Aratas America LLC launched the G3VH high-load-voltage SiC MOSFET relay, supporting 1,800V and 3,300V load voltages. The relay utilizes SiC technology for high voltage withstand capability and low on-resistance, targeting applications like semiconductor test equipment. Neutral signal.
BEL and Ananth Technologies signed an MoU to collaborate on the design and manufacturing of advanced electronic systems for defense and aerospace applications, including missiles and radars.
MacDermid Alpha is showcasing solder and sintering technologies designed to improve attach consistency in high-volume power electronics manufacturing. This highlights a focus on process optimization rather than immediate supply constraints. Neutral impact on current market pricing.
TT Electronics has secured a multi-million pound lifetime contract with Rolls-Royce to supply mission-critical power electronics, including multi-chip power modules and precision magnetics, manufactured in the UK. This agreement extends a 40-year partnership and confirms long-term demand visibility for TT's specific power components. Bullish for TT Electronics' long-term revenue outlook.
SK hynix published a technology roadmap for co-packaged optics (CPO) in Nature Electronics, emphasizing the shift in AI competition towards system-level integration.
Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display in Q2 2026 ahead of schedule. This move was driven by AI-related demand lifting memory prices and strengthening the company's cash position.
Norwegian supplier Confidee reports standard FR-4 and copper-clad laminate shortages spreading from advanced materials, with lead times extending and pricing volatile through 2027.
CACI International opened a 61,000-square-foot manufacturing facility in Rochester, NY, increasing its defence electronics capacity by 300%. This facility serves as the primary production hub for electronic warfare systems for the US Army. The expansion indicates a strategic move to secure supply for defence electronics components.
Cerebras Systems launched the CS-4 AI accelerator, achieving up to 30x faster performance than GPU solutions. Built on three WSE-3 Turbo chips, it delivers 750 PFLOPs of compute and 10x throughput per watt. Bullish: The launch signals a significant competitive threat to incumbent GPU providers in the AI inference market.
Pixus Technologies has released the MIL Rugged N310 Software Defined Radio (SDR) with an extended temperature range of -40°C to +71°C. Based on the Ettus USRP family, the unit features external MIL-grade cooling and heating options. Neutral: This is a new product launch with no immediate impact on supply or pricing.
Samsung Foundry delays 1.4nm mass production to 2029, sticking with 2nm for three years. TSMC plans 1.6nm A16 mass production in H2 2026, while Samsung delays High-NA EUV adoption. Neutral. This is a roadmap adjustment with no immediate impact on spot prices.
Samsung Display plans to expand OLED production capacity in Asan (Plant 2) starting 2027, targeting completion in early 2028, driven by foldable demand and Apple's rumored entry. Concurrently, rising memory costs are expected to keep mobile manufacturing expenses elevated in 2H26.
Yole Group forecasts the xEV power device market to reach $14.5 billion by 2031, recovering from a 2024-2025 slowdown. The report projects xEV production will account for 70% of global light vehicle production by 2031. Bullish: The 14% CAGR indicates strong future demand for power electronics.
Phison CEO Pua Khein-Seng predicts NAND Flash supply tightness will persist for years due to AI demand, with 2027 capacity constraints expected to be more severe than 2026, leaving room for further price gains. Bullish: Supply shortage and price increase potential.
Samsung Electronics' sales to China and the US surpassed the US in the first half of 2026, driven by an AI-driven memory upcycle. Despite strong ties with Nvidia in HBM, Nvidia is not among the top five customers. Bullish signal indicating robust demand for AI memory.
Samsung and SK Hynix are waging a hiring war for HBM4 talent, exacerbating South Korea's semiconductor design talent shortage by poaching key engineers from fabless companies, despite tighter restrictions complicating movement between the giants.
Ukrainian intelligence discovered an Nvidia Jetson Orin NX 16GB (TE980M-A1) in a Russian missile, bypassing sanctions. Impact: Neutral for component pricing; highlights secondary market loopholes in export controls.
Researchers from TSMC and National Yang Ming Chiao Tung University engineered a 0.42-nanometer aluminum-oxide interface for monolayer MoS₂ transistors, enabling strong gate control. This breakthrough addresses interface defects in 2D semiconductors but has no immediate impact on current trading prices or supply chains.
NoMIS Power demonstrated a 6.5 kV SiC MOSFET with >8 kV blocking voltage and 90 mΩ Rds(on), currently in sampling. Mass production is scheduled for Q4 2026, extending their roadmap to 10 kV+ devices.
Delta Electronics and Lite-On Technology are increasing capital expenditure to 9% of revenue to meet the surging demand for power and cooling solutions in AI data centers. Chipmakers like Nvidia and AMD are refreshing platforms annually, driving up power density and thermal requirements. This capacity expansion is necessary to avoid missing design cycles amid intense competition.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |