NuAxi Stream - Real-Time Semiconductor Intelligence

Wed, Oct 28

22:00Impact score 45
Enphase, Infineon Develop 900 V GaN Bidirectional Switches
Enphase Energy and Infineon Technologies have announced the deployment of 900 V gallium nitride (GaN) monolithic bidirectional switch (BDS) devices in Enphase solid-state transformer (SST) power modules, targeting AI data center power infrastructure. Enphase led the system-level development, while Infineon contributes device technology and engineering expertise through its CoolGaN portfolio; Enphase previously introduced 650 V GaN bidirectional switches into volume-production power electronics, and GaN HEMT technology is already used in its IQ9 microinverters. The technology supports Enphase's IQ Solid-State Transformer (IQ SST) platform for AI data centers and can support an 800 V unipolar DC bus instead of split ±400 V rails, and may also enable future 1,500 VDC architectures using split ±750 V generation; the 900 V devices could also benefit commercial solar inverters, supporting three-phase line-to-line designs for 480 V applications in the United States and 400 V applications in other markets. No specific quantities, prices, or timelines are stated. The devices have completed initial testing and are being integrated into IQ SST development builds, with production qualification expected to follow, so further validation is needed before the technology reaches qualified production status.
900 V GaN monolithic bidirectional switch (BDS)solid-state transformer (SST) power modulesCoolGaNEnphase Energy, Infineon TechnologiesPower Electronics NewsPartnership/M&A
21:00Impact score 10
When Nanomagnets Do the Math: France’s New Machine for Impossible Choices
French researchers have demonstrated a hybrid nanoelectronic experimental "Ising machine" designed to solve difficult combinatorial optimization problems more efficiently. The work was conducted by researchers from CEA-Leti and Spintec in Grenoble and the Centre for Nanoscience and Nanotechnology at Université Paris-Saclay, and reported in Nature Communications. The system combines hafnium-oxide resistive random-access memory (ReRAM) with stochastic magnetic tunnel junctions (SMTJs): ReRAM devices store the weighted connections describing how variables influence one another and can perform analog matrix operations where data are stored, while SMTJs represent the binary variables and fluctuate between states driven by thermal noise. The researchers control annealing by adjusting a single read voltage applied to the ReRAM array, so the hardware produces an annealing schedule through the direct interaction of its components. The proof-of-concept machine consistently reached the global optimum in a 24-vertex weighted MAX-CUT benchmark and a 10-vertex, three-color graph-coloring problem, operated at room temperature without an applied magnetic field, and the researchers emphasize that ReRAM, magnetic tunnel junctions and CMOS circuitry are compatible with back-end-of-line fabrication and vertical three-dimensional integration. The article notes this remains a small experimental prototype, not evidence of superiority over leading conventional solvers; updates are currently sequential, external feedback is still used for measurement, and comparative speed and energy benefits have not yet been quantified. The source does not state a cause (this is a technology development report, not a market movement).
hafnium-oxide ReRAMstochastic magnetic tunnel junctions (SMTJs)SemiWiki
19:31Impact score 96
SK Hynix Expects Memory Demand to Outpace Supply Through 2030
SK hynix reported its Q3 2026 quarterly results with a record $78.129 billion in net revenue and shared a market outlook: it expects memory demand to continue outpacing supply through 2030, with a grim outlook for the consumer market. The source states the main supply constraint is the complexity of leading-edge semiconductor nodes and the lengthy lead times for fab construction, which take years to translate into regular mass production volumes. On pricing, the average selling price of memory modules in Q3 increased by over 20% compared to Q2; SK hynix suggests this means consumer electronics device prices might jump by more than 20% once memory inventory is depleted. The company expects a decrease in PC and smartphone shipments, offset by a strong rollout of AI data centers. About 14 major customers, including most hyperscalers, have signed 5-year long-term agreements that will account for over 50% of total capacity sold for 2027 and 2028. The company also cited its long-term supply agreements and expansion plans involving new fab capacity and facilities under construction. The supply-demand gap and the possible consumer electronics price increase are company expectations, not achieved results.
memorySK hynixTechPowerUpPrice Movement
17:00Impact score 58
Foxconn Slovakia to hire at least 300 in Nitra for AI infrastructure
Foxconn Slovakia has started recruiting at its plant in Nitra, focusing on electrical engineering roles. The company says the hiring is a response to growing demand for AI infrastructure and new business opportunities in that area. The company has not said how many people it will hire, but according to an unnamed source in the company's management, cited by the Slovak news agency TASR, at least 300 positions will be created. The first engineering and technical positions, for specialists with an electrical engineering background, are already open, and recruitment will later be extended to production and assembly roles; the company will also focus on training in areas such as robotics and smart manufacturing. Background: the parent company, Taiwan's Hon Hai Technology Group (Foxconn), is one of the world's largest suppliers of AI servers, and in the third quarter its revenue rose 47%, driven by strong AI demand in its cloud and networking business. The hiring follows a round of job cuts at the plant: in November 2025, Foxconn Slovakia announced 509 redundancies in Nitra, and the first employees received notice in December.
AI infrastructureFoxconn SlovakiaEvertiq
15:01Impact score 20
Essemtec moves US headquarters to Woburn, Massachusetts
Essemtec, the SMT equipment business of Nano Dimension, has moved its US headquarters to a new facility in Woburn, Massachusetts (reported October 28, 2026). The 2,500-square-foot (about 230 square metres) site combines offices, training facilities and a demo floor, giving North American customers access to equipment demonstrations, application development and process evaluation. The demo centre currently shows the FOX Ultra All-in-One platform, which combines jetting, placement and inspection, alongside the Tarantula dispensing system and the company's full range of dispensing valves; a Lizard reflow oven will be added soon so customers can evaluate a complete process on site. According to Nano Dimension, the move comes as demand for Essemtec's equipment grows, particularly in aerospace and defence; Essemtec also works with large EMS providers, including in AI-related manufacturing, and has expanded deployments with space and satellite companies. Nano Dimension interim CEO Moshe Rozenbaum cited accelerating revenue growth and strong commercial momentum.
FOX Ultra All-in-One platformTarantula dispensing systemdispensing valvesEssemtec, Nano DimensionEvertiq
11:48Impact score 60
Kentec targets CSP opportunities with AIDC infrastructure integration
Kentec, a subsidiary of Kenmec Group, is planning to shift beyond its traditional role as a contract manufacturer of components to become a systems integration provider (SIP) for complete AI data center (AIDC) infrastructure. At an investor conference on October 27, Kentec general manager Asa Kuo said the AI era is just beginning, and the company is transforming its revenue mix by leveraging its electronics manufacturing services (EMS) foundation and electromechanical integration capabilities to enter thermal management and AIDC infrastructure. This is a transformation plan announced at an investor conference; the source does not state specific capacity figures or a timeline.
thermal managementAI data center (AIDC) infrastructureKentec, Kenmec GroupDigiTimes Asia
10:37Impact score 60
Unimicron steers resources to Taiwan AI substrates with NT$50.9B equipment orders, Japan unit sale
Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain. The company's board has approved an additional NT$50.9 billion (US$1.57 billion) in long-lead equipment orders and plans to sell its Japanese subsidiary to PCB maker Meiko Electronics. According to the source, the cause is surging AI and high-performance computing (HPC) chip demand, which drives the need for high-layer-count, large-size IC substrates. Both the equipment orders and the planned sale are board-approved plans; the source does not state that implementation has been completed.
AI substrateshigh-layer-count, large-size IC substratesUnimicron Technology, Meiko ElectronicsDigiTimes AsiaCapacity Change
09:48Impact score 30
NXP's automotive content gains, industrial demand strengthen its growth outlook
NXP Semiconductors' latest results point to a business gaining from more complex vehicle electronics and industrial computing, while its emerging data center operation offers another route to growth. The source also notes that the next test is whether those opportunities can sustain demand as the company adds manufacturing capacity and customers weigh their inventory needs. No specific figures, dates or price movements are given in the source.
automotive electronicsindustrial computingdata centerNXP SemiconductorsDigiTimes Asia
08:38Impact score 10
Samsung DX division opens Suzhou robotics R&D hub
Samsung Electronics' Device eXperience (DX) division has established its first overseas research and development site for manufacturing technology in Suzhou, China, leveraging the city's robotics and automation ecosystem to develop technologies for Samsung's global factories. This is an R&D site establishment and is background information, with no price, capacity, or policy change involved.
Samsung ElectronicsDigiTimes Asia
08:32Impact score 60
[News] CXMT Reportedly Ships HBM3E Samples, Eyes Production Within 2 Months Despite 20–30% Yields
According to a 2026-10-28 report citing Reuters sources, CXMT's HBM3E yields currently stand at just 20% to 30%, well below the approximately 70% achieved by SK hynix. CXMT has reportedly delivered HBM3E samples to several domestic AI chip designers and expects to begin limited production within the next two months (planned, not yet implemented). It has provided customers with two versions: a standard design and a revised version incorporating changes aimed at improving manufacturing yields. Because a significant portion of chips must be discarded or reworked, low yields are expected to make CXMT's HBM3E more expensive to produce than comparable products from overseas competitors. CXMT reportedly began developing HBM technology internally as early as 2024. Testing cited by Reuters showed CXMT's HBM3E performed closer to SK hynix's previous-generation HBM3 than to its HBM3E, highlighting the technological gap with SK hynix, Samsung Electronics, and Micron. The report also notes China's shortage of advanced AI memory: Reuters noted in September that Huawei, Cambricon, MetaX, and Iluvatar CoreX had reportedly raised prices for current and next-generation AI chips by 20% to 50%, and Chinese chipmakers have increasingly relied on costly grey-market HBM supplies following tighter U.S. export restrictions. Per Seoul Economic Daily in September, citing The Information, Alibaba's chip design unit T-Head and Cambricon Technology were reportedly testing the memory; if development proceeds as planned, products incorporating CXMT's HBM3E could reach the market as early as 2027. Per Southern Metropolis Daily, CXMT management did not directly address the technology at a September investor briefing, saying only it would continue developing products and processes according to its existing roadmap; an analyst noted it remained unclear whether samples could meet domestic customers' requirements or how soon stable, large-scale production could be achieved.
HBM3EHBM3HBMCXMT, SK hynix and 8 totalTrendForce
07:01Impact score 45
Intel to Acquire Quantum Computing Software Company Classiq
Intel announced on Oct. 26 local time that it had signed a definitive agreement to acquire quantum computing software company Classiq, to build a full-stack quantum computing platform integrating hardware and development tools. Classiq has developed an integrated software platform independent of specific qubit technologies or hardware architectures; when users provide instructions, the platform automatically designs quantum circuits optimized for the qubit characteristics of each hardware system, serving a role similar to EDA tools used in semiconductor circuit design. Intel plans to combine its proprietary spin-qubit manufacturing technology with Classiq's platform to create a user-friendly full-stack quantum computing system, aiming to accelerate the commercialization of quantum processing units (QPUs) usable in practical applications and to expand its product portfolio beyond CPUs, GPUs and ASICs to include QPUs. The acquisition is expected to close in the first half of 2027, subject to approval from US regulators and other procedures; until then the two companies will continue operating independently. Following the acquisition, Classiq will continue supporting quantum hardware and qubit technologies from other manufacturers. Intel has invested in quantum computing R&D since 2015 and can mass-produce spin-qubit chips and cryogenic control electronics using the same lithography and etching equipment and processes employed in conventional silicon semiconductor production lines.
quantum computing software platformspin-qubit chipscryogenic control electronicsIntel, ClassiqThe ElecPartnership/M&A
07:01Impact score 60
Doosan to Invest 399.2 Billion Won in Optical Module CCL Plant in Gimje
On Oct. 27, Doosan announced it signed a memorandum of understanding (MOU) with Jeonbuk State and Gimje City to establish dedicated copper-clad laminate (CCL) production lines for optical modules used in artificial intelligence (AI) data centers. The project is the first detailed domestic expansion plan under the company's investment program of approximately 970 billion won announced in September. Doosan will invest 399.2 billion won by 2028 to build the plant on a site adjacent to its flexible copper-clad laminate (FCCL) factory in the Gimje Jipyeongseon General Industrial Complex. The new facility will cover approximately 33,000 square meters, create about 200 jobs, and the production lines are scheduled to begin phased operations in the second half of 2028. The expansion is aimed at meeting growing demand for optical module CCL used in AI data centers; Doosan currently supplies CCL for high-speed optical modules capable of transmitting data at 800 gigabits per second (Gbps). No price movement is stated; this is a planned capacity expansion, not yet an operational capacity change.
copper-clad laminates (CCL) for optical modulesflexible copper-clad laminate (FCCL)DoosanThe ElecCapacity Change
06:54Impact score 60
[News] AI-Driven Component Costs Reportedly Push HP, ASUS, Acer to Shift Some PC Production Back to China
According to Nikkei, citing industry sources, rising component costs are reportedly prompting leading PC brands including HP, ASUS, and Acer to move part of their production from Thailand and Vietnam back to China, while Dell is also reportedly considering a similar move (reported move, not confirmed as implemented). The stated cause is that surging AI demand drives shortages of memory and storage chips, raising PC bills of materials: per TrendForce, CPU, DRAM, and SSD costs accounted for approximately 68% of a mainstream notebook's BOM in the third quarter of 2026, up from 45% in the first quarter of 2025. The development partially reverses the 'China+1' diversification strategy pursued amid U.S.-China tensions and trade restrictions. TrendForce estimates the share of global notebook production outside China will decline from approximately 24% in 2025 to 21% in 2026, potentially falling below 20% in 2027, and expects global notebook shipments to decline by a low-single-digit percentage in 2027, potentially widening to a high-single-digit rate if elevated DRAM and CPU prices are passed on to consumers. Separately, Quanta reportedly suspended HP notebook production for about a week in September amid a dispute over rising component costs, resuming after further negotiations; servers accounted for over 80% of Quanta's revenue in the second quarter of 2026, and supply chain sources suggest it has gained greater leverage in notebook pricing negotiations. Chinese ODMs (Luxshare, Huaqin Technology, Longcheer Technology) are reportedly offering lower upfront costs, including waiving engineering and tooling fees, and benefit from access to domestically produced memory chips.
memory chipsstorage chipsDRAMHP, ASUS and 11 totalTrendForceCapacity Change
06:39Impact score 55
[News] SK hynix Eyes EUV-Driven 6F² Scaling, Keeps 4F² and 3D DRAM in Play as Micron Holds Back
During its 3Q26 earnings call, SK hynix said it plans to maximize the potential of its existing 6F² architecture through process improvements and stable platform operations, while continuing to develop 4F² and 3D DRAM as potential next-generation options, with adoption tied to each technology's maturity and economic viability. According to News 1, SK hynix DRAM marketing head Park Joon-deok said advances in EUV lithography and process scaling offer further room to extend the 6F² platform, stressing that commercializing new cell architectures requires overcoming hurdles in yields, reliability, costs, product design and customer validation. By contrast, Micron has ruled out adopting 4F² DRAM currently, saying the technology is "not on the roadmap right now"; Micron President and Chief Technology and Product Officer Scott DeBoer said more than 20 years of research had failed to identify a sustainable scaling path, and that while technically feasible, the 4F² structure's process complexity and higher manufacturing costs limit its practical benefits. According to Chosun Biz, Samsung Electronics is developing a 4F² architecture based on vertical channel transistors (VCT), and Song Jae-hyuk, President and CTO of Samsung's Device Solutions (DS) division, confirmed the company's 4F² development efforts at SEDEX 2026 in Seoul on October 14. Separately, China's CXMT is pushing ahead with 4F² commercialization plans, aiming to launch its first 4F²-based server DDR5 RDIMM module by the end of 2026. SK hynix is also pursuing 4F² research: in a July blog post tied to VLSI 2026, it positioned 4F² vertical-gate (VG) DRAM as a way to extend scaling at sub-10nm nodes.
DRAM6F² DRAM4F² DRAMSK hynix, Micron and 4 totalTrendForce

Tue, Oct 27

23:40Impact score 25
A2 GLOBAL ELECTRONICS ACHIEVES AS9100 CERTIFICATION, STRENGTHENING QUALITY CONTROLS FOR VALUE-ADDED COMPONENT SERVICES
On October 27, 2026, A2 Global Electronics + Solutions announced that it has achieved AS9100 certification, which expands the quality management framework supporting its electronic component distribution and value-added processes, including BGA reballing, for aviation, space, and defense customers. AS9100 builds on the company's existing AS9120 certification with additional emphasis on the planning, execution, and control of operational processes, covering documented work instructions, personnel competencies, equipment control, in-process verification, product safety, traceability, and the management of nonconforming material. The certification complements A2 Global's existing AS9120 and AS6081 certifications and testing capabilities including those associated with AS6171 and ISO/IEC 17025, and the company states it will continue investing in controlled processes and technical capabilities. The source does not state any price or supply impact.
electronic componentsBGA (reballing value-added services)A2 Global Electronics + SolutionsElectronics Sourcing
22:57Impact score 10
A2 Global Electronics gains AS9100 certification
According to Evertiq on October 27, 2026, US component distributor A2 Global Electronics + Solutions has achieved AS9100 certification. The certification expands the quality management framework supporting the company's value-added services, including BGA reballing, for customers in aviation, space and defence. A2 Global was already certified to AS9120, the aerospace quality standard for distributors; per the company's press release, AS9100 goes further with requirements for how operational processes are planned, carried out and controlled, covering documented work instructions, staff competence, equipment control, in-process verification, traceability and the handling of nonconforming material. The company also holds AS6081 certification, the standard for avoiding counterfeit parts in distribution, and has testing capabilities aligned with AS6171 and ISO/IEC 17025.
A2 Global Electronics + SolutionsEvertiq
21:33Impact score 45
NOVOSENSE is latest addition to Anglia’s burgeoning analog and mixed signal devices product portfolio
Anglia Components, one of Europe's longest-established independent authorised distributors of electronic components, has signed a Pan-European franchise agreement with NOVOSENSE Microelectronics, the Chinese manufacturer of highly robust and reliable analog and mixed signal ICs. Anglia's Marketing Director John Bowman explained that the agreement is part of Anglia's strategy to offer customers alternative solutions to the big US analog companies, which are causing difficulties—especially to SME customers—with repeated price increases and restrictions to their supply chain; he said Anglia has rigorously evaluated NOVOSENSE and will add its ranges of ADCs, LED drivers, amplifiers, sensors, interface, motor driver, and gate driver ICs to its portfolio. Anna Wang, Head of NOVOSENSE EMEA, added that Anglia's long experience in the UK and Ireland and its well-established pan-European e-commerce platform Anglia Live will enable customers in the UK and Europe to experience the value of NOVOSENSE's products in their new design projects. The article notes NOVOSENSE's sensor, signal chain, and power management products are widely used in the automotive, industrial, information, communication and consumer electronics markets. The agreement signing itself is an announced event; no effective date is stated in the source.
ADCsLED driversamplifiersNOVOSENSE Microelectronics, Anglia ComponentsEE JournalPartnership/M&A
21:30Impact score 0
STMicroelectronics introduces first automotive safety combination sensors for mass-market applications
STMicroelectronics has announced automotive safety combination sensors for mass-market applications, combining multi-axis accelerometers and gyroscopes (angular rate sensors) in a single package for active and passive safety systems covering use-cases such as crash protection, rollover detection, airbag deployment, vehicle stability controls and radar beam stabilization. These are the first mass-market products launched following ST's acquisition of the NXP automotive and industrial MEMS sensors business in early 2026, a move completed to expand its own MEMS sensors capabilities. The four new sensors—NCS1012BAEP, NCS1012CAEP, NCS1012EAEP and NCS10135AEP—are in production now, in 24-pin QFN 6mm x 6mm x 1.90mm packages, ISO 26262 compliant, supporting SafeSPI, with an automotive temperature range of −40°C to +105°C; the integrated angular rate sensors offer full-scale ranges of ±125 dps, ±250 dps or ±350 dps, the low g acceleration sensors have a nominal full-scale range from ±1.50 g to ±34 g, and the medium g acceleration sensors from ±15.5 g to ±150 g. ST guarantees product availability for at least 15 years. Omdia Senior Research Analyst Nora Houlihan said that thanks to ADAS, IMUs are expected to grow at a 17.7% CAGR (2025-30).
automotive safety combination sensorsmulti-axis accelerometersgyroscopes (angular rate sensors)STMicroelectronics, NXPEE Journal
21:00Impact score 25
Murata Develops World’s Smallest 008004-Inch NTC Thermistor
Murata Manufacturing has developed the NCU01 series, an 008004-inch negative temperature coefficient (NTC) thermistor measuring just 0.25 × 0.125 mm, described as the world's smallest. Compared with the company's previous smallest 01005-inch product, the new component reduces mounting area by approximately 60% while maintaining equivalent temperature-sensing performance, with both resistance and B-constant tolerances specified at ±1%. The ultra-compact thermistor targets densely integrated devices including smartphones, wearable electronics, IC packages, and SiP modules, allowing temperature sensors to be placed closer to heat-generating components. Murata plans to begin sample shipments in October 2026, followed by mass production in 2027; the initial lineup will include 100 kΩ and 10 kΩ resistance variants, with additional options introduced progressively.
NTC thermistorMurata ManufacturingPower Electronics News
19:23Impact score 58
Rochester Provides Continued Lifecycle Support for Intel x86 Processors
On October 27, 2026, Rochester Electronics announced continued lifecycle support for Intel x86 processors. Rochester has partnered with Intel for more than 35 years, providing continued support for legacy microcontrollers and microprocessors including the 8051, 8086/8088, 80C186XL, 80C188XL, 80C196KC, and other established devices. Rochester's product replication engineering team has successfully ported the 80C186XL multiple times in response to manufacturing process obsolescence, helping ensure a continued supply path for customers supporting long-life applications; it also established PLCC assembly capabilities at its Newburyport headquarters after the original industry packaging infrastructure became unavailable. Rochester maintains inventory across a broad range of Intel 32-bit and 64-bit x86 processors, supporting more than 280 part numbers and over two million units, with available families including Xeon, Pentium, Core Duo, Celeron, Atom, and legacy 80286, 80386, and 80486 processors. Rochester's Intel offering also includes millions of chipsets and interface devices, complemented by a broad portfolio of memory, logic, and power management products. The source does not state the cause (such as any price or supply-demand change).
Intel x86 processors80518086/8088Rochester Electronics, IntelElectronics SourcingInventory Shift

Analog	$0.68	−5.9%
Connector	$0.75	+0.2%
CPU	$386.74	−21.3%
DDR4	$88.40	−0.2%
DDR52026-W13	$14.89	−11.2%
GPU	$478.20	+8.2%
MCU	$0.68	−61.7%Unusual
MLCC	$0.01	+54.0%Unusual
MOSFET	$0.12	−82.8%Unusual
PMIC2026-W13	$0.44	−12.5%
SSD/HDD	$288.43	n/a

NuAxi Stream - Real-Time Semiconductor Intelligence

Wed, Oct 28

Enphase, Infineon Develop 900 V GaN Bidirectional Switches

When Nanomagnets Do the Math: France’s New Machine for Impossible Choices

SK Hynix Expects Memory Demand to Outpace Supply Through 2030

Foxconn Slovakia to hire at least 300 in Nitra for AI infrastructure

Essemtec moves US headquarters to Woburn, Massachusetts

Kentec targets CSP opportunities with AIDC infrastructure integration

Unimicron steers resources to Taiwan AI substrates with NT$50.9B equipment orders, Japan unit sale

NXP's automotive content gains, industrial demand strengthen its growth outlook

Samsung DX division opens Suzhou robotics R&D hub

[News] CXMT Reportedly Ships HBM3E Samples, Eyes Production Within 2 Months Despite 20–30% Yields

Intel to Acquire Quantum Computing Software Company Classiq

Doosan to Invest 399.2 Billion Won in Optical Module CCL Plant in Gimje

[News] AI-Driven Component Costs Reportedly Push HP, ASUS, Acer to Shift Some PC Production Back to China

[News] SK hynix Eyes EUV-Driven 6F² Scaling, Keeps 4F² and 3D DRAM in Play as Micron Holds Back

Tue, Oct 27

A2 GLOBAL ELECTRONICS ACHIEVES AS9100 CERTIFICATION, STRENGTHENING QUALITY CONTROLS FOR VALUE-ADDED COMPONENT SERVICES

A2 Global Electronics gains AS9100 certification

NOVOSENSE is latest addition to Anglia’s burgeoning analog and mixed signal devices product portfolio

STMicroelectronics introduces first automotive safety combination sensors for mass-market applications

Murata Develops World’s Smallest 008004-Inch NTC Thermistor

Rochester Provides Continued Lifecycle Support for Intel x86 Processors

Chip Teardown Lab2 opened

Component price indexNPI, vs. prior period

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