Airbility and Schübeler signed an MoU to jointly develop next-generation EDF propulsion systems for eVTOL platforms, aiming to expand Korean technology into the European market.
Kymeta is integrating its satellite communication technology into Red Cat's Variant 7 unmanned surface vessel to support autonomous maritime operations. This partnership aims to enhance connectivity resilience through multi-orbit integration. Impact: Neutral (no specific price or supply data provided).
TASKING integrates large language models and agentic AI into its embedded toolchain to automate verification and validation tasks for safety-critical systems like automotive and aerospace. This development represents a significant technological shift in software engineering but lacks immediate supply chain or pricing data.
Auras Technology reported record Q1 2026 revenue of NT$49.038 billion, up 110% YoY, and dismissed market rumors regarding a design tweak on Nvidia's Vera Rubin cooling system. The company expects continued quarter-over-quarter growth in 2026.
Rohm warns of delays in a potential three-way alliance with Toshiba and Mitsubishi Electric due to integration hurdles and slim chances of success. Denso's failed bid for Rohm highlights the challenges in consolidating Japan's power semiconductor supply chain amidst vertical integration efforts by automakers like Toyota.
CSA Catapult is providing SiC power modules for Project SONATA, an initiative funded by the ATI Programme to develop on-aircraft electric taxi systems with regenerative braking.
Samsung, Intel, and TSMC have initiated 2nm mass production and are outlining roadmaps for 1.4nm nodes. TSMC focuses on specialized nodes, Samsung on yield, and Intel on aggressive GAA and High-NA EUV adoption.
B&H Photo slashed the price of Corsair Pro DDR5 32GB to $329.99, a $70 discount from $399.99, currently the cheapest DDR5 kit on the market. Despite general RAM price hikes driven by AI demand, this specific kit offers a temporary price dip.
This specific DDR5 kit sees a temporary price dip, though manufacturers warn of future price increases.
Farnell announced immediate availability of Microchip's new PIC32CM PL10 MCUs, featuring Arm Cortex-M0+ cores and 5V operation. These devices target industrial and consumer applications, offering pin-to-pin compatibility for 8-bit upgrades. The launch represents a neutral market impact as it introduces a new product without immediate supply constraints.
HBF (High Bandwidth Flash) is a new 3D flash technology inspired by HBM to improve AI efficiency. This represents a long-term R&D trend rather than an immediate supply change.
Quantum Diamonds deployed a production system at Eurofins EAG Labs for failure analysis of <5nm and 3D packaging using NV centers in synthetic diamond. This tool offers non-destructive testing with <1μm resolution. The launch of this quantum sensing technology represents a new R&D milestone in semiconductor failure analysis but has no immediate impact on component supply or pricing.
ams OSRAM divested its CMOS Image Sensor business to indie Semiconductor for EUR 40 million to focus on AI photonics. This strategic restructuring aims to accelerate balance sheet deleveraging and has no immediate impact on spot prices.
Qualcomm's Snapdragon 8 Elite Gen 6 Pro SoC is reportedly priced above $300 due to TSMC's 2nm process costs. The total bill of materials with LPDDR6 and UFS 5.0 exceeds $600, pressuring smartphone margins. Bullish for Qualcomm pricing, bearish for OEM margins.
Septentrio launches the mosaic-G5 P6 multi-frequency GNSS module, featuring AIM+ anti-jamming technology and compact dimensions for UAVs and robotics.
SkyWater shareholders approved the $1.8 billion merger with IonQ, granting IonQ direct access to a US-based trusted foundry for quantum processors. The deal is expected to close in Q2/Q3 2026, potentially accelerating IonQ's hardware development.
Infineon Technologies won a US International Trade Commission ruling against Chinese rival Innoscience, finding infringement of GaN-related patents. The ITC upheld the preliminary ruling, potentially restricting Innoscience's market access.
Innoscience，利多英飞凌GaN市场份额。
Supermicro launched new 2U and 5U server platforms based on Arm's proprietary AGI CPU, featuring up to 136 Neoverse V3 cores and 6TB of DDR5 memory for high-density Agentic AI workloads. These systems offer flexible I/O configurations with PCIe 5.0/6.0 lanes to compete with x86 performance-per-watt. The launch signals increased demand potential for DDR5 and Arm ecosystem components.
SK hynix is testing Intel's EMIB 2.5D packaging technology for its HBM to bypass TSMC's CoWoS capacity constraints. This partnership aims to secure supply and validate Intel's advanced packaging capabilities in the high-bandwidth memory market.
PCL Technologies acquired Pingood Group to secure precision plastic and metal parts for CPO components. The deal aims to support optical and electronic packaging for data centers and AI applications. Bullish for precision parts suppliers.
APLEX secured a charging-pile order from a US customer for Q4 mass production and anticipates medical product contributions starting in 2027. The company is focusing on smart manufacturing, transportation, and healthcare for 2026, with stainless steel IPCs gaining traction in industrial sectors. Bullish outlook for future IPC demand and charging infrastructure supply.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |