NuAxiSemiconductor trade intelligence

Why TSMC is Turning to GlobalFoundries for CoWoS Interposers

What happened

TSMC is turning to GlobalFoundries for silicon interposers in order to expand advanced packaging capacity and support future customer product schedules. The source does not provide specific expansion volumes, timelines, or further cause details; this is a planned arrangement, and the text does not state that any capacity change has already been implemented or completed.

Impact and signal

Medium impactImpact score: 58/100

Affected components and suppliers

CoWoS interposer

TSMCGlobalFoundries

advanced packagingCoWoSsilicon interposercapacity expansion

Source and time

Source: EE Times Asia · 10/19/2026 · View original source

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Globalfoundries to make silicon interposers for TSMCElectronics Weekly · 10/8/2026
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TSMC reportedly weighs 20% CoWoS price increase as Nvidia Blackwell and Rubin chips put pressure on packaging capacityTom's Hardware · 10/27/2026
[News] TSMC Reportedly Eyes 20% CoWoS Price Hike, Skips Equipment Price Renegotiations Amid AI Demand SurgeTrendForce · 10/26/2026
GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billionTom's Hardware · 10/8/2026

Why TSMC is Turning to GlobalFoundries for CoWoS Interposers

What happened

Impact and signal

Affected components and suppliers

Source and time

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