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Amkor breaks ground on new building in South Korea

What happened

Amkor broke ground on 29 October for an expansion of its campus in Gwangju, South Korea, to meet rising demand for advanced packaging for AI and accelerated computing. The Gwangju campus has been part of Amkor's Korean operations since the 1990s and already has about 152,000 square metres of manufacturing space, with capabilities including wafer bumping, FCBGA, fcCSP, system-in-package, wafer-level packaging and test. The expansion is part of a USD 1.3 billion agreement with Nvidia, which takes Amkor's multi-year agreements with Nvidia in Arizona and South Korea to a total of USD 3 billion; under the agreements, Nvidia makes prepayments that, according to Amkor, align its manufacturing capacity with Nvidia's long-term growth plans. Amkor is also expanding in Songdo, home to its global R&D centre working on technologies such as high-density fan-out, 2.5D TSV, FCBGA and system-in-package. Amkor does not say how large the new building will be, how much it is investing in it or when it will be completed.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

advanced packaging
expansiongroundbreakingGwangjuSouth Koreaadvanced packagingAI

Source and time

Source: Evertiq · 11/11/2026 · View original source

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