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RT NEWS: China’s Hunan Titan Future Technology has unveiled the country’s first 12-inch polycrystalline #SiC substrate, designed to tackle heat buil...

What happened

According to a news repost by TrendForce, China's Hunan Titan Future Technology has unveiled the country's first 12-inch polycrystalline SiC (silicon carbide) substrate, designed to tackle heat buildup in high-power AI chips. The source states that the product is already in small-batch trials. No production volumes, timelines, or supply impact figures are provided beyond these facts.

Impact and signal

Medium impactImpact score: 40/100

Affected components and suppliers

12-inch polycrystalline SiC substrate
Hunan Titan Future Technology
SiC substrate12-inchpolycrystallineAI chipssmall-batch trials

Source and time

Source: TrendForce Official (Market Data) · 10/29/2026 · View original source

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