NuAxiSemiconductor trade intelligence
[News] Behind TSMC’s High-NA EUV Deferral: Low-NA Stays Strong, Customer Landscape Shifts, and ASML Quietly Pivots
What happened
TSMC defers adoption of ASML's High-NA EUV lithography tools for its A13 node (~2029), citing cost and effective extension of current Low-NA EUV capabilities. The decision reflects a focus on multi-patterning techniques and optical shrinks for near-term scaling, impacting the timeline for next-generation equipment demand. Neutral: No immediate supply/demand or price impact for electronic components; a long-term technology roadmap shift.
Impact and signal
Low impactImpact score: 15/100
Affected components and suppliers
EUV Lithography Systems
roadmapcapextechnology
Source and time
Source: TrendForce · 4/30/2026 · View original source
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