Excellence Optoelectronics (EOI) plans to launch AI optical communication samples in early 2027 and targets a 2026 recovery driven by top five customers. The company is expanding in Mexico and adding non-headlamp automotive electronics.
AMD CEO Lisa Su is scheduled to visit South Korea in October 2026 to deepen cooperation with Samsung Electronics on HBM4 and NPU technologies. This follows her March visit which launched next-gen AI memory collaboration. Watch: Strategic alliance expansion may influence future supply stability.
The UK Semiconductor Catapult has restructured and shifted its strategic focus toward AI hardware, RF, and SST technologies to enhance sovereign capabilities and supply chain resilience.
UK government prioritizes semiconductors for national growth and security, launching the UK Semiconductor Centre to coordinate industry activity and foster regional clusters.
Samsung Electronics is accelerating its sub-10nm DRAM production strategy by shifting to the D0a node and utilizing hybrid bonding technology. This roadmap update indicates a focus on increasing capacity and efficiency for next-generation memory. The expansion of production capacity is likely to exert downward pressure on spot prices.
Samsung Electronics plans to increase HBM4 production capacity by 2.5 times by 2027 to meet surging AI chip demand. This significant expansion signals a future supply increase, which typically exerts downward pressure on spot prices.
Samsung foundry recovery is accelerating with higher utilization and firmer pricing, though sustained profitability depends on 2nm yields and the Taylor fab ramp.
Acer and Phison Electronics hold divergent views on the DRAM market outlook, with PC memory supply easing while AI and server demand constrain the broader market.
Alix Paultre interviews Texas Instruments Product Line Manager Mayrim Verdejo about managing rising design complexity in embedded innovation.
Samsung and SK Hynix are shifting production capacity to HBM, tightening conventional DRAM supply and allowing CXMT to gain market share without price competition. This structural shift is bullish for DRAM pricing.
TDK expands its B43645-B43661 series aluminum electrolytic capacitors to 500V rated voltage for AI server power supplies. This capacity expansion targets high power density requirements in data centers.
Global DRAM module revenue reached $21.2 billion in 2025, surging 59% year-over-year. This growth was driven by rising prices and concentrated shipments in the second half, fueled by tariff-driven inventory buildup and DDR4 end-of-life plans. Bullish signal for DRAM pricing and supply constraints.
CXMT announced mass production of its 24Gb LPDDR5X DRAM using quadruple patterning, achieving a 11.95nm half-pitch. This places CXMT's process capability on par with industry leaders. Bearish for traders as increased supply from a competitor pressures pricing.
The DRAM and NAND crisis deepens as SLC and NOR Flash face severe undersupply due to AI demand. Data center gold rush routes capacity to profitable products, devastating other supply chains. Bullish: Severe shortage threatens everyday electronics.
Terafab faces a trademark dispute with Tera-Print, halting its chip production plans before the first unit is made. The conflict centers on the use of the name for high-volume manufacturing versus Tera-Print's tabletop lithography tools. Settlement talks are reportedly ongoing.
TrendForce reports contract prices for NOR Flash and SLC NAND rose over 100% in H1 2026, with SLC NAND expected to climb another 120%-170% in H2. Morgan Stanley and JPMorgan warn of severe supply shortages as capacity is reallocated to higher-margin chips.
AI infrastructure spending is driving persistent DRAM shortages expected through 2027. This supply constraint is forcing consumer electronics manufacturers to lower their priority in the supply chain. The market faces sustained upward pressure on prices.
Lead times for semiconductor equipment components have reportedly doubled, reaching up to 40 months, driven by surging AI demand and limited capacity expansion. This supply crunch is causing delivery delays for major equipment makers like Applied Materials and ASML. Bullish for prices due to persistent shortages.
On September 17, 2026, Texas Instruments (TI) (Nasdaq: TXN) announced it will raise its quarterly cash dividend 7%, from $1.42 per share to $1.52, or $6.08 annualized. The higher dividend will be payable November 10, 2026, to stockholders of record on October 30, 2026, contingent upon formal declaration by the board of directors at its regular meeting in October. The company said the increase is consistent with its long-term objective of providing a sustainable and growing dividend and reflects its continued commitment to return all free cash flow to its owners over time, and that the announcement marks 23 consecutive years of dividend increases. The release also includes forward-looking statement risk disclosures.
Winbond will acquire Infineon's NOR Flash business for $1.12B, lifting its market share to over 30%. This deal coincides with a 100-120% surge in NOR Flash prices driven by supply constraints. Bullish: M&A strengthens leading player's share amidst tight supply.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |