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Samsung Begins 144 Trillion Won Investment in South Korea’s Chungcheong Region

What happened

Samsung held a groundbreaking ceremony for its Chungcheong Mega Project at the Onyang campus on Nov. 12, unveiling investment plans totaling 144 trillion won to expand production facilities for semiconductors, displays, substrates and batteries. The affiliates' medium- to long-term plans include 60 trillion won from Samsung Electronics, 67 trillion won from Samsung Display, 8 trillion won from Samsung Electro-Mechanics and 9 trillion won from Samsung SDI. Three projects broke ground: Samsung Electronics' advanced packaging fab in Onyang, Samsung Display's production line in Asan and Samsung Electro-Mechanics' AI server substrate plant in Sejong. Samsung Electronics is building a fifth production line at Onyang for advanced high-bandwidth memory (HBM) packaging; foundation work is underway with operations scheduled to begin in June 2028. The Onyang Line 5 facility will house 9,400 pyeong of cleanroom space across three floors, with a total phased investment of 46 trillion won, including 6 trillion won for construction and 40 trillion won for advanced equipment; Samsung plans to package next-generation HBM and other products there and to expand and modernize HBM-related facilities at its existing Cheonan site. Samsung Display will invest 67 trillion won in Asan and Cheonan; its A7 line in Asan, which broke ground last month, will span 170,000 pyeong across three floors, with 5.9 trillion won to produce OLED panels for foldable smartphones, laptops and tablets, targeting mass production in the second half of 2029. Samsung Electro-Mechanics will invest 8 trillion won at Sejong to expand AI semiconductor package substrate capacity, including 4.3 trillion won on a new factory that broke ground last month; the four-story facility will cover 30,000 pyeong with mass production scheduled for September 2028, and the company plans to secure additional nearby land. Samsung SDI will invest 9 trillion won at Cheonan, where its battery mother factory was completed in July last year, equipment operations began that November, and additional equipment is currently being installed. Additionally, 194 domestic semiconductor materials, components and equipment companies plan to invest approximately 18.1 trillion won by 2030, of which 66 companies are investing or preparing to invest 4.4 trillion won in the Chungcheong region, with the investments expected to create approximately 23,000 jobs. All facilities remain planned or under construction and are not yet operational.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

advanced high-bandwidth memory (HBM) packagingOLED panelsAI semiconductor package substratesbatteries
Samsung ElectronicsSamsung DisplaySamsung Electro-MechanicsSamsung SDI
SamsungChungcheong Mega ProjectHBM advanced packagingOLEDpackage substratecapacity expansion

Source and time

Source: The Elec · 11/12/2026 · View original source

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