Yole forecasts the xEV power-device market to reach $14.5 billion by 2031, with SiC MOSFETs growing at a 21.5% CAGR. Driven by 800V architectures and Chinese BEV demand, SiC and GaN adoption is accelerating, though SiC manufacturers face overcapacity risks.
ZJ InnoLight subsidiary invested approximately 2.32 billion RMB to acquire a 1.04% stake in PCB giant Avary Holding. This strategic move integrates optical transceiver supply chains with high-end PCB manufacturing, specifically targeting AI server and 800G/1.6T optical module markets. Watch: Avary Holding announced an 11 billion RMB investment to build a high-end PCB base, indicating capacity expansion driven by AI demand.
Cissoid has discontinued products based on its second-generation HADES gate driver chipset, including IPMs and ICMs, due to the discontinuation of X-FAB's Xi10 process. The company is accelerating the release of a third-generation redesign on a new fab, expected as early as next year. Bearish: The EOL of the 2nd gen products will trigger immediate supply shortages and price increases.
NXP broke ground on a new assembly and test factory in Malaysia, adding 500,000 square feet to expand its operations. The facility, ramping up in Q1 2028, aims to double output and support future growth from joint ventures in Singapore and Germany. Bearish for prices due to increased supply capacity.
Navitas Semiconductor filed a patent infringement lawsuit against Renesas Electronics in the U.S. District Court for the Eastern District of Texas, alleging infringement of four GaN patents. The lawsuit targets Renesas' SuperGaN product lines and aims to protect Navitas' IP portfolio in the high-power AI infrastructure market. Watch: This legal action may reshape the competitive landscape of GaN power semiconductors but is unlikely to impact spot prices in the short term.
Samsung Electronics' HBM4 yield has approached 80%, a significant improvement since mass production began. This enhancement strengthens its competitiveness against SK Hynix in terms of volume and cost. Bearish: Improved yield increases supply and alleviates HBM market shortage pressure.
Keystone Electronics launches a new SMT 5mm glass fuse holder rated 10A/500VDC, available in stock. The product features tape and reel packaging for automated assembly and is compatible with standard 5x20mm fuses. The impact on existing market prices is neutral.
Swedish Nolato acquires Irish M&M Qualtech for approximately SEK 385 million to expand capacity in medical, industrial, and defense electronics. The deal strengthens Nolato's product offering and customer base. Bearish for prices due to increased supply capacity.
Navitas Semiconductor has filed a patent infringement lawsuit against Renesas Electronics. The case involves GaN and SiC power IC technology and was filed in the US District Court for the Eastern District of Texas.
Sager Electronics has been designated as Power-Sonic's first certified value-add reseller, leveraging Sager's engineering and testing capabilities for custom solutions.
该合作强化了Power-Sonic在北美市场的渠道服务能力，但短期内对现货价格影响中性。
India is accelerating its semiconductor ecosystem with new packaging capacity and tax incentives. Investments by ASIP, Dixon, and Rashi highlight a focus on higher-value manufacturing and sovereign AI capabilities. Watch: Policy-driven long-term restructuring of the supply chain.
iQ Sense is developing a photonic integrated circuit (PIC) platform for continuous in vivo biochemical monitoring in animals, utilizing heterogeneous integration and AI. The technology relies on mature components like photonics and mixed-signal design to shrink lab capabilities onto a millimetre-scale chip.
Musk's Terafab facility spans 10 million sq. ft and will produce logic, memory, and AI chips to meet SpaceX and Tesla's 1PW compute demand. Despite Jensen Huang calling it 'extremely hard,' Intel CEO Lip-Bu Tan views Musk as the ideal partner for unconventional manufacturing. This is a significant capacity expansion plan requiring close monitoring.
Inventec reported a 33% drop in notebook shipments in July (1.6M vs 2.4M in June) and forecasts a single-digit percentage decline in Q3. This follows customer-led inventory drawdowns in H1. Bearish for notebook component pricing due to weakening demand.
Samsung Electronics and Netlist have settled patent disputes and signed a five-year strategic alliance, including a cross-license of server DIMM and HBM technologies and a supply agreement for DRAM and NAND. Samsung also invested in Netlist by purchasing 10 million shares of common stock. This deal validates Netlist's IP value and provides immediate financial support.
Samsung unveiled a new generation of 3D memory products at FMS 2026, targeting AI infrastructure performance and energy efficiency. The portfolio includes DRAM, NAND, and enterprise storage solutions. Neutral impact on current supply chain pricing.
The global semiconductor market is projected to grow 98.3% in 2026, with the memory sector surging 298% due to AI demand. HBM capacity shifts are tightening mainstream DRAM supply, driving average selling prices up 268%. Bullish, this structural shortage signals sustained price increases across the technology supply chain.
Power Integrations (PI) announced the industry's first 2.2 kV lateral GaN switch under its PowiGaN portfolio. This technology demonstration targets high-voltage applications like data centers and EV auxiliary supplies.
This milestone indicates a shift toward higher-voltage GaN for improved power density.
Samsung Electronics showcased zHBM at FMS 2026, a next-gen 3D memory architecture promising 8x HBM5 performance. The technology aims to place memory closer to GPUs to address AI compute bottlenecks. This represents a significant technological shift in high-performance memory.
ESCATEC added two ASMPT SX pick-and-place modules to its UK facility to enhance medical manufacturing capacity. This investment aims to improve efficiency and support rapid NPI projects. The move signals a capacity expansion that could increase supply for medical electronics.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |