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Genesem to showoff HBM and hybrid bonding equipment at Semicon Korea
What happened
Fab equipment maker Genesem will showcase its HBM back-end and hybrid bonding equipment at Semicon Korea 2026, targeting 90 billion won in revenue for the year. The company is adapting its vacuum mounter and die recon tools for hybrid bonding, a process expected for future HBM generations, and has seen demand rise for its PKG sorter due to new final test requirements from customers like Nvidia. Neutral: This is a technology showcase and capacity enabler for future HBM production, with no immediate impact on current supply, pricing, or trader inventory decisions.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
HBM2.5D Packaging
Genesem
Source and time
Source: The Elec · 2/11/2026 · View original source
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