TDK introduces the Micronas HAR 3025 dual-die stray-field robust motor position sensor with redundant design, ASIL D ready (SEooC) per ISO 26262:2018 and stray-field compensation per ISO 11452-8:2015; samples are available now and start of production is planned for the first half of 2027. The source does not state the cause.
Vishay has introduced four new automotive-grade optical sensors targeting battery management, energy storage, and industrial automation systems: VCND2040X02, VCND2040SLX02, VCND2045X02, and VCND2045SLX02. The devices combine an infrared (IR) emitter and PIN photodiode in 4.4 mm x 2.25 mm x 1.9 mm surface-mount packages, feature two independent lenses and an integrated crosstalk barrier between emitter and detector, and support free-to-air optical communication over short ranges that can be extended to several meters via optical fiber. They are AEC-Q102 qualified, enable data transmission up to 6 Mbit/s between system nodes, use a wettable flank lead frame allowing side-view or top-view mounting, and have MSL 3 with RoHS compliance, halogen-free construction. The VCND2040 series has typical radiant intensity of 35 mWsr, radiant power of 8 mW, rise/fall time of 18 ns, and forward voltage of 1.5 V (@ IF=24 mA); the VCND2045 series has typical radiant intensity of 65 mWsr, radiant power of 12 mW, rise/fall time of 9 ns, and forward voltage of 2.5 V (@ IF=24 mA). The source does not state pricing, capacity, or availability timing.
Antaira Technologies announced that its LMX-1204G-SFP-T-BABA Managed Gigabit Ethernet Switch is fully compliant with Phase 2 of the Build America, Buy America (BABA) Act, which took effect October 1, 2026; the switch is manufactured in the USA and available now. Under Federal Highway Administration (FHWA) requirements, the domestic share of component costs for manufactured products rose to 55% on October 1, 2026, and at least 55% of the switch's component costs are mined, produced, or manufactured in the United States, allowing system integrators, contractors, and agencies to deploy it on federally funded infrastructure projects without domestic content risk. Antaira also announced its next BABA-compliant platform, the LMP-1204G-SFP-bt-24-T-BABA, which adds up to 100W per port of IEEE 802.3bt PoE++ power to the series and is scheduled for production in Q1 2027; the upcoming model features four IEEE 802.3bt PoE++ ports delivering up to 100W per port, four IEEE 802.3at PoE+ ports delivering up to 30W per port, and four Gigabit SFP slots, with wide 12–55VDC power input. The company's BABA initiative launched in 2025, when it introduced the LMX-1204G-SFP-T-BABA and expanded its manufacturing into the United States.
IN2FAB offers a Migration Feasibility Study for analog and mixed-signal IP, applying migration technology to a representative portion of IP to turn assumptions into engineering evaluations, helping companies decide between full migration or redesign by assessing reuse, showing which devices map, where parameter or device-size limits arise, which layout structures can be preserved, where engineering intervention may be needed, identifying where automation can make the greatest contribution, assisting in estimating effort, assigning resources, developing schedules, defining verification requirements, guiding delivery approach (internal use, engaging IN2FAB for engineering services, or combining both), and following the process: start with design, test migration, measure effort, then decide how to proceed. The source does not state the cause.
Tower and Semtech have agreed to expand their 20-year partnership, with Semtech investing in securing dedicated silicon germanium (SiGe) capacity at Tower to support its strong design wins and demand for AI data-center optical interconnect components.
Qualcomm said it is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC Center, the company said its memory-and-logic stacking work could sharply reduce energy use, although thermal, materials, and manufacturing challenges remain globally. The source does not state a timeline for commercialization of this technology.
In an SK hynix Newsroom article series [Inside the Research] Part 2 dated October 14, 2026, the company detailed its research paper "Co-Optimizing Cell, Non-Cell, and Page Schemes for Energy Efficient Analog Computing in 3D FeNAND," published in the 2025 IEEE International Electron Devices Meeting (IEDM), authored by Won-Tae Koo and Jihun Kim of SK hynix's Global RTC. The research proposes a 3D FeNAND-based analog compute-in-memory (A-CiM) architecture that merges storage and computation, and by co-optimizing cell, non-cell (interconnect/word line), and page schemes, achieves approximately 10 to 20 times higher throughput and around 4,000 to 5,000 times greater energy efficiency than conventional 3D arrays under the same chip-area constraints; the article notes these figures reflect 3D FeNAND's high-density advantage over conventional 2D nonvolatile memory arrays widely studied as A-CiM candidates. Reported optimization results include: using a low-resistance word line metal improved throughput by up to 16% and energy efficiency by up to 3%; air gaps reduced word-line parasitic capacitance by approximately 60%, improving throughput by 1.2 times and energy efficiency by two times; jointly optimizing word line resistance and capacitance improved throughput by up to 1.4 times and energy efficiency by up to 2.2 times; in-page pipelining (IPP) doubled energy efficiency and improved throughput by nine times versus the baseline; and splitting a conventional 16KB page into four 4KB subpages improved energy efficiency by 1.2 times and throughput by 1.7 times. The team also demonstrated four-level-per-cell operation in the low-current region with stable data retention at the 300mm wafer scale. The article states the research shows NAND's potential to expand beyond a storage medium into a computing medium; the source contains no price, shipment, capacity, or market-condition information.
SEMI expects Americas 300mm fab equipment spending to more than double from US$18.1 billion in 2026 to US$40.6 billion in 2029, driven by U.S. investment and expansions by TSMC, Intel, Micron, and Samsung.
Eric Hong joins Mixel as VP of Engineering, bringing 30 years of experience to lead analog and mixed-signal IP development. He highlights the challenges customers face in delivering complex SoCs and emphasizes Mixel's end-to-end support approach to reduce integration risk and accelerate time-to-market.
The second-generation Lenovo Legion Go handheld devices have already received a substantial price increase after their initial launch. The AMD Ryzen Z2 Extreme-powered Legion Go 2 was previously increased from $1,349.99 to $1,999.99; now the same Legion Go 2 with 32 GB of RAM and 2 TB of storage, which had previously jumped to $2,849, rose by another $233 (around 8% of the previous price) and is listed at $3,081.99 on the Lenovo US online store, while the 1 TB version can still be found at Best Buy for $1,999.99. The entry-level Legion Go S jumped from $899.99 and $649.99 to $1,579.99 and $989.99 for the Z1 Extreme and Z2 Go models, respectively. The latest price increase comes as the gaming handheld continues to be out of stock at Lenovo, although partner stores like Best Buy still have stock. Lenovo has not yet announced the price hike for the Legion Go; the source does not state the cause (the article's suggestion of a link to the 'RAMpocalypse' affecting RAM and DRAM pricing across PC hardware segments is presented as an assumption, not a confirmed cause).
CanSemi debuted on the ChiNext board on October 13 with an IPO price of CNY 12.01 per share; shares opened at CNY 45, up 274.69%, raising approximately CNY 7.5 billion.
Marvell launched the second-generation Structera X 3406/3506 controllers supporting CXL 3.2 and PCIe Gen6, offering up to 9TB DDR4 or 6TB DDR5 per unit. Designed to address AI KV caching and large language model inference bottlenecks, the new chips provide 5x LZ4 compression throughput. Bullish for CXL controller and AI server memory expansion markets.
Polar Semiconductor and imec's IC-Link are collaborating to provide 8-inch manufacturing for e-mode GaN devices. This partnership targets high-growth sectors like AI data centers and automotive. Bearish: Capacity expansion signals potential supply increase, pressuring spot prices.
pSemi, a Murata company, has introduced two fully integrated 2.4 GHz front-end modules, PE566212 and PE566213, which combine a power amplifier, low-noise amplifier, and RF switch in a silicon-on-insulator (SOI) design to improve wireless connectivity in IoT devices.
MangoBoost launched its AI inference platform Mango Inference on Oct. 12, after first unveiling it in July. The company said its pricing is more than 20% lower than competitors, and it plans to build a 1‑megawatt AI data center in Gangnam, Seoul by Q1 next year, expandable to 5MW, with GPUs from AMD and memory from Samsung Electronics and SK hynix. MangoBoost targets over 100 billion won in revenue next year, expecting around 10 billion won this year, and was founded in 2022.
Infineon has introduced the XDP8HD40S-1 high-voltage hot-swap controller designed for digital power-path protection and monitoring in next-generation AI server power architectures operating at ±400 V and 800 VDC, with samples targeted for availability in the second quarter of 2027.
U-Best Innovative reported record revenue driven by strong footwear material demand and expansion into emerging display applications. This shift indicates growing opportunities for materials suppliers in the foldable device market.
Texas Instruments has introduced the ADC34DSO75, a 3-gigasamples-per-second (GSPS) analog-to-digital converter (ADC) designed to detect transient power events in AI data centers, enabling continuous, low-power, event-based remote monitoring at nanosecond resolution, and presented it alongside new high-voltage power management and clocking solutions at the 2026 Open Compute Project (OCP) Global Summit. TI also introduced the LMI800PS, an 800V isolated hot-swap controller that integrates functions previously implemented using five separate integrated circuits, combining an isolated bias supply and PMBus telemetry in a single package to reduce board area by more than 60%; it supports both ±400V and 800V distribution architectures with 5kVrms reinforced isolation and more than 8mm of creepage distance. TI also highlighted the LMK6B bulk acoustic wave (BAW)-based oscillator, which delivers 9.6fs jitter at 625MHz, supporting timing accuracy and signal integrity in high-speed networking systems as data transmission rates increase toward 3.2Tbps. In addition, TI will demonstrate 800V DC power solutions for NVIDIA's MGX AI Factory Ecosystem, including hot-swap protection and 800V-to-12V and 800V-to-6V DC/DC conversion, the latter incorporating gallium nitride (GaN) power stages, and has scheduled a technical presentation on 800V data center DC/DC design considerations, topology comparisons, and trade-offs for October 15, 2026, at the OCP Global Summit in San Jose, California.
On October 13, 2026, it was reported that Vital Technology Group’s subsidiary Vital Core Optoelectronic Technology (Wuhan) Co., Ltd. officially brought its wafer fabrication facility (fab) online in the Wuhan East Lake Free Trade Zone on September 28. The facility serves as the manufacturing core of the group’s CNY 12 billion high-end compound semiconductor material and chip industrialization base, featuring large-format optoelectronic chip platforms supporting 4/6-inch InP and 6/8-inch GaAs materials. Additionally, this month the group entered into a strategic cooperation agreement with Smarter Microelectronics and, together with its subsidiaries, secured joint pre‑research development orders from a leading overseas customer for next‑generation single‑lambda 400G optical interconnects.
GlobalFoundries launches 7nm-class FDX Fusion node with double density of 22FDX, targeting automotive and edge AI markets for 2028 production.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |