ACCM expands US capacity for AI substrate materials that don’t rely on T-glass

What happened

US materials company Advanced Chip and Circuit Materials (ACCM) is expanding its manufacturing capacity in La Crosse, Wisconsin, for its Celeritas family of dielectric materials for AI hardware. According to an ACCM press release, its prepreg and build-up capacity will reach 87 million square feet (about 8.1 million square metres) a year this month, and new laminate capacity of 20 million square feet (about 1.9 million square metres) a year comes online in January 2027; larger expansions of both are planned for the second half of 2027. The source does not state the cause of the expansion. The materials none of which depends on T-glass or quartz fabric, which are in short supply, are made on a raw material supply chain independent of the conventional CCL chain, with lead times of typically three weeks, per ACCM. The expansion covers four segments: ultra-low-loss materials without woven glass for 224G-class switch and backplane designs, low and negative expansion laminates for large accelerator boards, core materials for IC substrates and packages, and build-up materials. ACCM says the materials are halogen-free and PFAS-free, and can be processed on the lamination, drilling and plating equipment PCB makers already use. The company is also opening a second materials characterisation laboratory at the Wisconsin facility and has not disclosed the size of the investment or how its capacity compares with demand.

Impact and signal

Affected components and suppliers

Source and time

Source: Evertiq · 11/9/2026 · View original source