Researchers at UC Berkeley, Samsung Electronics, and Intel published a research paper titled “Nanoelectromechanically Gated Gain Cell eDRAM.” An abstract excerpt states that the memory wall and the slowdown of static random access memory (SRAM) scaling have renewed interest in gain-cell embedded dynamic random access memory (DRAM); while gain cells offer high density and energy efficiency, they suffer from limited retention. This is a research publication treated as background information; the source does not mention prices, capacity changes, or commercialization arrangements.
gain-cell embedded DRAM (eDRAM)SRAMSamsung Electronics, IntelSemiconductor Engineering
According to Commercial Times, citing institutional investors, Google's TPU v9 project, involving MediaTek, could see its initial tape-out delayed until January 2027 following design revisions, with shipments potentially pushed back to the first quarter of 2028; the November 2026 sampling target remains unchanged, and the production-version tape-out is expected in the second quarter. The report notes that revisions to Google's TPU v9 Core A design, codenamed Humifish... wait, Humufish, have delayed development by approximately three weeks, affecting the Core B and I/O designs handled by MediaTek. According to TrendForce, the chip is expected to adopt Intel's EMIB-T advanced packaging, with substrate yields remaining a key challenge to production scalability and cost competitiveness. Bloomberg, citing sources, reports that ByteDance is nearing an agreement to purchase MediaTek's data center chips, potentially making it MediaTek's second major ASIC customer after Alphabet's Google. Among Taiwanese ASIC design firms: GUC, supported by cloud customers' CPU and ASIC programs, reported record September revenue of NT$7.145 billion, up 97.8% year over year; Alchip posted September revenue of NT$9.979 billion, surging 496% year over year as shipments of 3nm AI accelerators increased. Faraday has obtained Samsung's 2nm process design kit (PDK) to pursue related design opportunities; per Commercial Times, Samsung's 4nm capacity is reportedly fully utilized, prompting some AI ASIC customers to evaluate its 2nm node. Faraday has also completed its design environment setup for Intel's 18A-P and begun offering design services, with plans to pursue more projects in 2027. Commercial Times, citing institutional investors, projects global AI ASIC accelerator shipments to reach 14.1 million units in 2027, up approximately 69% year over year.
Google TPU v9Core A (codenamed Humufish)Core BMediaTek, Google and 11 totalTrendForce
According to Seoul Economic Daily (with ZDNet having reported in September that Samsung is pursuing a dual-track strategy for custom HBM, tapping both its own foundry and rival TSMC), NVIDIA has asked Samsung, SK hynix and Micron to adopt TSMC's 3nm process for the base dies of its NVHBM, unveiled in August. Samsung's Device Solutions (DS) division reportedly agreed to the requirements following an internal review. The stated causes are NVIDIA's push to standardize production across suppliers to ensure consistent HBM performance and simplify product validation; additionally, industry estimates place TSMC's 3nm yields above 90%, versus around 60% for Samsung Foundry's 2nm (SF2) process. NVHBM's custom base die integrates the memory controller traditionally housed in the GPU; according to NVIDIA, the technology offers up to 30% more memory bandwidth, 15% lower HBM power consumption and 25% more XPU compute die area than standard HBM4E. The partnership is not entirely new: according to Seoul Economic Daily, Samsung and TSMC first collaborated four years ago to ensure HBM compatibility with TSMC's GPU packaging process, and this latest tie-up extends into HBM manufacturing for the first time. Samsung is keeping its own foundry in play: with TSMC's 3nm capacity facing competing demand from AI accelerators and smartphone chips, Samsung is validating NVHBM base die production on its 2nm process as a potential alternative should TSMC face capacity constraints. TSMC flagged tight 3nm capacity at its October 15 earnings call, with the node accounting for 33% of third-quarter wafer sales, its largest share among all process nodes; according to Economic Daily News, Chairman and CEO C.C. Wei announced plans for another 3nm fab in Tainan, on top of existing expansion projects in Arizona, Japan's Kumamoto and Taiwan's Southern Taiwan Science Park, with the additional fab slated to begin mass production in the first half of 2028. Samsung also continues in-house base die production for its standard HBM lineup: HBM4, which entered mass production earlier this year, and HBM4E, now undergoing production validation, both use Samsung Foundry's 4nm process for base dies, while their core dies are manufactured on 1c DRAM lines at its Hwaseong and Pyeongtaek campuses; Samsung plans to maintain its turnkey approach to base die production for custom HBM supplied to other customers, including AMD.
NVHBMNVHBM base dieHBM4NVIDIA, TSMC and 5 totalTrendForcePartnership/M&A
The source is an interview with Francisco Almada Lobo, CEO and co-founder of Critical Manufacturing. The company was founded in Porto, Portugal, in 2009 and builds an Industrial Operations Platform with a manufacturing execution system (MES) at its core; since 2018 it has been part of ASMPT. Its strongest application area is semiconductor back-end and advanced packaging, which it says is also where demand is growing most. It notes new capacity is being built in the US, Europe, India and Southeast Asia, and that advanced packaging moves front-end complexity into the back-end. This is background interview content; the source contains no component price movement, production halt, or policy event.
Rising memory prices and tightening supply are reportedly pushing some Chinese smartphone makers to turn to salvaged memory chips. According to TechNews, some brands are said to be sourcing memory chips recovered from discarded phones, potentially including used iPhones, through traders in Shenzhen's Huaqiangbei electronics market. Sources say memory procurement costs have surged, with some chips reportedly costing up to RMB 500 more per unit; the Shenzhen local government is also rumored to be offering smartphone brands subsidies of around RMB 300 per unit, leaving manufacturers to absorb roughly RMB 200. Unable to fully pass on the increases, some brands are reportedly cutting production and sales volumes to limit losses. TechNews notes the reported price increases, subsidies, and use of salvaged chips have yet to be confirmed by Chinese authorities or the companies involved, and such chips are largely limited to ultra-low-cost, unbranded smartphones and are unlikely to enter flagship supply chains. As background: TrendForce says AI server demand continues to squeeze DRAM supply, with shortages and price increases expected to persist into 2027; TrendForce projected global smartphone production would fall 14% year over year to approximately 1.07 billion units in 2026, a forecast revised upward due to earlier-than-expected purchases and restored production. Caijing's April investigation found a Shandong recycler purchased around 1,000 discarded phones in March and dismantled more than 600 for potential chip resale, with some nonfunctional devices reportedly fetching more than RMB 100 each; some recyclers preferred Android phones from OPPO, vivo, and Huawei, while sources told TechNews that Huaqiangbei traders primarily purchased used iPhones. A September STAR Market Daily investigation found refurbished chips can serve lower-end applications such as automotive accessories, IoT devices, and overseas refurbished phones, but analysts cautioned that salvaged chips face yield losses and compatibility risks, and recycling premiums could quickly disappear if major chipmakers adjust production.
Kulicke & Soffa reported fiscal Q3 2026 net revenue of $330.4 million, up 123% year-over-year, with gross margin of 47.8% and non-GAAP EPS of $1.20, beating expectations. The company guided to roughly $375 million for Q4 fiscal 2026 ending October 3, 2026, citing strengthening demand across semiconductor, memory, automotive, and industrial markets.
On October 17, 2026, Taiwan announced it will add AI servers and the latest chips to its controlled export list to align its policies with U.S. trade bans; the revised Foreign Trade Act will impose penalties of up to five years imprisonment and/or a fine of about $92,500 for smuggling these items once the controls take effect. The move follows a U.S. tariff agreement and a raid on Super Micro, after U.S. authorities accused Super Micro employees of smuggling $2.5 billion worth of AI servers; months later Taiwanese authorities raided Super Micro’s Taipei office, leading to the indictment of nine individuals. Taiwan currently does not treat AI chip exports to China as a crime, and the new controls are not yet in effect.
Samsung Electro-Mechanics (Semco) faces potential equipment procurement bottlenecks in its KRW6.78 trillion (approximately US$5.1 billion) expansion of semiconductor substrate production for AI servers, as machinery manufacturers struggle with component shortages and longer delivery times; the company says its investment is proceeding as planned and no production delay has been confirmed.
semiconductor substrateSamsung Electro-MechanicsDigiTimes Asia
According to Tom's Hardware, published 16 October 2026, Chinese startup Langdao Silex (established in 2024 by Tsinghua University's Gas Discharge Plasma Laboratory alumni) demonstrated a prototype EUV light source with over 15W of output power, 90% domestic components, and decent uptime at the 26th China International Industry Fair in Shanghai, without lighting it up. The FlintNano LPP-OXXO system uses laser-produced plasma (LPP) technology with a 1,000W driving laser operating at 1kHz–20kHz, conversion efficiency exceeding 2%, brightness of 100 W/(mm²·sr), continuous operation of over 100 hours, plasma stability of 3% RMS and EUV output power stability of 5%; however, its output remains insufficient for high-volume chip production, and the company has not disclosed whether the 15W is measured at the plasma or at intermediate focus. Per TrendForce, citing various sources, the company will need another three to five years to commercialize its technology. Langdao is also developing the higher-power FlintMicro-LPP EUV source, which has completed proof-of-principle validation, but its output power, conversion efficiency and operating lifetime are undisclosed. A light source alone does not make an EUV scanner; a complete EUV lithography scanner would require further advances in collection/illumination optics, multilayer mirrors, wafer and reticle stages, and system integration.
Samsung will reportedly break ground on its second chip fab in Taylor, Texas, this November, with mass production targeted for 2030. DigiTimes, citing South Korea's The Guru, reports that Taylor Fab 2 will span roughly 2.7 million square feet. Samsung also appears to have confirmed the timing at an October 15 event near the site, where Jonathan Taylor of Samsung Austin Semiconductor said construction should start early next month and that Fab 2 will be one and a half times bigger than Fab One. The process for Fab 2 has not been disclosed yet. As background, the first Taylor fab has slipped well past its original 2024 target and seems to be on track this time, with installed tools starting to run processes during staged qualification; Fab 1 uses EUV lithography for Samsung's 2 nm process, with operations planned by the end of 2026 and volume production in 2027. Its best-known customer is Tesla, which signed a $16.5 billion deal running through 2033 covering the AI6 chip, and Samsung is also set to build Tesla's AI5 on 2 nm in Texas. How orders will be split between the two fabs is unknown. Samsung plans to invest over $37 billion across Central Texas, backed by up to $4.745 billion in CHIPS Act funding. Given how long Fab 1 took, the source notes it is reasonable to expect the 2030 target will depend heavily on demand.
On the recent investor call, TSMC Chairman and CEO Dr. C.C. Wei said assessed demand exceeds available supply, and the company is responding with new factories, equipment conversions, productivity improvements and flexible manufacturing across technology generations. Third-quarter revenue reached $46.7 billion, and TSMC forecasts approximately 44% revenue growth for 2026 in U.S. dollar terms (a forecast, not an achieved result). Wei described nearly 20 fabrication facilities under development worldwide, including leading-edge manufacturing and advanced packaging projects, and the company expects annual capacity for its N2 technology family to more than double in 2027 (an expectation). Wei said TSMC is expanding 3-nanometer production despite its historical practice of avoiding further expansion once a technology generation reaches its targeted scale. TSMC outlined manufacturing plans in Taiwan, Arizona and Japan, alongside preliminary evaluations in Texas; Wei linked U.S. expansion to customer requests and said manufacturing location can affect pricing. He also acknowledged some shortage in backend packaging capacity, mentioned cooperation with GlobalFoundries, and noted that company teams are examining U.S. data-center construction and electricity availability, since chip deployment depends on functioning infrastructure. Wei also warned that rising component prices and economic uncertainty are challenging consumers and price-sensitive markets.
Terafab’s project has secured $16.8 billion for phase‑one funding (up to $119 billion total across four phases); its research fab in Austin is iterating on process recipes, transistor designs and packaging variants at a few thousand wafers per month, while the volume fab under construction in Grimes County is targeting 100,000 wafer starts per month with first silicon expected in 2029, using Intel’s 14A process as named by Elon Musk. The site and phase‑one funding are approved and the research fab is under construction, but no first‑wafer date or ownership terms have been made public and neither Tesla nor Intel is contractually bound. The article argues that advanced packaging, not lithography, will determine whether the single‑roof concept pays off.
onsemi and Sungrow announced the integration of onsemi's EliteSiC hybrid power module technology into Sungrow's PowerTitan 3.0 energy storage platform, targeting high-power DC-AC conversion in grid-scale storage installations. According to onsemi, the new architecture improves inverter-level efficiency by 0.4 percentage points compared with the previous-generation platform, supports power conversion units rated up to 450 kW, and achieves peak efficiency exceeding 99.3%. onsemi's analysis indicates that a 0.4% efficiency improvement could save more than 475 MWh annually in a 100 MW battery energy storage installation compared with the previous-generation module. The SiC hybrid technology combines silicon carbide and silicon power devices in a three-level inverter architecture, providing increased power density and improved thermal performance. The companies collaborated on platform development, system optimization, engineering validation, and qualification, and the adoption follows an established strategic relationship between onsemi and Sungrow.
EliteSiC hybrid power modulehigh-density power integrated modules (PIMs)onsemi, SungrowPower Electronics NewsPartnership/M&A
Foxconn has reached a final agreement to acquire a 50% stake in Mitsubishi Electric Mobility for JPY 115 billion (EUR 646.3 million), valuing the unit at an enterprise value of JPY 320 billion and equity value of JPY 230 billion. The purchase price corresponds to 50% of the equity value. The transaction still requires regulatory approvals, including competition clearance, and is expected to close on 1 October 2027. Upon completion, the two companies will jointly run the automotive equipment business, combining Mitsubishi Electric’s capabilities in electric powertrains, software and vehicle control with Foxconn’s speed, scale and strength in market deployment, with plans to offer EV platforms initially focused on Japan and later globally.
MetaOptics, a Singapore-based semiconductor optics company, has announced the incorporation of its wholly-owned Malaysian subsidiary, MetaOptics Technologies Sdn. Bhd., with the aim of advancing next-generation optical technologies and strengthening cross-border collaborations with Malaysian supply chain partners in semiconductor manufacturing, integrated photonics and nanophotonics. According to a media release, it also boosts the company's global strategy to deliver metalens solutions to customers worldwide. In the new facility, mass production and fabrication, volume assembly and testing will sit in proximity, enabling shorter development cycles, improved production yields and a faster path from prototyping to commercial-scale mass production. Executive Chairman Thng Chong Kim said Malaysia provides an established semiconductor base, a deep process-engineering pool and proximity to customers and suppliers, and that the incorporation will enable the company to establish fabrication, assembly and testing capabilities in Malaysia to serve the growing metalens industry in the region. The source does not state a timeline for establishing these capabilities.
UK distributor Anglia Components has announced a strategy to supply the entire signal chain, in response to customer frustration around the supply of some analogue components. CEO Steve Rawlins described the market as shaped by "the apparent duopoly which has dominated the market" of ADI and TI. Anglia is grouping some of its existing analogue franchisees and adding four others; initially 10 franchisees were announced, offering ADCs, DACs, amplifiers, timing and interface ICs, analogue switches, references and power management ICs. Three (Nanopower, Novosense and 3Peak) are existing suppliers, three (BeRex, Linear Systems and Silanna) were signed this summer, and Cimo Microelectronics, Zynalog, Raystar Microelectronics and Quest Semiconductors are new signings. The suppliers have been sourced, vetted and approved by the distributor to offer pin-for-pin compatible parts with established brands' comparable capabilities. The initiative responds to customers looking for greater resilience in the supply chain; Rawlins also noted that quarterly price increases are driving designers to seek compatible alternatives, alongside a need for design support and availability. Anglia expects to appoint four FAEs in the UK and Nordics dedicated to the analogue supply chain, and more lines are expected to be added to build the alternative portfolio.
ADCDACsamplifiersAnglia Components, Nanopower and 11 totalElectronics WeeklyPartnership/M&A
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Anglia Components, Nanopower, Novosense, 3Peak, BeRex, Linear Systems, Silanna, Cimo Microelectronics, Zynalog, Raystar Microelectronics, Quest Semiconductors
Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion. This is a plan; construction has not yet started. Its first facility in Taylor is preparing to begin operations by the end of the year. The source does not state the cause.
Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems. Samsung is exploring a design that stacks high-bandwidth memory (HBM) directly above graphics processors (zHBM), while SK Hynix is advancing high-bandwidth flash (HBF) to expand memory capacity for AI inference. Both remain at the development/exploration stage; the source does not state timelines or production plans.
high-bandwidth memory (HBM)high-bandwidth flash (HBF)Samsung Electronics, SK HynixDigiTimes Asia
Gaonchips announced on October 15 that it had joined Arm Total Design for Physical AI, becoming the first South Korean design solution provider to participate in the initiative, and as a technology partner will support the implementation of Arm-based semiconductors for physical AI applications through silicon-to-system collaboration, providing support from chip design to system implementation. The source does not state the cause.
According to Chinese market research firm Sigmaintell on Oct. 15, Samsung Display supplies more than 70% of the OLED panels used by major laptop brands. As OLED adoption increases, supply has become increasingly concentrated: Lenovo relies primarily on Samsung Display while sourcing some panels from BOE and EverDisplay (EDO); HP also depends heavily on Samsung Display and uses EDO panels in certain models; Asus sources from Samsung Display, BOE and EDO; Acer obtains approximately 75% of its OLED panels from Samsung Display; and Dell sources panels for its XPS lineup from LG Display but relies mainly on Samsung Display for its other products. Laptop OLED panel shipments more than doubled from 2.1 million units in the first quarter of last year to 4.3 million units in the second quarter of this year, and are expected to reach 4.9 million units in the third quarter; OLED's share of the overall laptop panel market is projected to exceed 10% in the second half of this year; and Lenovo, HP and Asus are each expected to equip more than 10% of their laptops with OLED panels this year. Sigmaintell said that greater dependence on a single supplier weakens negotiating position on prices and increases coordination requirements, so major laptop brands are shifting procurement strategies toward securing multiple suppliers. In the entry-level segment, TCL CSOT is preparing to supply inkjet-printed (IJP) OLED panels: it began shipping monitor panels in the third quarter and plans to start mass production of laptop panels in the fourth quarter. In the midrange and high-end segments, BOE and Visionox are expanding supplies of flexible OLED panels, with BOE having begun mass production at its B16 line in the second quarter of this year and Visionox having started producing flexible OLED panels for laptops in the third quarter. Sigmaintell forecasts that amorphous silicon (a-Si) LCDs will account for approximately 48% of laptop panels in 2030, down from about 79% in 2024, while OLED's share is expected to rise to around 20% and oxide LCDs are projected to reach approximately 29%.