Terafab Wants to Become One of the Largest Memory Makers by 2032

What happened

According to Nikkei, a procurement team from Terafab, the chip venture between Tesla and SpaceX, visited Japan and walked local equipment makers through its purchase plans, targeting 1 million wafers per month from 2032 onward, with around 700,000 going to memory chips and 300,000 to logic; Nikkei's headline puts that at 40 times the output of Japan's Rapidus. The same split first surfaced in a Jiji Press report last month, which said a single Texas plant would handle both memory and logic, with a pilot fab completed as early as July 2027. Intel is reportedly helping with logic using its 2 nm and 1.4 nm-class technology, while a Taiwanese company — possibly Nanya, though nothing is confirmed — has been floated as a technology partner for memory. For context, Samsung's entire DRAM output was estimated at 650,000 to 700,000 wafers a month late last year, while SK hynix was at about 550,000 earlier this year and hopes to reach roughly 1 million by 2030 or 2031; it isn't clear whether Terafab's memory figure covers DRAM alone or also includes NAND, so the Samsung comparison is a loose one. Musk put "big error bars" on reaching volume production by Q3 2028 on an October SpaceX call, with a first SRAM test chip planned for mid-2027 at Terafab's Austin research lab. All of this remains a plan/rumor and is unconfirmed.

Impact and signal

Affected components and suppliers

Source and time

Source: TechPowerUp · 11/9/2026 · View original source