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QPT files patent for die attach process that boosts waste heat removal by up to 15x
What happened
UK-based Quantum Power Transformation (QPT) has filed a patent for a die attach process named 'qAttach' that claims to improve waste heat removal from power dies by up to 15x. This addresses a critical thermal challenge in high-power semiconductor packaging, particularly for GaN-based applications like motor controls. Neutral: This is a long-term R&D milestone with no immediate impact on component supply, pricing, or inventory, and is not a signal for trading action.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
GaN Power DevicesPower Semiconductor Packaging
Quantum Power Transformation (QPT) Ltd
packagingthermal-managementrd-milestone
Source and time
Source: Semiconductor Today · 12/2/2024 · View original source
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