[News] NVIDIA Unveils Next-Gen CPO Prototype With Optics on Silicon Interposer, Targets Higher Bandwidth Density

What happened

At SEMICON West 2026, under the theme "Optical Integration for the Next Generation of AI," NVIDIA presented its next-generation co-packaged optics (CPO) technology, including an optics-on-interposer (OOI) prototype that moves optical engines from the organic package substrate onto the silicon interposer carrying the computing chips; according to The Elec, this eliminates the organic substrate from the electrical signal path, allowing signals to travel through shorter, fine-pitch interposer connections that could increase bandwidth density and reduce power consumption. NVIDIA also demonstrated DWDM technology that, according to Wccftech, combines eight wavelengths operating at up to 32 Gb/s each, delivering an aggregate bandwidth of 256 Gb/s per fiber. Both technologies remain in the research stage with no commercialization timeline announced, and NVIDIA said it is evaluating them for potential future products. Looking ahead, NVIDIA plans to extend optical interconnects with its Kyber NVL1152 architecture, which will connect eight racks into a single 1,152-GPU NVLink domain and support the Feynman platform, which Wccftech says is expected to arrive in 2028. On existing products, in May 2026 NVIDIA announced that its Spectrum-X Ethernet Photonics switches had entered full production, integrating 200Gb/s SerDes with CPO technology for the Vera Rubin platform, with CoreWeave, Lambda, and Oracle Cloud Infrastructure among early adopters; its manufacturing ecosystem includes TSMC for silicon photonics fabrication, SPIL for chip-scale packaging, assembly, and testing, TFC for laser die packaging and reliability validation, and Foxconn for integrating Spectrum-X Photonics switches into complete networking systems, plus Coherent, Lumentum, and Sumitomo Electric for external laser source modules, Corning, Senko, and Browave for optical fibers and related components, and Fabrinet for cooling and final testing.

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Source and time

Source: TrendForce · 10/21/2026 · View original source