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VisIC launches top-side-cooled isolated package
What happened
VisIC Technologies has launched a new top-side-cooled isolated package, the V22TG D3GAN, for its gallium nitride transistors, with samples available in Q1 2024. This represents a packaging innovation for GaN power devices, potentially improving thermal performance in applications like automotive and industrial. Neutral: This is a standard product launch with no immediate impact on supply, demand, or pricing for the broader semiconductor market.
Impact and signal
Low impactImpact score: 15/100
Affected components and suppliers
GaN TransistorsPower Conversion Devices
VisIC Technologies Ltd
packagingganpower-electronics
Source and time
Source: Semiconductor Today · 11/14/2023 · View original source
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