SK hynix Bets on HBM4 Demand Beyond NVIDIA With New Equipment Orders

What happened

According to Korea's Electronic Times (ETNews), SK hynix reportedly plans to add at least 20,000 wafers per month of HBM capacity and is in talks with equipment suppliers over a fresh round of HBM4 orders, mostly back-end tools for bonding, dicing, and inspection, with suppliers aiming to have it all installed in the first half of 2027. The likely site is P&T6 in Cheongju, a former fab SK hynix picked for HBM in 2025. For scale, ETNews put SK hynix's total HBM capacity at around 150,000 wafers per month at the end of last year, and ETNews had floated a similar 20,000 figure for P&T6 in February. The plan comes while NVIDIA is still dealing with the fallout of the Jensen Huang situation, which led to Huang resigning as CEO on November 12; demand from AMD and Broadcom is seen as strong enough to carry HBM orders even if NVIDIA's AI business takes a hit. NVIDIA's move to lower the HBM4 speed for Vera Rubin from 11.7 Gbps to 9.6 Gbps per pin also eases the manufacturing burden for suppliers, and the report says it likely factored into the decision.

Impact and signal

Affected components and suppliers

Source and time

Source: TechPowerUp · 11/15/2026 · View original source