On October 28, Samsung Electro-Mechanics (SEMCO) told investors that long-term agreements are expected to account for more than 60% of its multilayer ceramic capacitor (MLCC) revenue next year, showing how far ahead AI data center builders are reserving components. It said demand was growing faster than expected despite capacity additions, and that supply of both MLCCs and flip-chip ball grid array (FCBGA) substrates would tighten further in the fourth quarter.
According to a consensus among economic research institutions, 2026 will be a breakout year for Taiwan's economic growth, with GDP forecast to expand at a double-digit rate—more than twice China's growth rate. The forecast also states that over the next six months, the electronics and machinery sector is expected to remain resilient, while securities, textiles, chemicals, and petrochemical raw materials could weaken. The source does not state the cause behind these projections.
Tesla and SpaceX are building Terafab in Texas, with Musk aiming to establish a facility capable of processing 1 million wafers per month within 10 years. Intel has joined as a technology partner, and TSMC has confirmed discussions on potential cooperation. Procurement officials from Tesla and SpaceX visited Korean suppliers at SEMICON West. Whether Terafab will materialize as planned remains uncertain.
Global Technology said on Oct. 28 that it signed a memorandum of understanding (MOU) with Austria's TriLite Technologies to develop, manufacture and commercialize automotive laser beam scanning (LBS) projection solutions. The companies will first conduct a proof of concept (PoC) for a system that projects images or information from vehicle doors onto the ground, aiming to verify its suitability for automotive applications by the first half of next year. The technology uses light sources installed in vehicle doors or side mirrors to display images and guidance information on the ground, with applications including welcome lighting, exit warnings and pedestrian guidance; minimizing optical module size is essential because the technology must fit into limited spaces inside vehicles. TriLite will supply an ultra-compact LBS optical engine that uses a single MEMS mirror to steer light from RGB lasers and can project onto curved surfaces or the ground without a separate projection lens, while Global Technology will handle overall system design, including drive electronics, module integration, optics, thermal management structures and vehicle interfaces, with plans to validate brightness, operational reliability and safety under actual vehicle conditions. After completing the PoC, the companies will consider expanding the partnership to mass production, prioritizing discussions on domestic manufacturing of LBS optical engine modules and joint development of automotive SoCs; under the proposed arrangement, TriLite would be responsible for algorithms and technical specifications, while Global Technology would handle semiconductor design implementation.
Reports of internal display damage have emerged for Apple's first foldable smartphone, the iPhone Duo. According to industry sources on Oct. 28, following the device's launch on Oct. 23, devices reported in the United States, Australia and other markets showed similar symptoms, including cracks near the lower portion of the central fold and long white lines extending to the right; some users said they heard a cracking sound after folding and unfolding several times, followed by screen damage. The leading hypothesis is that metal components inside the external hinge may have broken or malfunctioned, damaging the back of the display; cracks in similar locations across multiple countries have raised concerns about a possible structural defect in the hinge itself. The external hinge consists of more than 100 precision components; if a connecting component breaks or the support plate fails to move properly, the metal structure could press against the back of the OLED panel, and damage to internal OLED wiring could cause bright lines. Apple uses 3D printing for the titanium hinge cover, and observers suggested its adoption, potentially motivated by cost reduction, may be linked to hinge durability issues. The device had hinge production yield problems during development; the primary external hinge supplier was changed from U.S.-based Amphenol to Taiwan's Shin Zu Shing, which also reportedly supplied 'golden samples' meeting Apple's standards. Foxconn's assembly yield reportedly stood at slightly above 60% in mid-September, with yield problems of key components such as the hinge and OLED display, supply delays and design changes cited as possible causes. Supply chain: Shin Zu Shing and Amphenol supply the external hinges; South Korea's Fine M-Tec reportedly supplies the internal hinge (backplate); Samsung Display is the exclusive foldable OLED panel supplier; upper UTG is supplied by Lens Technology and South Korea's UTI; lower UTG by Lens Technology and China's Biel Crystal. Observers believe machining or assembly issues in the external hinge could be resolved through process improvements, but a design change may be necessary if the problem lies in the hinge structure itself. Apple said it is aware of an issue affecting internal displays of a small number of iPhone Duo devices and that users should contact AppleCare for a replacement.
internal OLED display (foldable OLED panel)external hingecentral support plateApple, Amphenol and 9 totalThe Elec
Related manufacturers
Apple, Amphenol, Shin Zu Shing, Fine M-Tec, Samsung Display, Lens Technology, UTI, Biel Crystal, Foxconn
Finetek will supply 10 billion won worth of OLED manufacturing equipment to Samsung Display Vietnam, consisting of bonding systems used in OLED panel manufacturing. The order follows a 19.5 billion won contract signed in July. Finetek stated on Oct. 28 that cumulative orders this year, including the latest contract, totaled approximately 37 billion won, equivalent to 80% of last year's revenue, and will be reflected in revenue sequentially from the second half of this year. Finetek also plans to expand its existing OLED equipment business and new businesses, including robotics.
SK ecoplant Materials (SK Materials) said on Oct. 28 that it signed a memorandum of understanding (MOU) with Japan's Furukawa Electric Co. to cooperate on semiconductor materials for artificial intelligence (AI) data centers. Furukawa Electric will develop new products for semiconductor and data center applications, while SK Materials will evaluate the new materials and expand their adoption in the South Korean market. The companies plan to establish a working group for regular technical exchanges and business discussions, and will jointly assess potential applications for various materials based on customer demand. The collaboration aims to address increasingly stringent performance and reliability requirements for materials used in packaging, thermal management, insulation and communications infrastructure. The source does not state a cause beyond this cooperation context.
semiconductor materials for AI data centersSK ecoplant Materials (SK Materials), Furukawa Electric Co.The ElecPartnership/M&A
Related manufacturers
SK ecoplant Materials (SK Materials), Furukawa Electric Co.
On its third-quarter earnings conference call held on Oct. 28, LG Electronics said panel prices for LCD TVs and monitors are expected to remain firm in the fourth quarter of this year, with upward pressure intensifying further from the first quarter of next year (Q1 2027 per the headline), driven by production cuts and price increases by panel manufacturers along with growing demand for large-screen TVs. The company said demand for larger panel sizes in the TV market is clearly increasing and expects this to be another factor driving prices higher. LG Electronics' Media Entertainment Solution (MS) division, which oversees the TV business, reported third-quarter revenue of 5.0215 trillion won and operating profit of 146.7 billion won, swinging to a profit from an operating loss of 302.6 billion won a year earlier; the company attributed the improvement to increased sales of premium products including OLED TVs, lower material costs and more efficient marketing spending. Park Sang-ho, senior vice president in charge of business management at the MS division, said the company will improve supply chain efficiency to address rising costs of key components and plans to increase the proportion of premium product sales, reduce competitive costs and adjust selling prices in line with market conditions.
Apple has unveiled a series of new products, including an OLED touchscreen MacBook Pro, an M6 MacBook Pro, an M6 iMac, and an OLED iPad mini; the OLED MacBook Pro is Apple's first Mac with an OLED touchscreen. According to MacRumors, the 14-inch and 16-inch models start at US$2,899 and US$3,399, respectively, representing a US$400 premium over comparable mini-LED versions, and both models are scheduled to go on sale November 6. Apple says the M6 marks its transition to 2nm and is expected to use TSMC's N2 process, delivering up to 30% faster graphics performance and 25% faster AI workloads than the M5, while the OLED touchscreen MacBook Pro uses the earlier M5 Pro and M5 Max chips built on TSMC's third-generation 3nm process. According to The Korea Herald, Samsung Display has reportedly secured exclusive OLED panel supply for Apple's 14-inch and 16-inch models, with industry estimates suggesting orders could reach approximately 2.5 million panels through 2027. Per Commercial Times, institutional investors expect the new lineup to drive high-end replacement demand and potentially boost fourth-quarter orders and shipments for Taiwanese ODM partners Foxconn and Quanta, while major PC ODMs remain cautious about the second-half market outlook, with persistently high memory and storage costs putting upward pressure on notebook ASPs and constraining overall PC shipment growth.
OLED touchscreen panelM6 chipM5 Pro chipApple, TSMC and 5 totalTrendForce
Renesas has introduced the RX74M and RX74N 32-bit industrial MCUs, available now along with corresponding evaluation boards. The two devices are the first in the RX family to use a 22-nm process and incorporate embedded MRAM. Based on a 600-MHz RXv3e core, they achieve more than twice the performance of their 240-MHz predecessors, the RX72M and RX72N. Each MCU features 1 MB of code MRAM, 256 KB of zero-wait-state TCM (tightly coupled memory) RAM, and 1.5 MB of SRAM for real-time processing. Unlike embedded flash, MRAM can be written without a prior erase operation, allowing faster code and data updates and reducing programming time. The RX74M is designed for industrial automation equipment, including AC drives, industrial robots, and PLCs, while the RX74N targets smart meters, power conditioners, and HVAC systems. Both integrate Gigabit Ethernet and CAN FD, and the RX74M adds a TSN-capable Ethernet switch and an EtherCAT slave controller for industrial networking.
Samsung reported 3Q26 results: riding the AI memory boom, operating profit surged nearly ninefold YoY to a record KRW 107.4 trillion ($80.04 billion), and revenue climbed to KRW 195.3 trillion, exceeding its early-October preliminary estimate by KRW 300 billion. The semiconductor (DS) division delivered KRW 147.1 trillion in sales and KRW 106.5 trillion in operating profit, a 72.4% margin. Samsung has posted record revenue and operating profit for four consecutive quarters since 4Q25. During its October 29 earnings call, Samsung said HBM4 revenue more than tripled QoQ in 3Q26, accounting for roughly 60% of total HBM sales; its planned 2027 HBM supply is effectively sold out, with customer negotiations concluded at target pricing levels, though major clients continue to request additional volumes. Samsung also claims it has achieved its goal of bringing its HBM market share in line with its standing in the broader DRAM market (TrendForce ranked Samsung as the top DRAM supplier in 2Q26 with a 39.4% share). Against a tightening supply outlook, Samsung has finalized long-term memory supply agreements (LTAs) with 10 major customers and is negotiating with another 10, and reportedly sees its target of securing LTAs covering 60–70% of production capacity by 2030 increasingly within reach; Samsung expects chip supply to tighten further in 2027. On pricing, DRAM average selling prices (ASPs) climbed around 20% QoQ in 3Q26 and NAND gained a high-teens percentage QoQ, per News 1 citing Kim Jae-june, Executive Vice President of Samsung Electronics' Memory Business; shipment growth was more modest, with DRAM volumes up a low- to mid-single-digit percentage and NAND up a mid-single-digit percentage sequentially.
According to an exclusive Reuters report, CXMT is expected to start mass production of its first-ever HBM memory in the HBM3E form factor within the next two months, meaning it will officially start by the end of the year. CXMT began risk production of HBM3E memory in August, but the company has struggled with the yield of HBM3E memory modules, and this situation remains similar today, according to the latest report. The yield challenge stems from the immaturity of the through-silicon via (TSV) technology it employs: front-end manufacturing achieves around 30% yields, while back-end processing adds about 70% on top of the original 30%. Data suggests CXMT is attempting to achieve HBM3E with only 3,000 TSVs per layer and trying to pack 8 layers into the regular 8-high HBM3E configuration (compared with Samsung's roughly 5,000 TSVs per layer on HBM2 and SK hynix's more than 8,000 TSVs per layer on HBM3). Given these challenges, the company is unlikely to transition to a higher-capacity 12-high HBM in the near term as it addresses engineering issues. JEDEC's official data for HBM3E indicates a 1,024-bit width and speeds from 9.2 Gbps per pin to 12.4 Gbps, with most standard configurations targeting 9.6 Gbps per pin, total bandwidth around 1.2 TB/s, and capacities from 24 GB using 8-high stacks to 36 GB using 12-high stacks of 24 Gb layers. The mass production start is an expectation, not a confirmed completed event.
Enphase Energy and Infineon Technologies have announced the deployment of 900 V gallium nitride (GaN) monolithic bidirectional switch (BDS) devices in Enphase solid-state transformer (SST) power modules, targeting AI data center power infrastructure. Enphase led the system-level development, while Infineon contributes device technology and engineering expertise through its CoolGaN portfolio; Enphase previously introduced 650 V GaN bidirectional switches into volume-production power electronics, and GaN HEMT technology is already used in its IQ9 microinverters. The technology supports Enphase's IQ Solid-State Transformer (IQ SST) platform for AI data centers and can support an 800 V unipolar DC bus instead of split ±400 V rails, and may also enable future 1,500 VDC architectures using split ±750 V generation; the 900 V devices could also benefit commercial solar inverters, supporting three-phase line-to-line designs for 480 V applications in the United States and 400 V applications in other markets. No specific quantities, prices, or timelines are stated. The devices have completed initial testing and are being integrated into IQ SST development builds, with production qualification expected to follow, so further validation is needed before the technology reaches qualified production status.
900 V GaN monolithic bidirectional switch (BDS)solid-state transformer (SST) power modulesCoolGaNEnphase Energy, Infineon TechnologiesPower Electronics NewsPartnership/M&A
French researchers have demonstrated a hybrid nanoelectronic experimental "Ising machine" designed to solve difficult combinatorial optimization problems more efficiently. The work was conducted by researchers from CEA-Leti and Spintec in Grenoble and the Centre for Nanoscience and Nanotechnology at Université Paris-Saclay, and reported in Nature Communications. The system combines hafnium-oxide resistive random-access memory (ReRAM) with stochastic magnetic tunnel junctions (SMTJs): ReRAM devices store the weighted connections describing how variables influence one another and can perform analog matrix operations where data are stored, while SMTJs represent the binary variables and fluctuate between states driven by thermal noise. The researchers control annealing by adjusting a single read voltage applied to the ReRAM array, so the hardware produces an annealing schedule through the direct interaction of its components. The proof-of-concept machine consistently reached the global optimum in a 24-vertex weighted MAX-CUT benchmark and a 10-vertex, three-color graph-coloring problem, operated at room temperature without an applied magnetic field, and the researchers emphasize that ReRAM, magnetic tunnel junctions and CMOS circuitry are compatible with back-end-of-line fabrication and vertical three-dimensional integration. The article notes this remains a small experimental prototype, not evidence of superiority over leading conventional solvers; updates are currently sequential, external feedback is still used for measurement, and comparative speed and energy benefits have not yet been quantified. The source does not state a cause (this is a technology development report, not a market movement).
hafnium-oxide ReRAMstochastic magnetic tunnel junctions (SMTJs)SemiWiki
SK hynix reported its Q3 2026 quarterly results with a record $78.129 billion in net revenue and shared a market outlook: it expects memory demand to continue outpacing supply through 2030, with a grim outlook for the consumer market. The source states the main supply constraint is the complexity of leading-edge semiconductor nodes and the lengthy lead times for fab construction, which take years to translate into regular mass production volumes. On pricing, the average selling price of memory modules in Q3 increased by over 20% compared to Q2; SK hynix suggests this means consumer electronics device prices might jump by more than 20% once memory inventory is depleted. The company expects a decrease in PC and smartphone shipments, offset by a strong rollout of AI data centers. About 14 major customers, including most hyperscalers, have signed 5-year long-term agreements that will account for over 50% of total capacity sold for 2027 and 2028. The company also cited its long-term supply agreements and expansion plans involving new fab capacity and facilities under construction. The supply-demand gap and the possible consumer electronics price increase are company expectations, not achieved results.
Foxconn Slovakia has started recruiting at its plant in Nitra, focusing on electrical engineering roles. The company says the hiring is a response to growing demand for AI infrastructure and new business opportunities in that area. The company has not said how many people it will hire, but according to an unnamed source in the company's management, cited by the Slovak news agency TASR, at least 300 positions will be created. The first engineering and technical positions, for specialists with an electrical engineering background, are already open, and recruitment will later be extended to production and assembly roles; the company will also focus on training in areas such as robotics and smart manufacturing. Background: the parent company, Taiwan's Hon Hai Technology Group (Foxconn), is one of the world's largest suppliers of AI servers, and in the third quarter its revenue rose 47%, driven by strong AI demand in its cloud and networking business. The hiring follows a round of job cuts at the plant: in November 2025, Foxconn Slovakia announced 509 redundancies in Nitra, and the first employees received notice in December.
Samsung published Part 1 of a series on the evolution of AI and AI chips and the HBM that powers them; the content is technical background. It explains the division of roles among AI chips (GPUs, AI-specific ASICs, CPUs), notes that during decode at smaller batch sizes memory bandwidth can become a key performance constraint, and describes KV cache data storage needs that grow as context lengths and concurrent requests increase. The article recounts that GPUs traditionally used GDDR for high memory bandwidth, but because GDDR devices are placed around the GPU on the board, adding memory requires additional space and routing, and raising per-pin data rates increases challenges of power consumption, heat, and signal integrity. HBM addresses this by combining vertical stacking with a wide I/O interface, connecting multiple stacked DRAM dies through Through Silicon Vias (TSVs), delivering high bandwidth, higher capacity, greater energy efficiency, and high-density packaging in a smaller footprint. It also outlines HBM's generational evolution, including stack counts rising from 8-high to 12-high and 16-high, higher-density DRAM dies, and advanced logic-process base dies. Samsung's zHBM is currently under development and directly stacks memory on top of the compute device via 3D integration to shorten data paths. The content is informational only, with Samsung providing no warranty as to its accuracy or completeness.
Essemtec, the SMT equipment business of Nano Dimension, has moved its US headquarters to a new facility in Woburn, Massachusetts (reported October 28, 2026). The 2,500-square-foot (about 230 square metres) site combines offices, training facilities and a demo floor, giving North American customers access to equipment demonstrations, application development and process evaluation. The demo centre currently shows the FOX Ultra All-in-One platform, which combines jetting, placement and inspection, alongside the Tarantula dispensing system and the company's full range of dispensing valves; a Lizard reflow oven will be added soon so customers can evaluate a complete process on site. According to Nano Dimension, the move comes as demand for Essemtec's equipment grows, particularly in aerospace and defence; Essemtec also works with large EMS providers, including in AI-related manufacturing, and has expanded deployments with space and satellite companies. Nano Dimension interim CEO Moshe Rozenbaum cited accelerating revenue growth and strong commercial momentum.
FOX Ultra All-in-One platformTarantula dispensing systemdispensing valvesEssemtec, Nano DimensionEvertiq
Kentec, a subsidiary of Kenmec Group, is planning to shift beyond its traditional role as a contract manufacturer of components to become a systems integration provider (SIP) for complete AI data center (AIDC) infrastructure. At an investor conference on October 27, Kentec general manager Asa Kuo said the AI era is just beginning, and the company is transforming its revenue mix by leveraging its electronics manufacturing services (EMS) foundation and electromechanical integration capabilities to enter thermal management and AIDC infrastructure. This is a transformation plan announced at an investor conference; the source does not state specific capacity figures or a timeline.
thermal managementAI data center (AIDC) infrastructureKentec, Kenmec GroupDigiTimes Asia
Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain. The company's board has approved an additional NT$50.9 billion (US$1.57 billion) in long-lead equipment orders and plans to sell its Japanese subsidiary to PCB maker Meiko Electronics. According to the source, the cause is surging AI and high-performance computing (HPC) chip demand, which drives the need for high-layer-count, large-size IC substrates. Both the equipment orders and the planned sale are board-approved plans; the source does not state that implementation has been completed.
AI substrateshigh-layer-count, large-size IC substratesUnimicron Technology, Meiko ElectronicsDigiTimes AsiaCapacity Change