SICC reported revenue of CNY 1.559 billion for the first three quarters of 2026, up 40.22% year on year, and net profit attributable to shareholders of CNY 27.2162 million, up 2,330.24% year on year. Third-quarter revenue reached CNY 646 million, up 102.89% YoY, and net profit totaled CNY 85.8329 million. 8-inch silicon carbide (SiC) substrates accounted for more than 50% of revenue in the third quarter. The growth is attributed to structural shifts in downstream demand, including rising adoption of 800V high-voltage platforms in new energy vehicles and AI server power supplies.
Chi Yi Hsin Technology's order backlog reached NT$4.476 billion (US$137.5 million) as of the end of September 2026, driven by Arizona fab projects, with execution scheduled through around 2028 and overall order visibility extending to 2030.
order backlogChi Yi Hsin TechnologyDigiTimes AsiaInventory Shift
Citing Unimicron Chairman S.C. Chien at the TPCA Show on October 20, Wealth Magazine and Economic Daily News report that AI accelerator demand driving advanced packaging such as CoWoS and EMIB is spreading supply bottlenecks to critical materials and equipment: lead times for some key equipment have stretched to 30 months, and critical materials could face a 20% supply shortfall in 2027. On the materials side, low-CTE glass fiber cloth, copper-clad laminates (CCL) and ABF are particularly tight; lead times have lengthened for more than 80% of equipment, with over 20% seeing delays of more than double their original lead times. Chien projected CoWoS capacity to grow 6.8-fold by 2028 from 2024 levels, alongside a 6.3-fold increase in hyperscaler capex, while IC substrate capacity is expected to merely double and DRAM capacity to expand 1.8-fold; he cautioned these multiples do not necessarily signal shortages given different capacity bases. Wealth Magazine notes DRAM and substrate shortages are already emerging in 2025 and 2026, and prolonged equipment lead times and tight material supply could make it harder to synchronize capacity expansion. Per MoneyDJ, substrate sizes have grown from roughly 1x reticle size in early designs to 3x in 2025, with 5x targeted for 2026 and 5–9x by 2027–2028, potentially reaching 12–14x; per Central News Agency, AI chips can draw currents exceeding 1,000 amperes, raising demands on power integrity, high-speed signal transmission, thermal management and thermomechanical reliability, and fine-line requirements approaching 12–14x reticle size could exceed individual substrate makers' capabilities, complicating yield improvement. In Intel's EMIB supply chain, substrate yields have recently improved to around 45%, with suppliers reportedly targeting 50% by 4Q26 and 60% by 1Q27.
IC substrateCoWoSEMIBUnimicron, IntelTrendForceInventory Shift
On October 7, 2026, the Global Electronics Association announced the August 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program: the 3-month book-to-bill ratio stands at 1.39 and the 1-month book-to-bill at 1.33. Total North American EMS shipments in August 2026 were up 1.0% year-over-year, up 5.5% from the preceding month, and August's year-to-date shipments increased by 1.0% YoY. EMS bookings in August increased 53.5% year-over-year and were down 29.2% from the previous month, with August's YTD bookings up 15.5% versus the same period last year. The Association's chief economist, Dr. Shawn DuBravac, said EMS manufacturers are working to fulfill strong order flow that continues to outpace shipments and build a pipeline of future production, but tight availability of certain components and extended supplier lead times may be limiting how quickly some manufacturers can convert orders into deliveries, and securing the materials needed to fulfill those orders remains a challenge. The statistics are based on a representative sample of companies selling in the USA and Canada.
Canon plans to remanufacture multifunction devices at its Virginia plant starting April 2026, utilizing standardized processes and a >90% parts reuse rate. This expansion aims to offer competitively priced refurbished devices while supporting environmental goals. The event is neutral for semiconductor supply chains as it focuses on refurbishment rather than new production.
Multifunction Device ControllersPrint Head ChipsImage SensorsCanon Inc., Canon U.S.A., Inc. and 3 totalGlobeNewswire SemiconductorsInventory Shift
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Canon Inc., Canon U.S.A., Inc., Canon Virginia Inc.
Epiwafer and substrate supplier IQE plc expects first-half 2023 revenue to decline by approximately £30 million year-on-year due to weaker demand and inventory build-up throughout the semiconductor supply chain. The company cites an acceleration of these negative trends, leading to reduced customer orders and forecasts. This signals a bearish outlook for upstream materials as supply chain destocking pressures pricing and volumes.