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GlobalFoundries tops out Dresden expansion

What happened

GlobalFoundries held the topping-out ceremony for the SPRINT expansion project on October 9, marking a milestone in its EUR 1.1 billion expansion in Dresden. The expansion is expected to raise the site’s annual capacity to more than one million 300mm wafers by the end of 2028; Dresden currently can produce up to 950,000 wafers per year, meaning the expansion adds at least around 5 percent capacity. Construction has been completed on schedule and on budget, and the project is supported by the EU, the German federal government and the Free State of Saxony under the European Chips Act.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

300mm wafers
GlobalFoundries

Source and time

Source: Evertiq · 10/12/2026 · View original source

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