NuAxiSemiconductor trade intelligence

JCET opens 3D packaging plant to target AI power modules, CPO demand

What happened

JCET opened a new advanced manufacturing facility in Jiangyin to focus on 3D packaging for AI computing, power modules, and CPO. This expansion strengthens JCET's position in advanced packaging to meet growing data center demand. Watch for capacity expansion trends in advanced packaging benefiting AI and optical module supply chains.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

3D PackagingPower ModulesCPO

JCET长电科技

capacityAI3D-packaging

Source and time

Source: DigiTimes Asia · 6/6/2026 · View original source

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JCET opens 3D packaging plant to target AI power modules, CPO demand

What happened

Impact and signal

Affected components and suppliers

Source and time

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