Element 6 and Entegris to bring diamond to GPU and RF packaging

What happened

Element Six (E6), the industrial synthetic diamond specialist, and materials supplier Entegris plan to accelerate the integration of diamond-enabled thermal management solutions into advanced packaging for GPU and RF devices. The source attributes the background to AI demands driving rapid increases in chip power density, making thermal management a critical determinant of semiconductor performance, efficiency and scalability, with conventional cooling technologies approaching practical limits. Synthetic diamond possesses the highest thermal conductivity of any material at room temperature, but realizing its potential requires innovative approaches to bonding diamond with semiconductor wafers and dies while minimizing thermal boundary resistance. The collaboration combines E6's expertise in engineered synthetic diamond materials with Entegris' leadership in semiconductor materials science and surface engineering to develop scalable solutions, with a focus on enabling scale, cost-effective wafer-level and heterogeneous integration approaches that reduce manufacturing complexity and support next-generation GPU and RF device performance requirements. The companies plan to offer a portfolio including engineered surfaces meeting customized specifications and bonded diamond technologies for both polycrystalline and single-crystal diamond platforms. The collaboration is a plan; the source does not state a timeline.

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Source and time

Source: Electronics Weekly · 11/4/2026 · View original source