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Fujitsu taps Broadcom's 3D chip tech for 144-core Monaka CPU
What happened
Fujitsu will use Broadcom's 3.5D XDSiP packaging technology to build its 144-core Monaka CPU, featuring four 2nm compute dies stacked on SRAM chiplets. This marks an early public adoption of Broadcom's standardized multi-die platform, which aims to compete with AMD and Intel in advanced packaging. Neutral: This is a long-term technology roadmap item with no immediate impact on component supply, pricing, or trader decisions.
Impact and signal
Low impactImpact score: 12/100
Affected components and suppliers
CPUSRAMAdvanced Packaging
FujitsuBroadcom
3D-stackingproduct-launchdatacenter
Source and time
Source: The Register · 2/26/2026 · View original source
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