembly and test factory in Malaysia, adding 500,000 square feet to expand its operations. The facility, ramping up in Q1 2028, aims to double output and support future growth from joint ventures in Singapore and Germany. Bearish for prices due to increased supply capacity.
Musk's Terafab facility spans 10 million sq. ft and will produce logic, memory, and AI chips to meet SpaceX and Tesla's 1PW compute demand. Despite Jensen Huang calling it 'extremely hard,' Intel CEO Lip-Bu Tan views Musk as the ideal partner for unconventional manufacturing. This is a significant capacity expansion plan requiring close monitoring.
ESCATEC added two ASMPT SX pick-and-place modules to its UK facility to enhance medical manufacturing capacity. This investment aims to improve efficiency and support rapid NPI projects. The move signals a capacity expansion that could increase supply for medical electronics.
Samsung plans to begin construction on Taylor Fab 2 by end-2026, targeting mass production in 2030 to address lagging demand for leading-edge nodes. The foundry expects 2nm orders to more than double in 2026 and utilization to reach full capacity for 8nm and below. This expansion, driven by surging AI and HPC demand, signals a bullish outlook for Samsung Foundry's profitability and market share.
Samsung Electronics is establishing a hybrid bonding mass production line with approximately 50 bonders, targeting full-scale deployment by 2029-2030. This move aligns with the upcoming NVIDIA Feynman generation, signaling a long-term capacity expansion in advanced packaging.
Samsung Electronics is delaying its High-NA EUV rollout compared to Intel to prioritize foundry profitability over equipment spending. The company is shifting the debate from yield rates to financial returns. This cautious approach signals a potential slowdown in aggressive capacity expansion.
Molex and Prysmian signed a 10-year agreement for optical cables to support AI data center growth, doubling Prysmian's domestic fiber capacity. This capacity expansion signals increased supply availability, which may alleviate current shortages. Bearish impact on spot prices.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |