NuAxi Stream - Real-Time Semiconductor Intelligence

Thu, Oct 15

16:12Impact score 45
Skeleton Technologies raises Siemens-led round to expand US production
Supercapacitor maker Skeleton Technologies has raised a new investment round led by Siemens, valuing the company at more than USD 1 billion. According to a Skeleton press release, the round is a "nine-digit" sum, meaning at least USD 100 million, but the exact amount has not been disclosed. The money will mainly go towards building up manufacturing in the US, including its own cell production, for power systems in AI data centres. The company plans to invest more than USD 200 million in scaling up operations and R&D in Silicon Valley, working directly with hyperscalers; the US expansion includes plans for domestic cell manufacturing, giving Skeleton a full US value chain from cells to complete systems. The company says its supercapacitor cells based on its own Curved Graphene material, combined with power electronics and controls, even out load fluctuations from GPU clusters that switch power states within milliseconds, and can deliver up to 40% energy savings and double-digit improvements in GPU performance. Siemens supported Skeleton's expansion in 2023, and Siemens Digital Industries designed and automated the company's SuperFactory in Leipzig, Germany; the two companies will now develop and commercialise products for AI data centres together. Skeleton has not disclosed the size of the round, how large a stake Siemens is taking, or where and when the US cell production will start.
supercapacitorssupercapacitor cellspower electronicsSkeleton Technologies, SiemensEvertiqPartnership/M&A
08:00Impact score 50
Star Asia Vision targets digital out-of-home market with new products, Nichia partnership
Star Asia Vision (SAVC), a display and systems integrator under Taiwan-Asia Semiconductor, is focusing on growth in the digital out-of-home (DOOH) advertising market by expanding software-hardware integration and high-end customization, while deepening its strategic partnership with global LED materials leader Nichia. The company is optimistic about growth momentum across its three main product lines and expects project expansions in 2027 to drive operating growth. The partnership deepening and expansion plans are planned/expected in nature; no realized capacity or financial figures are reported.
LEDStar Asia Vision, Taiwan-Asia Semiconductor and 3 totalDigiTimes AsiaPartnership/M&A

Wed, Oct 14

23:00Impact score 55
New motherboards, old RAM, plenty of life left in yesterday's PCs
According to a report published by The Register on Wednesday, 14 October 2026 at 16:00 UTC, Gigabyte recently announced new motherboards that use DDR4 RAM, a standard that launched in 2014. For AM4 processors, Gigabyte offers the new B450M H ARGB with two DDR4 slots and the B550 X-Eagle with four slots, while Intel-platform buyers can get the B760M Aorus Elite. The article states this is partly due to the current price rises and component shortages induced by large-scale, cloud-based LLMs. In the People's Republic of China, several vendors sell new DDR3 motherboards for circa 15-year-old server CPUs, such as Huananzhi's X79-4D or X79 Supreme, or the Machinist X79 V2.82H, all using Intel's LGA-2011 socket, which launched in 2011. The DDR5 standard was agreed in 2020, with mainstream PC adoption following in 2021. The article also argues that Linux lets older hardware remain in service, making second-hand kit more usable than ever.
DDR4DDR3DDR5Gigabyte, AMD and 5 totalThe Register
21:59Impact score 45
RECOM and CELUS Partner to Bring RECOM Power Designs to the CELUS Design Platform
RECOM Power, an Austrian designer and manufacturer of power conversion solutions, and CELUS, a cloud-based electronics design automation company, announced a partnership that brings a first set of RECOM power designs to the CELUS Design Platform. The partnership covers 37 RECOM CUBOs (reusable circuit modules on the platform, also known as Digital Datasheets): 29 are built around RECOM power ICs for isolated and switching DC/DC conversion, corresponding to RVP001 (4 CUBOs), RVP003 (9), RVP003S (1), RVP010 (6), RVP6501 (1), RVPW011 (1), RVPW012 (1), RVPW014 (4), RVPW015 (1) and RVPW016 (1) reference designs; the remaining 8 cover RECOM's R-78 switching regulators (6 CUBOs) and RAC AC/DC converter modules (2 CUBOs). The partnership arrives alongside the platform's new Power Nets capability, in which engineers define supply nets with voltage and direction and the Design Assistant proposes only solutions whose power specifications match those nets; designs continue through the platform's integrations with Altium Designer, KiCad, Siemens EDA and Autodesk Fusion. The CELUS Design Platform is used by more than 30,000 engineers in over 100 countries, with a library of more than 560,000 components. This is an announced partnership; the source does not state any price or supply impact.
power conversion solutionsisolated and switching DC/DC conversionR-78 switching regulatorsRECOM Power, CELUSEE JournalPartnership/M&A
21:56Impact score 0
TDK introduces new dual-die, stray-field robust motor position sensor for ASIL D fail operational applications
TDK introduces the Micronas HAR 3025 dual-die stray-field robust motor position sensor with redundant design, ASIL D ready (SEooC) per ISO 26262:2018 and stray-field compensation per ISO 11452-8:2015; samples are available now and start of production is planned for the first half of 2027. The source does not state the cause.
EE Journal
21:47Impact score 45
Siemens’ Tessent ecosystem enables direct test pattern execution via PCIe and USB
Siemens announced Tessent™ Silicon Executable (TSE) software, a standalone application designed to translate test patterns and apply them directly onto high-speed interfaces and protocols (PCIe and USB per the title), seamlessly delivering test data from the test equipment ecosystem to the Tessent In-System Test on-chip hardware. This is a product launch announced by Siemens with an ecosystem/collaboration character: TSE launches in collaboration with automated test equipment (ATE) providers Advantest and Teradyne. Advantest stated it is integrating Siemens TSE into its V93000 platform with Link Scale and extending it into pre-silicon verification and DFT lab engineering with SiConic; Teradyne stated it has integrated Tessent Silicon Executable into its UltraPort instrument for UltraFLEXplus and claims to be the first tester company to give customers a standard path to run SSN over PCIe for PCIe Gen 6 interfaces, which it says dramatically improves performance and reduces test times. Ankur Gupta of Siemens EDA cited silicon complexity, multi-die and new transistor technology driving growth in test content as the driver. The source provides no quantitative price or market-impact data.
Tessent Silicon Executable (TSE) softwareTessent In-System Test on-chip hardwareSiemens, Advantest and 3 totalEE JournalPartnership/M&A
21:31Impact score 0
STMicroelectronics reveals high-accuracy two-in-one altitude and underwater depth sensor for wearables and sports cameras
STMicroelectronics revealed the LPS27DEWO, a two-in-one MEMS sensor combining altitude and underwater-depth monitoring over 50 meters in a single device that saves space, simplifies circuitry, and trims bill-of-materials costs in wearables and outdoor equipment. With two selectable full scales in one compact package, it suits sports cameras, smart rings, smartwatches, and other outdoor and underwater equipment. Its extended underwater pressure range of 6060hPa provides accurate information for recreational and enthusiast divers when ascending from below 40 meters – the critical depth for decompression – and the sensor remains robust at water-pressure depths of up to 110 meters. It features a 2.7mm x 2.7mm 10-lead LGA footprint in a 1.7mm-high cylindrical metal lid package, ±0.5% accuracy at full-scale, and a new black potting gel that eliminates light-induced error; it supports 1.2V I2C, SPI, and I3C digital interfaces with very low operating current of just 1.7µA at 3.8Pa.
MEMS altitude and underwater depth sensorSTMicroelectronicsEE Journal
16:38Impact score 10
ASE expands PowerSiP platform to improve AI data center power efficiency
ASE Technology has introduced a 3D system-in-package (SiP) solution for vertical voltage regulator modules (VRMs) in AI data centers. This expansion aims to enhance power efficiency and support high-density computing infrastructure.
PowerSiP3D SiPVRMASE Technology Holding Co.DigiTimes AsiaProduct Launch

Tue, Oct 13

23:29Impact score 20
(PR) Bolt Graphics Achieves Silicon Bring-up of Zeus Test Chip, Opens Taipei Office
Fabless semiconductor startup Bolt Graphics announced the bring-up of its Zeus test chip and the opening of a Taipei office to manage manufacturing partnerships as it prepares for production of its first fully commercial GPU, which is planned for general availability in 2028 (a plan, not an achieved result). Built on Bolt's rendering technology architecture, the 12 nm TSMC test chip accelerates electromagnetic simulation and path tracing in software and hardware, enabling full-product simulation without physical prototypes. Bolt stated its GPU exceeds performance expectations, validating the chip architecture, and that it has proven complex physics algorithms can be executed on fixed-function hardware, accelerating training of advanced robotics and world models. The source does not state the cause (this is a company progress announcement, not a price or supply change).
Zeus test chipGPUBolt Graphics, TSMCTechPowerUp
13:04Impact score 0
HV hot-swap controller for digital power-path protection
Infineon has introduced the XDP8HD40S-1 high-voltage hot-swap controller designed for digital power-path protection and monitoring in next-generation AI server power architectures operating at ±400 V and 800 VDC, with samples targeted for availability in the second quarter of 2027.
Electronics Weekly
04:53Impact score 40
TI Unveils High-Speed ADC for AI Data Center Monitoring
Texas Instruments has introduced the ADC34DSO75, a 3-gigasamples-per-second (GSPS) analog-to-digital converter (ADC) designed to detect transient power events in AI data centers, enabling continuous, low-power, event-based remote monitoring at nanosecond resolution, and presented it alongside new high-voltage power management and clocking solutions at the 2026 Open Compute Project (OCP) Global Summit. TI also introduced the LMI800PS, an 800V isolated hot-swap controller that integrates functions previously implemented using five separate integrated circuits, combining an isolated bias supply and PMBus telemetry in a single package to reduce board area by more than 60%; it supports both ±400V and 800V distribution architectures with 5kVrms reinforced isolation and more than 8mm of creepage distance. TI also highlighted the LMK6B bulk acoustic wave (BAW)-based oscillator, which delivers 9.6fs jitter at 625MHz, supporting timing accuracy and signal integrity in high-speed networking systems as data transmission rates increase toward 3.2Tbps. In addition, TI will demonstrate 800V DC power solutions for NVIDIA's MGX AI Factory Ecosystem, including hot-swap protection and 800V-to-12V and 800V-to-6V DC/DC conversion, the latter incorporating gallium nitride (GaN) power stages, and has scheduled a technical presentation on 800V data center DC/DC design considerations, topology comparisons, and trade-offs for October 15, 2026, at the OCP Global Summit in San Jose, California.
ADC (analog-to-digital converter)hot-swap controllerBAW oscillatorTexas Instruments, NVIDIAPower Electronics News

Mon, Oct 12

22:32Impact score 0
(PR) INNO3D Announces AGS-4UMGX-R1 4U GPU Server With NVIDIA MGX
INNO3D announces the AGS-4UMGX-R1 4U GPU Server based on the NVIDIA MGX platform, featuring dual Intel Xeon 6 processors, support for up to 32 DDR5 RDIMMs, up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs, and an NVIDIA ConnectX -8 SuperNIC with eight 400 Gbps QSFP ports for AI training, AI inference, large language models (LLMs), digital twins, and high-performance computing (HPC) workloads.
AGS-4UMGX-R1 4U GPU ServerNVIDIA MGXdual Intel Xeon 6 processorsINNO3D, NVIDIA and 3 totalTechPowerUp
22:30Impact score 10
GlobalFoundries unveils 7nm-class FDX Fusion node — comes 7 years after firm abandoned FinFET
GlobalFoundries launches 7nm-class FDX Fusion node with double density of 22FDX, targeting automotive and edge AI markets for 2028 production.
FD-SOIRF transistorsSensorsGlobalFoundriesTom's HardwareProduct Launch
20:00Impact score 25
TI unveils new ADC to enable nanosecond-level telemetry and minimize downtime in AI data centers
On Oct. 12, 2026, Texas Instruments (TI) debuted new products at the Open Compute Project (OCP) Global Summit, including the ADC34DSO75, described as the industry's first ADC enabling 24/7, low-power, event-based remote monitoring at nanosecond resolution (a 3-gigasamples-per-second ADC, thousands of times faster than current solutions per TI), the LMI800PS, described as the industry's first 800V isolated hot-swap controller (replacing a discrete solution requiring five integrated circuits with a single package, reducing board area by more than 60%), and the LMK6B, a bulk acoustic wave-based oscillator delivering 9.6fs jitter at 625MHz. TI states these analog solutions address data center operators' challenges around power instability, inadequate real-time monitoring and signal degradation as AI workloads increase, and TI is also showcasing 800VDC power solutions in NVIDIA's MGX AI Factory Ecosystem. This is a product launch news item with no price or capacity change.
analog-to-digital converter (ADC)isolated hot-swap controllerbulk acoustic wave (BAW)-based oscillatorTexas InstrumentsOfficialTI Newsroom
16:50Impact score 60
GlobalFoundries tops out Dresden expansion
GlobalFoundries held the topping-out ceremony for the SPRINT expansion project on October 9, marking a milestone in its EUR 1.1 billion expansion in Dresden. The expansion is expected to raise the site’s annual capacity to more than one million 300mm wafers by the end of 2028; Dresden currently can produce up to 950,000 wafers per year, meaning the expansion adds at least around 5 percent capacity. Construction has been completed on schedule and on budget, and the project is supported by the EU, the German federal government and the Free State of Saxony under the European Chips Act.
300mm wafersGlobalFoundriesEvertiqCapacity Change
07:41Impact score 25
Vertiv 2.3MW CDU Meets NVIDIA DSX Ready Requirements
Vertiv said on Oct. 8 that its 2.3-megawatt CoolChip coolant distribution unit (CDU) model meets the requirements of NVIDIA's DSX Ready CDU program. The NVIDIA DSX Ready program allows operators building AI factories to identify power and cooling products that meet relevant requirements for NVIDIA DSX; for CDU suppliers, individual products are evaluated using the NVIDIA CDU self-qualification suite to determine whether they meet the applicable functional requirements. Because the verification is conducted by the suppliers themselves, customers adopting the products must separately evaluate whether a CDU meets the design, system configuration, and operational requirements of their facilities. The 2.3MW Vertiv model is part of Vertiv's liquid-to-liquid CDU portfolio, supports direct-to-chip (D2C) cooling and rear-door heat exchanger applications, and is designed for installation at the end of a rack row or along the perimeter of a data center room. Other CDU suppliers with products that have received NVIDIA DSX Ready certification include LG Electronics, LiquidStack, and Schneider Electric, in addition to Vertiv.
2.3MW CoolChip coolant distribution unit (CDU)VertivThe Elec

Sun, Oct 11

21:15Impact score 75
Russia's Yandex bot traffic nearly eliminated overnight after Ukraine drone strikes cripple multiple of 'Russia's Google' data centers
Ukraine drone strikes Yandex data centers, knocking out 84 services and reducing network traffic to 30%. This is a retaliatory measure against Moscow's attacks on Kyiv infrastructure.
关注
Major disruption to Russian cloud services.
Data CentersServersYandex, CloudflareTom's HardwareDisaster/Disruption

Fri, Oct 9

22:33Impact score 10
Diodes Incorporated Showcases Analog and Power Solutions for Efficient Automotive, Data Center, and Industrial Systems at electronica 2026
Diodes Incorporated (Nasdaq: DIOD) announced on October 9, 2026 that it will exhibit at electronica (November 10–13) for the first time, at Hall C6, Booth 211. The company will showcase its expanding analog and power portfolio under the theme "More than diodes," with four demonstration platforms covering mains-to-48V conversion, 48V-to-lower-voltage conversion, motor control, and circuit protection, targeting automotive, data center, and industrial applications. The 48V power tree demonstration will illustrate power conversion from a 48V input to 12V and then to lower-voltage rails including 5V and 3.3V. Diodes will also use its presence at electronica 2026 to unveil the latest in power-conversion technology addressing the requirements of data center and AI computing infrastructure. This is a trade-show exhibition/product showcase plan with no price, capacity, or supply-demand changes reported.
analog and power solutions48V power conversionmotor controlDiodes IncorporatedElectronics Sourcing
21:00Impact score 30
Navitas, Microchip Develop 800V AI Data Center Reference Design
Navitas Semiconductor and Microchip Technology have developed an 800V DC-to-6V DC reference design for AI data center rack power systems, based on the Open Compute Project (OCP) 800 V DC architecture. The platform combines Navitas GaNFast™ gallium nitride power devices with Microchip digital power control and hardware security technologies. The primary power stage uses 16 NV6034 devices, each rated at 650 V with 17 mΩ on-resistance, in a stacked half-bridge configuration, with the GaN FETs in a DFN 8×8 mm dual-side-cooled package. Control uses Microchip's dsPIC33AK256MPS306 family digital signal controller (200 MHz 32-bit processor, double-precision floating-point unit, 78 ps high-resolution PWM, and 12-bit ADCs operating at up to 40 MSPS). The platform targets peak efficiency of up to 96% at full load while switching at 1 MHz, with a stated power density of 2,100 W/in³; the architecture directly converts 800 V DC to 6 V DC, combining the conventional 800 V-to-50 V and 50 V-to-6 V stages into a single converter, in an implementation approximately 20% thinner than a mobile phone and intended for close integration with GPU boards. Security is integrated through Microchip's TA100 CryptoAuthentication™ device, and the dsPIC33AK platform also supports cryptographic functions associated with CNSA Suite 2.0 post-quantum cryptography algorithms. The reference platform will include evaluation hardware, software, and design documentation, and will be showcased at Microchip's OCP Event in San Jose, California, from October 12 to 15, 2026.
GaNFast gallium nitride power devicesdsPIC33AK digital signal controllerTA100 CryptoAuthentication deviceNavitas Semiconductor, Microchip TechnologyPower Electronics News
15:29Impact score 0
Practical design for a multi-output flyback converter with improved cross-regulation
A technical article by Joan Mampel, applications engineer at Monolithic Power Systems (MPS), presents a practical design combining a stacked-output topology with a weighted feedback network to improve cross-regulation in multi-output flyback converters. The design is centered on the MPX2002 (an all-in-one flyback controller with integrated 650-V primary control circuitry and a secondary 150-V synchronous rectification driver, using capacitive isolation to replace the optocoupler and quasi-resonant operation) and generates four output rails from an 85 V AC to 265 V AC input: a main regulated +5 V output, a stacked +12 V output, a post-regulated +3.3 V output (produced by the MP2332H fully integrated synchronous buck converter stepping down the +12 V rail, at approximately 1.2 MHz switching frequency with the MPL-AL4020-2R2 inductor), and a low-current -12 V auxiliary output (generated by a dedicated transformer winding feeding the MP2015A LDO, which withstands a 2.5 V to 24 V input range). Key design parameters given include: a 62 µF/450 V input bulk capacitor selected (minimum DC bus voltage explicitly limited to 85 V DC, maximum ambient temperature 90°C, maximum output power 25 W), a primary-to-secondary turns ratio N_PS1=12 for the +5 V output (maximum duty cycle limit of 45%, resulting in a 41.62% maximum primary duty cycle at minimum input voltage), N_PS2=8 for the +12 V output, N_PS4=4 for the -12 V output, a 70 kHz switching frequency, a 479 µH magnetizing inductance, a calculated maximum rated peak current of 1.32 A, an average input current at low line of 0.33 A, and a worst-case input peak current of 1.99 A, with weighted feedback achieving 70% regulation for the +5 V output and 30% for the +12 V output. The article states that experimental results were used to evaluate the achieved cross-regulation, output voltage accuracy, and overall converter performance, and validates the architecture as a practical approach for multi-output auxiliary supplies. This is background design-technical content, not a price, capacity, inventory, or policy event.
multi-output flyback converter+5 V main regulated output+12 V stacked outputMonolithic Power SystemsEDN

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NuAxi Stream - Real-Time Semiconductor Intelligence

Thu, Oct 15

Skeleton Technologies raises Siemens-led round to expand US production

Star Asia Vision targets digital out-of-home market with new products, Nichia partnership

Wed, Oct 14

New motherboards, old RAM, plenty of life left in yesterday's PCs

RECOM and CELUS Partner to Bring RECOM Power Designs to the CELUS Design Platform

TDK introduces new dual-die, stray-field robust motor position sensor for ASIL D fail operational applications

Siemens’ Tessent ecosystem enables direct test pattern execution via PCIe and USB

STMicroelectronics reveals high-accuracy two-in-one altitude and underwater depth sensor for wearables and sports cameras

ASE expands PowerSiP platform to improve AI data center power efficiency

Tue, Oct 13

(PR) Bolt Graphics Achieves Silicon Bring-up of Zeus Test Chip, Opens Taipei Office

HV hot-swap controller for digital power-path protection

TI Unveils High-Speed ADC for AI Data Center Monitoring

Mon, Oct 12

(PR) INNO3D Announces AGS-4UMGX-R1 4U GPU Server With NVIDIA MGX

GlobalFoundries unveils 7nm-class FDX Fusion node — comes 7 years after firm abandoned FinFET

TI unveils new ADC to enable nanosecond-level telemetry and minimize downtime in AI data centers

GlobalFoundries tops out Dresden expansion

Vertiv 2.3MW CDU Meets NVIDIA DSX Ready Requirements

Sun, Oct 11

Russia's Yandex bot traffic nearly eliminated overnight after Ukraine drone strikes cripple multiple of 'Russia's Google' data centers

Fri, Oct 9

Diodes Incorporated Showcases Analog and Power Solutions for Efficient Automotive, Data Center, and Industrial Systems at electronica 2026

Navitas, Microchip Develop 800V AI Data Center Reference Design

Practical design for a multi-output flyback converter with improved cross-regulation

Chip Teardown Lab2 opened

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