NuAxiSemiconductor trade intelligence
LG starts development of hybrid bonder for HBM
What happened
LG Electronics is developing an alpha version of hybrid bonding equipment for HBM, backed by a 14 billion won government project with a 2029 deadline targeting 200nm precision. The project is in proof-of-concept stage and is considered non-competitive for HBM upon its potential launch in three years, with the team also considering logic chip applications. Neutral: This is a long-term R&D project with no near-term impact on HBM supply, demand, or pricing, as commercialized equipment from Besi and others already exists.
Impact and signal
Low impactImpact score: 8/100
Affected components and suppliers
LG Electronics
equipmentR&Dhybrid-bonding
Source and time
Source: The Elec · 1/11/2026 · View original source
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