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GlobalFoundries tops out Dresden expansion
What happened
GlobalFoundries held the topping-out ceremony for the SPRINT expansion project on October 9, marking a milestone in its EUR 1.1 billion expansion in Dresden. The expansion is expected to raise the site’s annual capacity to more than one million 300mm wafers by the end of 2028; Dresden currently can produce up to 950,000 wafers per year, meaning the expansion adds at least around 5 percent capacity. Construction has been completed on schedule and on budget, and the project is supported by the EU, the German federal government and the Free State of Saxony under the European Chips Act.
Impact and signal
Medium impactImpact score: 60/100
Affected components and suppliers
300mm wafers
GlobalFoundries
Source and time
Source: Evertiq · 10/12/2026 · View original source
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