[News] Industry Weigh 825–900 μm HBM Thickness for 20-High Stacks, Potentially Slowing Hybrid Bonding

What happened

JEDEC members are discussing easing the HBM package thickness standard to 825-900μm for future 20-high stacks like HBM4E/HBM5, up from the current 775μm for HBM4. This is driven by the technical difficulty of thinning 20-layer stacks and the increased thickness from TSMC's SoIC packaging technology. Neutral: This is a long-term technical specification discussion with no immediate impact on component supply, pricing, or production.

Impact and signal

Affected components and suppliers

Source and time

Source: TrendForce · 3/5/2026 · View original source