Nvidia Unveils Next-Generation CPO Technology

What happened

Nvidia unveiled next-generation co-packaged optics (CPO) technology, optics-on-interposer (OOI), at SEMICON West 2026 in San Francisco on Oct. 13. The technology moves optical engines from the organic package substrate onto the interposer carrying computing chips; by eliminating the organic substrate from the electrical signal path, it can increase bandwidth density and reduce power consumption, and Nvidia said it has developed a prototype. Nikola Nedovic, a principal researcher at Nvidia, presented the research. Nvidia also unveiled DWDM technology, demonstrating eight wavelengths operating at 32Gb/s each, delivering 256Gb/s per fiber. Both technologies remain in the research stage; Nedovic said the company is proposing and evaluating technologies for future products while addressing challenges preventing commercialization. Nvidia has already deployed CPO in mass-produced products including Quantum-X Photonics and Spectrum-X Photonics: Quantum-X is used in InfiniBand networks connecting Blackwell Ultra-based GB300 NVL72 racks, while Spectrum-X is deployed in Ethernet switches for the Vera Rubin platform. Nvidia has established a CPO manufacturing ecosystem: TSMC provides its COUPE silicon photonics packaging technology and handles contract manufacturing alongside SPIL; Coherent, Lumentum and Sumitomo Electric manufacture external laser source modules; Corning, Senko, Browave and TFC supply optical fibers and related components; Foxconn and Fabrinet handle cooling and final testing.

Impact and signal

Affected components and suppliers

Source and time

Source: The Elec · 10/15/2026 · View original source