Fujitsu taps Broadcom's 3D chip tech for 144-core Monaka CPU
Fujitsu will use Broadcom's 3.5D XDSiP packaging technology to build its 144-core Monaka CPU, featuring four 2nm compute dies stacked on SRAM chiplets. This marks an early public adoption of Broadcom's standardized multi-die platform, which aims to compete with AMD and Intel in advanced packaging. Neutral: This is a long-term technology roadmap item with no immediate impact on component supply, pricing, or trader decisions.
- Related manufacturers
- Fujitsu, Broadcom
- Impact score
- 12 / 100, low impact