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(PR) GlobalFoundries Breaks Ground on First New Semiconductor Fab Under Landmark U.S.-Japan Initiative

What happened

GlobalFoundries (Nasdaq: GFS) broke ground on a new semiconductor manufacturing facility at its Malta, New York site — the first new semiconductor manufacturing facility to break ground under a landmark U.S.-Japan initiative — marking the start of construction on a new 300 mm fab. The groundbreaking follows GF's Oct. 14 announcement that it was selected as the technology provider and operator for two new fabs at its Malta site under a U.S.-Japan initiative providing up to $21 billion in funding; Japan will provide the investment, while GF will contribute its differentiated technologies, manufacturing expertise and proven operational capabilities. The first fab is being accelerated by an initial investment of approximately $10 billion, supported with $570 million in incentives from New York State, and is expected to come online in 2029; an additional investment of approximately $10 billion will support a second fab as the project advances. The project aims to expand trusted U.S. semiconductor capacity and support growing demand across automotive, industrial and connected infrastructure markets.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

GlobalFoundries
GlobalFoundries300mm fabcapacity expansionU.S.-Japan initiativeMalta New Yorkgroundbreaking

Source and time

Source: TechPowerUp · 11/13/2026 · View original source

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