An Intel Foundry editorial, citing the Semiconductor Industry Association, notes that America's share of global semiconductor manufacturing fell from 37% in 1990 to 10% in 2022. The editorial states that construction and tool installation are underway at Intel's Fab 62 in Arizona, with operations expected by the end of 2028, while its Ohio project has reached another structural milestone; it emphasizes that construction progress signals preparation for future demand, although the eventual impact will depend on execution, customer adoption and competitive manufacturing performance. The editorial also states Intel works with more than 4,500 suppliers across 49 states and generates more than $29 billion in annual domestic spending. These are editorial claims and in-progress construction plans, not achieved capacity results.
Hanwha Systems has begun full-scale mass production of multifunction displays (MFDs) for South Korea’s domestically developed KF-21 supersonic fighter jet. According to industry sources on Oct. 21, Hanwha Systems has completed development of the KF-21 MFD and started mass production. A contract covering the initial production batch of 40 aircraft has been signed, with the overall procurement program potentially expanding to 120 aircraft, including 80 in subsequent production batches. In November 2024, Hanwha Systems signed a contract worth approximately 61.6 billion won with Korea Aerospace Industries (KAI) to supply four types of avionics equipment for the KF-21. The contract covers MFDs, mission computers (MC), audio communication control systems (ACCS) and infrared search and track (IRST) systems. The contract runs through December 2026.
multifunction displays (MFDs)Hanwha Systems, Korea Aerospace Industries (KAI)The ElecCapacity Change
According to industry reports, Samsung Electronics' foundry business has yet to finalize contracts with major global technology companies for its 2nm process, while demand has pushed its 4nm production lines close to full capacity. The company is expanding efforts to win new 5nm orders as it seeks to increase utilization of established processes and improve foundry profitability. The 2nm customer contracting remains unfinalized, the 4nm near-full utilization is an observed condition, and the source attributes the near-full 4nm utilization to demand.
Topoint Technology said it is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA Show 2026, the company presented tools and processing technologies for advanced materials, including ABF substrates, quartz cloth, and PTFE, while outlining its capacity expansion in Taiwan and China. The expansion is a plan; the source gives no scale or schedule for the expansion.
South Korean IC design firm LX Semicon has deployed AI agents in the development of display driver ICs (DDIs), reducing the design time for a benchmark image-processing engine from 10 days to two. The company said two large-size LCD TV DDI products developed with the technology have reached tape-out, with mass production planned for early to mid-2027 for television panels in Greater China; the mass production remains a plan and has not yet been implemented.
According to Reuters, as AI-driven demand extends from DRAM to NAND and competition from China's YMTC intensifies, Samsung and SK hynix are planning upgrades at their Chinese NAND facilities: Samsung plans to shift its Xi'an plant from roughly 200-layer to 286-layer V9 NAND under an internal project dubbed "Monami"; SK hynix, already authorized to produce up to 240-layer NAND in Dalian, is reportedly planning to upgrade from its current 192-layer technology to 240 layers or more, and may seek U.S. approval for R&D on 300-plus-layer technology. TrendForce estimates China accounts for roughly 30–35% of Samsung's total NAND output and an even higher 40–45% for SK hynix. U.S. export restrictions remain a major hurdle: both chipmakers must obtain annual licenses to install U.S.-made equipment at their Chinese plants, and Washington indicated in 2025 that it would not approve technology upgrades or capacity expansions there; both companies confirmed to Reuters that upgrades were underway in close coordination with Washington but declined to disclose detailed production plans. On competition, YMTC's NAND lineup is dominated by 160- and 232-layer products, it is already producing 294-layer chips in limited volumes and plans to push beyond 300 layers. Separately, per Seoul Economic Daily, Samsung has shifted roughly 60% of its V-NAND capacity to V9 (286 layers), is ramping shipments to NVIDIA, has begun mass production and supply of V10 NAND, and is accelerating development of next-generation V11 targeting around 500 layers; per Bloter, SK hynix is stepping up its shift to 321-layer NAND, which became its largest NAND production segment in 2Q26, with roughly half of its domestic NAND capacity expected to transition to 321-layer products by year-end.
NAND flashSamsung, SK hynix and 3 totalTrendForceCapacity Change
According to industry sources on Oct. 20 (year not stated in the source), Samsung Electronics plans to manufacture its next-generation M2800 series mobile modem chips using a 2nm process, transitioning from the 4nm technology currently used for external modems; the external 5G modem M2800 is scheduled to complete development in 2027, is intended for the Galaxy S28 series due for release in 2028, and will be paired with the next-generation Exynos 2800 in a two-chip configuration. Moving modem production to 2nm will free up capacity on Samsung's 4nm lines, which the company plans to redirect toward HBM production; an industry official said "Samsung Foundry is converting much of its 4nm production capacity to HBM manufacturing," with the 4nm process used for the base die containing control circuitry at the bottom of an HBM stack. Samsung will continue using 4nm through the M2700, an external modem designed to accompany the Exynos 2700 in the 2027 Galaxy S27 series; the Shannon 5410 external modem used in the 2026 Galaxy S26 (also marketed externally as the Exynos Modem 5410) was also manufactured on a 4nm process, with Samsung equipping the South Korean versions of the Galaxy S26 and S26+ with the Exynos 2600 and Shannon 5410 combination while US models used Qualcomm's Snapdragon 8 Elite Gen 5. An industry official said Samsung has discontinued the Shannon modem brand and replaced it with the M-series. Although the M2700 uses the same 4nm process, it reportedly received favorable evaluations in internal testing by Samsung's Mobile eXperience (MX) Business, unlike its predecessor; Samsung improved power efficiency and data transmission speeds through design and software changes, reduced the chip's area by approximately 4% using optical shrink, and moved the modem from 3GPP Release 17 to Release 18 with improved NTN satellite communication capabilities. The official said the existing Shannon 5410 lagged behind competing products in idle power consumption and under standard power measurement conditions, and that the M2700, following voltage adjustments and other improvements, reportedly delivers performance comparable to or better than rival products. The 2nm transition and 4nm capacity conversion are plans; the source does not confirm their implementation.
mobile modemHBM base dieSamsung ElectronicsThe ElecCapacity Change
Yea Shin Technology, a subsidiary of Eris Technology, will begin trading on Taiwan's emerging stock market on October 23 and plans to raise the share of 6-inch wafers in its capacity from 35% to more than 50%, as its TVS products enter the international AI server supply chain. The source attributes this to AI servers driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. The increase in the 6-inch wafer share is a plan, not a completed outcome.
Genesem has reached an exclusive agreement with Company A, a top-three global semiconductor manufacturer, and its outsourced packaging partners to supply saw singulation equipment equipped with AI inspection capabilities starting in 2027. The GVISION AI+ passed mass-production qualification testing in the third quarter, with deliveries expected to total approximately 20 machines in 2027 and a contract value exceeding 30 billion won. AI capabilities have increased equipment prices by more than 10% compared to existing models.
saw singulation equipmentGVISION AI+Genesem, Company A and 3 totalThe ElecCapacity Change
Related manufacturers
Genesem, Company A, Company A's outsourced packaging partners
Amkor Technology is tripling its planned investment in Gwangju to expand advanced packaging capacity for artificial intelligence and high-performance computing. The source does not state the specific investment amount or the resulting figure after the tripling. The project is a semiconductor project under South Korea's southwestern development strategy and is being brought into construction. The stated context for the increased investment is growing AI packaging demand. This is a planned expansion; the source provides no completion timeline or capacity figures.
advanced packaging capacity for artificial intelligence and high-performance computingAmkor TechnologyDigiTimes AsiaCapacity Change
Transmission systems integrator TiMotion Technology plans to begin trading on Taiwan's Emerging Stock Board on October 21, coinciding with its 20th anniversary. The company is targeting record revenue in 2026 on strong industrial demand and its expansion into the robot market. In addition, its Vietnam plant is set to open by year-end (this plan is stated in the title; the body does not elaborate). These items are plans or targets, not yet achieved results.
TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage samples with semiconductor packaging companies. Under its stated plan, the company targets core technology validation by the end of 2027 and mass production in 2028; the title cites an investment of NT$6 billion. This is a planned/expansion event, and mass production has not yet been realized.
According to Wccftech, at the 2026 Open Compute Project (OCP) Global Summit, Intel — which is expanding its silicon photonics capabilities as demand for high-bandwidth optical interconnects grows across AI and high-performance computing (HPC) — claimed to be the only high-volume foundry capable of supplying 300mm indium phosphide (InP) silicon photonics at scale to the broader industry; the technology is intended to support next-generation near-package optics (NPO) and co-packaged optics (CPO). The source notes that conventional InP substrates are generally limited to 150mm (6-inch) wafers, with 3-inch and 4-inch formats still widely used, and that InP crystals are brittle, grow slowly, and present defect-control challenges, limiting laser chip output per wafer and slowing capacity expansion; Intel integrates InP-based laser technology into its 300mm silicon photonics manufacturing platform, aiming to improve production efficiency and scalability. Per TrendForce, NVIDIA has begun shipping its Spectrum-X CPO switches to select partners (developed jointly with TSMC using its Compact Universal Photonic Engine (COUPE) technology), Broadcom continues limited shipments of its 51.2 Tb/s Bailly CPO switches, and at OCP 2026 showcased its third-generation Tomahawk 6-Davisson CPO switch with 102.4 Tb/s of switching capacity and 200 Gbps per channel; TSMC plans to begin production of its COUPE-on-substrate solution in 2026, targeting twice the power efficiency and a tenfold reduction in latency compared with board-level pluggable optics. Per ijiwei, Zhongji Innolight has established a dedicated CPO production line and begun small-volume production of 800G CPO optical modules; some customers have placed orders, with shipments potentially beginning in 2027 and broader adoption expected in 2028, and in September 2026 Huawei introduced its NPO-based Ascend 960 supernode for large-scale AI training and inference. TrendForce states that testing remains a key obstacle to CPO mass production: while optical alignment times have fallen to seconds or less, complete testing of a single photonic integrated circuit (PIC) can still take more than 100 seconds, shifting the bottleneck toward testing speed and cost; TrendForce expects 2027 to be a pivotal year for integrating CPO testing systems, with 2028 a critical period for assessing readiness for large-scale production.
Tesla CEO Elon Musk has predicted a surge in Chinese memory chip production by 2028, raising questions over Samsung Electronics and SK Hynix's pricing power during an AI-driven dynamic random-access memory (DRAM) shortage. His remarks suggest that China's expanding capacity could offer major technology buyers alternative sources of supply and potentially ease memory costs. This is a prediction, not an implemented capacity change; the source does not state the cause.
DRAMSamsung Electronics, SK HynixDigiTimes AsiaCapacity Change
ACM Research, a US semiconductor equipment maker, is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the company invests in South Korea and Oregon. The company expects overseas operations to grow faster than its China revenue, although the source states that technology adoption, packaging-size standards, and US-China tensions could affect its plans. The expansion remains a plan/expectation, customer evaluations are ongoing, and no completion is reported.
AUO Chairman and CEO Paul Peng said the company is positioning its growth around artificial intelligence, diversification, and cooperation across the group. As the display technology company marks its 30th anniversary, it will build on three established businesses while seeking fourth and fifth growth pillars through technologies and partnerships, with directions including co-packaged optics and glass core substrates. This is a stated plan; the source does not state investment scale, timetable, or the cause.
Tata's Dholera fab faces customer and shareholder tests; the fab is a planned capacity project, with no reported implementation or completion. Meanwhile, India's semiconductor push is broadening, with packaging, chip services, AI hardware and infrastructure investments accelerating across the country's domestic technology ecosystem. The source does not state the cause.
On the recent investor call, TSMC Chairman and CEO Dr. C.C. Wei said assessed demand exceeds available supply, and the company is responding with new factories, equipment conversions, productivity improvements and flexible manufacturing across technology generations. Third-quarter revenue reached $46.7 billion, and TSMC forecasts approximately 44% revenue growth for 2026 in U.S. dollar terms (a forecast, not an achieved result). Wei described nearly 20 fabrication facilities under development worldwide, including leading-edge manufacturing and advanced packaging projects, and the company expects annual capacity for its N2 technology family to more than double in 2027 (an expectation). Wei said TSMC is expanding 3-nanometer production despite its historical practice of avoiding further expansion once a technology generation reaches its targeted scale. TSMC outlined manufacturing plans in Taiwan, Arizona and Japan, alongside preliminary evaluations in Texas; Wei linked U.S. expansion to customer requests and said manufacturing location can affect pricing. He also acknowledged some shortage in backend packaging capacity, mentioned cooperation with GlobalFoundries, and noted that company teams are examining U.S. data-center construction and electricity availability, since chip deployment depends on functioning infrastructure. Wei also warned that rising component prices and economic uncertainty are challenging consumers and price-sensitive markets.
LG Innotek expects its semiconductor substrate business to improve in 2027. The company is pursuing long-term supply agreements (LTAs) with major technology companies and preparing to enter the high-end AI accelerator market. Under this strategy, it plans to secure customer commitments before expanding production capacity as it seeks to diversify beyond smartphone camera modules. These items remain plans/expectations and do not constitute an implemented capacity expansion.
semiconductor substratesmartphone camera modulesLG InnotekDigiTimes AsiaCapacity Change