According to the source, Formosa Smart Energy (FSET) is moving into AI data centers and plans to partner with Chuang-Xi Information and Technology (CXIT) to build one at Formosa Plastics Group's Mailiao industrial park, targeting Taiwanese enterprise users and Japanese cloud service providers (CSPs) in the first phase. The companies also plan to set up a CSP joint venture to run AI data center operations and computing-power services. These are plans; the source does not state the cause.
AI data centercomputing-power servicesFormosa Smart Energy (FSET), Chuang-Xi Information and Technology (CXIT)DigiTimes AsiaPartnership/M&A
Related manufacturers
Formosa Smart Energy (FSET), Chuang-Xi Information and Technology (CXIT)
GlobalFoundries and TSMC have signed an effective five-year, $2 billion manufacturing agreement under which GlobalFoundries will expand capacity at its Malta, NY fab to produce silicon interposers for TSMC's CoWoS advanced packaging technology, with volume production slated to ramp up in the first half of 2028.
Micron and Samsung are shifting HBM base die production to TSMC, with Micron projecting higher ASP and margins for NVHBM. This follows NVIDIA's NVHBM architecture which increases base die value. Bullish: Outsourcing to TSMC and higher ASP expectations for custom HBM.
HBMHBM4HBM4EMicron, Samsung and 6 totalTrendForcePartnership/M&A
Kioxia announced a 2x speed increase for its Optane-class GP series SSDs using Gen 3 XL-FLASH technology, achieving over 20 million IOPS. The company also unveiled the LD4, a PCIe 5 E1.L QLC SSD with 15.36 and 30.72 TB capacities. This launch targets AI infrastructure demands but currently shows no immediate impact on spot prices.
According to an October 08, 2026 report, Delta Electronics has opened an Automation & Robotics Center in Stuttgart where customers, partners and system integrators can test the company's robots and automation solutions. The centre covers approximately 600 square metres and around seven engineers will be based at the site; it will be used for technology demonstrations, proof-of-concept development, customer workshops, technical training and application engineering. Applications displayed at the opening included Delta's D-Bot collaborative robots, among them a palletising solution, a material flow demonstration in which the D-Bot DC20 and DC30 work together, and a robotic dry welding application. As background, Delta joined the Stuttgart-based research campus ARENA2036 in 2025.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and ZuriQ AG, a Swiss quantum computing company spun out of ETH Zurich, today announced the expansion of their collaboration to advance scalable quantum computing hardware. The partnership combines ZuriQ's trapped-ion quantum computing architecture with Infineon's expertise in semiconductor manufacturing, advanced packaging, and integrated photonics. Previous development work demonstrated feasibility of the architecture by trapping a 3×3 array of nine individually controlled ions, achieving the largest two-dimensional array of its kind to date; the next step is to scale the technology to significantly larger qubit counts. ZuriQ has developed a natively two-dimensional Penning micro-trap architecture that uses electric and magnetic fields to move ions directly across the chip, avoiding complex junction structures and making it easier to accommodate larger qubit arrays. This is a planned expansion of collaboration and has not been shown to involve any price movement or capacity figures.
Keysight Technologies, Inc. (NYSE: KEYS) announced the Velocity 4900 Series, a new line of cost-effective Layer 1 automation switches designed to automate physical connectivity in network test labs through software-controlled testbed configuration, supporting testing for networks and infrastructure for AI, 6G, and next-generation services. The first two models: the Velocity 4902 is a high-speed Layer 1 automation switch supporting Ethernet speeds from 100 Mbps to 100 Gbps, with 72 QSFP28 ports supporting 288 connections with breakouts; the Velocity 4906 is a high-density Layer 1 automation switch with 288 SFP28 ports supporting Ethernet speeds from 100 Mbps to 25 Gbps. Both switches provide true Layer 1 forwarding through an ultra-low-latency, fully transparent switching matrix, support single-mode fiber, multimode fiber, direct-attach copper, and active optical cables, and include port tapping for diagnostics and one-to-many traffic replication. According to the source, the product addresses test-lab bottlenecks such as reliance on manual cabling and physical topology changes that leave equipment underutilized and slow testing. The Velocity 4902 and 4906 are available for order immediately, with initial deliveries planned for January 2027.
VONK has launched the NEYA 3.0 Hydrogen Power Conversion Platform, the latest generation of its power-conversion platform for large-scale hydrogen electrolysis. The platform features a standardized architecture to improve grid interaction, installation efficiency, system integration, and maintenance. VONK will publicly present NEYA 3.0 at the Hydrogen Technology World Expo Europe in Hamburg from 20 to 22 October 2026, showcasing it at stand 5F32.
A study led by Chalmers University of Technology suggests that batteries capable of bypassing weak cells could keep electric vehicles on the road longer and lower the total cost over the battery's lifetime; under optimal conditions, lifespan increases by more than 20%. In the researchers' models, the most advanced solution – where each cell can be controlled separately – can extend lifespan by over 20% in some high-voltage vehicles, such as electric trucks and long-range electric cars, though in practice groups of cells are more likely to be controlled together, making that figure a theoretical upper limit. The researchers also modelled a typical 80 kWh car battery with an annual mileage of 12,000 kilometres: a conventional pack is assumed to be replaced after 10 years, in line with current industry practice, while the reconfigurable pack reached the same point after about 11 years, roughly 14 months later, and had a higher residual value because it had aged less. The extra electronics make the technology more expensive up front, but the researchers state that the longer service life and higher residual value can outweigh that additional cost under many realistic conditions; the potential is greatest in high-voltage, long-range vehicles with many series-connected cells. The approach could also affect battery manufacturing by reducing the need for precise cell matching and allowing more packs to get a second life, for example as stationary energy storage.
EV battery packsreconfigurable battery packsEvertiq
The industry is shifting to mmWave frequencies above 30GHz and adopting waveguide technologies to address signal loss. Traditional interconnects are becoming obsolete, prompting a transition to GaN as a viable alternative to GaAs in high-frequency applications.
Infineon and ZuriQ plan to expand their collaboration to scale qubits; they have demonstrated the feasibility of the architecture by trapping a 3×3 ion array, the largest two-dimensional array of its kind to date; the next step is to scale the technology to significantly larger qubit counts.
On Oct. 08, 2026, Deloitte India and Avolution announced a strategic alliance to help organisations strengthen enterprise architecture capabilities and make more informed technology and transformation decisions through Avolution's ABACUS platform. Under the alliance, Deloitte will lead the implementation of ABACUS, leveraging its technology strategy and transformation expertise to help clients address the growing complexity of modern technology environments while accelerating AI adoption and innovation. ABACUS's adaptive enterprise modelling and impact analysis capabilities support Deloitte in assessing dependencies and the potential risk and delivery implications of change, while its AI governance capabilities help organisations track AI model usage, risk and compliance across the enterprise. The alliance will initially focus on banking, insurance and financial services organisations across South Asia, with India serving as the lead market. Looking ahead, Deloitte India and Avolution plan to expand the joint offering through industry-specific business architecture frameworks, enhanced enterprise transformation capabilities and integrated value realisation services, and will also explore opportunities across government, healthcare, telecommunications, manufacturing and energy.
ABACUS platformDeloitte India, AvolutionGlobeNewswire SemiconductorsPartnership/M&A
In the latest update of its RF GaN Technology Patent Monitor, KnowMade says that more than 110 new RF GaN patent families were published during second-quarter 2026, with China comprising the majority of them. This is background patent-activity information; the source does not state the cause, and no price, production or supply change is involved.
Omnivision has introduced the OG05D, a 5-Mpixel global-shutter CMOS image sensor with a 2.2 µm pixel size, offering one of the smallest global-shutter pixel sizes with HDR in its class. It is designed for industrial machine vision applications, including compact AI cameras and humanoid robotics, particularly data-collection devices for robotics training. The sensor delivers up to 146 fps in linear mode without crypto, making it 143% faster than the previous-generation sensor; it reaches 130 fps in linear mode with crypto and 60 fps in both 3-exposure HDR and single-exposure dual conversion gain (DCG) HDR. It uses Nyxel NIR technology to achieve QE of more than 55% at 850 nm and more than 35% at 940 nm. The OG05D has a 1/2.525-in. optical format and comes in a compact 56-pin CSP. The image sensor is sampling now, with mass production scheduled for Q4 2026.
According to STAR Market Daily, semiconductor testing demand is surging as increasingly complex AI chips require more intensive processes, tightening available capacity; OSAT provider Sigurd Microelectronics has posted monthly revenue above NT$2 billion for three consecutive months, and customers are increasingly signing long-term agreements to secure testing capacity — most have signed capacity agreements lasting more than a year, others have reserved capacity through dedicated equipment, and some memory customers are even willing to pay premiums to lock in capacity. On pricing, Sigurd said it could not speak for the industry but confirmed that it has already begun raising its own prices. Per TechNews, AI, CPUs, GPUs, ASICs, and silicon photonics generated about NT$3.7 billion in revenue for Sigurd in the first nine months of 2026, up from roughly NT$2.5 billion a year earlier, with their share of total revenue rising from 20% to 24%, and the company expects the share to exceed 30% in 2027. Silicon photonics is also a key growth driver: Sigurd has expanded its optical communications testing capabilities to cover EICs, PICs, and optical engines, spanning testing technology, R&D engineering, and volume production. Strong demand is accelerating capacity expansion: Sigurd's second Hukou plant began production in July, with about 40% of capacity online as of October and already locked in by customers; Zhongxing Plant 3 is scheduled for completion in the fourth quarter of 2026 and volume production in the first quarter of 2027. Sigurd has raised its 2026 capex to NT$8.8 billion, 48% above its original plan, focused on advanced testing equipment, and is in discussions with several key customers and could raise capex again in the coming months. As background: per Seoul Economic Daily citing Nomura Securities, NVIDIA Blackwell's final test time is estimated at four times that of Hopper, while Rubin could require seven times as long, with testing's share of GPU manufacturing costs projected to rise from 1.9% for Hopper to 2.5% for Blackwell and 3.3% for Rubin; per ETNews, Digital Frontier and UniTest have secured a combined KRW 283.94 billion in HBM4 wafer tester orders from SK hynix this year, and as HBM complexity increases, more test items and longer testing times could drive testing equipment demand to grow faster than HBM output itself.
AI芯片测试产能HBM4晶圆测试机硅光子（EIC、PIC、光引擎测试）Sigurd Microelectronics, SK hynix and 5 totalTrendForcePrice Movement
Related manufacturers
Sigurd Microelectronics, SK hynix, Digital Frontier, UniTest, NVIDIA
Toshiba Electronics Europe launched the IX800FXF2YMS4, a 3300V/800A SiC MOSFET module featuring third-generation technology and silver sintering. This product targets high-power applications including railway traction and UPS. The launch indicates Toshiba's product expansion but does not currently affect supply or pricing.
SiC MOSFET ModuleSilicon Carbide MOSFETToshiba Electronics EuropePower Electronics NewsProduct Launch
Intel CEO Lip-Bu Tan told reporters on Wednesday (as reported on 7 October 2026) that Intel will remain part of Elon Musk's Terafab project. Back in April, Intel and Terafab, the semiconductor production venture by SpaceX, Tesla, and xAI, announced that the new chipmaker would use Intel's next-generation 14A fabrication process to make chips; details of the collaboration are still unknown, though there is a general understanding that Intel will license its manufacturing technology to Terafab, with unclear whether it will also help ramp up production on the node. Around the same time, Musk debunked rumors that his companies would invest in Terafab and then partner with TSMC, which would build and operate the fab, saying "No, we will build and run the fab," and proposing instead that TSMC sublease part of Terafab to make chips for its customers if it wants, "but nothing more than that." The sublease remains only Musk's proposal; the report notes his X statements are deliberately vague and raises questions about equipment qualification, IP isolation, and operational responsibility in such an arrangement.
Intel 14A fabrication processIntel, TSMC and 6 totalTom's HardwarePartnership/M&A
imec expands its IC-Link collaboration with TSMC to provide managed cloud services for EDA flows and advanced packaging support via the 3DFabric Alliance.
Seagate and Toshiba are reportedly competing to acquire TDK's HDD magnetic head business, a multi-billion dollar deal that would consolidate the industry's only independent supplier. This acquisition threatens to disrupt Toshiba's sole supply source and alter the competitive balance of the HDD market. Traders should watch for the outcome as it impacts pricing power and supply security.
HDD Magnetic HeadsSeagate Technology, Toshiba and 3 totalTom's HardwarePartnership/M&A
TDK expands the MLJ1608-G series multilayer inductors for automotive power-over-coax (PoC) circuits, with mass production starting in October 2026; the component provides 1.7 to 2 times higher impedance than conventional parts in the 100–700 MHz range, achieves high impedance up to 2 GHz, and has a 1608 footprint.