NuAxiSemiconductor trade intelligence
CEA-Leti and NcodiN partner to industrialize 300mm silicon photonics for bandwidth-hungry AI interconnects
What happened
CEA-Leti and startup NcodiN announced a collaboration to industrialize NcodiN's optical interposer technology on a 300mm silicon photonics platform, targeting AI interconnect applications. This is a long-term R&D effort focused on future high-bandwidth computing needs. Neutral: This is a pre-commercial research milestone with no immediate impact on component supply, pricing, or trader decisions.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Silicon PhotonicsOptical Interposer
CEA-LetiNcodiN
R&DpartnershipAI-interconnects
Source and time
Source: Semiconductor Today · 3/12/2026 · View original source
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