ROHM Semiconductor is partnering with Aixtron to install a G10-GaN MOCVD system at its Hamamatsu plant to produce 8-inch GaN epitaxial wafers for 650V and 100V power devices. This move establishes in-house GaN epitaxy capabilities. Traders should watch for supply stability improvements and potential cost reductions in ROHM's power device portfolio.
TSMC unveiled roadmap updates for A12, A13, and N2U processes at the 2026 Europe Technology Symposium, targeting 48x more transistors in advanced packaging. The updates aim to support future AI development through design-technology co-optimization. Watch.
Wolfspeed launched its fifth-generation SiC MOSFET technology for 1200V and 750V automotive and industrial applications, highlighting significant efficiency improvements.
This article details the technical process of compiling and deploying arc-fault detection models on microcontrollers (MCUs), addressing the challenges of moving models from lab environments to resource-constrained edge devices.
Synopsys introduces customized Foundation IP to support next-generation automotive compute requirements driven by software-defined vehicles. As automotive SoCs demand higher performance and reliability, FinFET technology and tailored IP libraries become essential. Neutral - This article highlights a technology trend and R&D milestone rather than immediate supply or price impacts.
Positronic's SCBM mixed-density Combo-D connectors are now available through Powell Electronics, covering 22 variants. Designed for spaceflight and harsh environments, they support up to 70A current. Bullish: Confirms supply chain availability for high-reliability defense and aerospace applications.
MIPI Alliance demonstrated 8Gbps SerDes interoperability between Sony, Southchip, Valens, and Velinktech at AutoSens USA. This event highlights the ecosystem's maturity and the launch of the A-PHY Compliance Program. The development supports long-term adoption in ADAS and SDV systems but shows no immediate price impact.
Ainekko announced its CORE-ET Silicon Platform (ETSP) acceptance into the OpenHW Foundation as an open-source project. The platform utilizes a many-core 64-bit RISC-V architecture and MRAM-based memory for edge AI inference. This ecosystem initiative has no immediate impact on component pricing or supply.
Vishay Intertechnology introduces four series of 3000 W TVS diodes in the DFN6546A package for automotive and industrial applications. The new devices feature wettable flanks for AOI and high-temperature operation up to +185°C. This product launch is neutral for existing inventory trading as it targets new applications rather than addressing immediate shortages.
Minisforum unveiled the All-Flash S5 and N5 MAX at Computex 2026, featuring Intel Wildcat Lake and AMD Strix Halo processors with up to 200TB storage. These devices target AI development and storage-intensive workflows. Neutral: New product launch with no immediate supply chain impact.
Rumble and Together AI signed a multi-year agreement for dedicated NVIDIA HGX B300 GPU capacity. This deal validates Rumble's independent infrastructure strategy and secures long-term revenue visibility. Bullish for RUM stock and Blackwell GPU demand.
Direct Insight launches the QS91 SoM featuring NXP's i.MX 91 processor, measuring 27x27mm. Targeting Linux-based IoT, it offers a cost-effective alternative to the i.MX 93. Neutral - New product launch with no immediate supply constraints or price impact.
Bourns Inc. launched the MH3261-T series high-current ferrite beads, offering up to 11A current ratings and a compact 3.2x1.6mm footprint for high-density power applications. The components feature low DC resistance and wide impedance ranges to support efficient EMI suppression in space-constrained systems. Neutral impact on current pricing; signals capacity expansion in passive components.
Infineon Technologies introduced the industry's first 750V silicon carbide bidirectional switch based on CoolSiC Gen2 technology, targeting automotive and AI data center power applications. The device integrates two dies in a single top-side-cooled Q-DPAK package. Trading impact is neutral as the product is currently in the sampling phase with no immediate effect on existing spot market pricing.
Researchers from UT Austin and Harvard published a paper on surface modification for III-V selective area MBE. The technology aims to seamlessly integrate metals and dielectrics into crystalline materials for novel optoelectronic devices. No immediate trading impact on current component supply or pricing.
Kioxia plans an average annual capex of ¥470 billion for FY2026-2028, up 66% from FY2025, to fund a potential third Kitakami fab. Despite current utilization at ~50%, supply-demand is expected to remain tight through 2027 driven by an 86% CAGR in inference AI NAND demand. Bullish for NAND pricing and supply constraints.
Power Integrations released two new GaN-based auxiliary power supply reference designs optimized for 800V AI data center architectures. The designs utilize 1700V PowiGaN technology to reduce board area and BOM by 30%. Neutral: While highlighting GaN adoption in AI infrastructure, it presents no immediate trading or pricing impacts.
Nvidia partnered with MediaTek to launch the Arm-based N1X processor. This move aims to meet global AI demand, increasing supply choices and intensifying competition against x86 rivals like Intel and AMD. Watch for long-term shifts in PC and server demand patterns.
Invisix, founded by ASML alumni, secured €20 million in seed funding to develop soft x-ray metrology systems using High Harmonic Generation (HHG) technology. This aims to address measurement challenges for advanced logic and memory nodes. Impact: Neutral for immediate component markets; significant for future equipment landscape.
Infineon joins Nvidia's MGX ecosystem to support 800 VDC power architectures for AI data centers, utilizing GaN and SiC technologies. This collaboration aims to enhance power density and efficiency. Bullish: Expected to drive demand for GaN and SiC power devices in AI infrastructure.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass chip map: 12 modules, 37 checkable identifiers (31 A / 6 B) and 19 public MPNs (16 externally searchable); A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.All teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |