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EVG and Teramount collaborate on packaging technologies for PICs
What happened
EV Group and Teramount have announced a collaboration to develop wafer-level packaging solutions for silicon photonics using EVG's nanoimprint lithography and Teramount's PhotonicPlug technology. The partnership aims to address the fiber-to-chip packaging bottleneck, a key challenge in scaling photonic integrated circuits (PICs) for datacom and telecom. Neutral: This is a long-term R&D milestone with no immediate impact on component supply, pricing, or trader inventory decisions.
Impact and signal
Low impactImpact score: 12/100
Affected components and suppliers
硅光芯片光互连封装
EV GroupTeramount
packagingR&Dphotonics
Source and time
Source: Semiconductor Today · 3/8/2022 · View original source
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